Faculty Profiles - ZHANG Rong | The Hong Kong University of Science and Technology

Rong ZHANG
張榮

PhD in Mechanical Engineering
The Hong Kong University of Science and Technology, 2017

Senior Lecturer
Division of Emerging Interdisciplinary Areas

(852) 3469 2949
rongz@ust.hk
Room 4374

ORCID

0000-0002-4669-4816

ResearcherID

FZM-2102-2022

Scopus ID

57202881100

Publications Projects Teaching Assignment

Publications

All Years 22 2024 0 2023 2 2022 0 2021 1 2020 1 2019 1 2018 17

2023 2

iFUNDit: Visual Profiling of Fund Investment Styles

Computer Graphics Forum, 2023, p. 1-13
Zhang, Rong; Ku, B.K.; Wang, Y.; Yue, X.; Liu, S.; Li, K.; Qu, Huamin
Article

Tax-Scheduler: An interactive visualization system for staff shifting and scheduling at tax authorities

Visual Informatics, v. 7, (2), June 2023, p. 30-40
Yuan, Linping; Li, Boyu; Li, Siqi; Wong, Kam Kwai; Zhang, Rong; Qu, Huamin
Article

2021 1

TaxThemis: Interactive Mining and Exploration of Suspicious Tax Evasion Groups

IEEE Transactions on Visualization and Computer Graphics, v. 27, (2), February 2021, article number 9222068, p. 849-859
Lin, Yating; Wong, Kam Kwai; Wang, Yong; Zhang, Rong; Dong, Bo; Qu, Huamin; Zheng, Qinghua
Article

2020 1

A spiral-based inspection path generation algorithm for efficient five-axis sweep scanning of freeform surfaces

Computer-Aided Design, v. 124, July 2020, article number 102838
Chen, Lufeng; Zhang, Rong; Tang, Kai; Hu, Pengcheng; Zhao, Pengyu; Li, Zhaoyu; Han, Zhenwei
Article

2019 1

Visual Analytics of Student Learning Behaviors on K-12 Mathematics E-learning Platforms

Xia, Meng; Wei, Huan; Xu, Min; Lo, Yu Ho; Wang, Yong; Zhang, Rong; Qu, Huamin
Conference paper

2017 1

Automatic Generation of Five-Axis Continuous Inspection Paths for Free-Form Surfaces

IEEE Transactions on Automation Science and Engineering, v. 14, (1), January 2017, article number 7731218, p. 83-97
Hu, Pengcheng; Zhang, Rong; Tang, Kai
Article

2015 2

Five-axis finishing tool path generation for a mesh blade based on linear morphing cone

Journal of Computational Design and Engineering, v. 2, (4), October 2015, p. 268-275
Zhang, Rong; Hu, Pengcheng; Tang, Kai
Article

Lens Forming by Stack Dispensing for LED Wafer Level Packaging

IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 5, (1), January 2015, article number 6965571, p. 15-20
Zhang, Rong; Lee, Shi-wei; Lo, Chi Chuen
Article

2014 1

Lens forming by stack dispensing for LED wafer level packaging

2014 International Conference on Electronics Packaging, ICEP 2014 / IEEE. Piscataway, NJ : IEEE, 2014, p. 670-675, Article number 6826763
Zhang, Rong; Lee, Ricky Shi Wei; Lo, Chi Chuen
Conference paper

2012 3

Design and Fabrication of a Silicon Interposer With TSVs in Cavities for Three-Dimensional IC Packaging

IEEE Transactions on Device and Materials Reliability, v. 12, (2), June 2012, article number 6168823, p. 189-193
Zhang, Rong; Lo, Chi Chuen; Lee, Shi-wei
Article

Emerging trend for LED wafer level packaging

Frontiers of Optoelectronics, v. 5, (2), June 2012, p. 119-126
Lee, Shi-wei; Zhang, Rong; Chen, Kewei; Lo, Chi Chuen
Article

Moldless encapsulation for LED wafer level packaging using integrated DRIE trenches

Microelectronics Reliability, v. 52, (5), May 2012, p. 922-932
Zhang, Rong; Lee, Shi-wei
Article

2011 2

LED packaging using silicon substrate with cavities for phosphor printing and copper-filled TSVs for 3D interconnection

Proceedings - 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), June 2011, article number 5898727, p. 1616-1621
Zhang, Rong; Lee, Shi-wei; Xiao, David Guowei; Chen, Haiying
Conference paper

Nondestructive inspection of through silicon via depth using scanning acoustic microscopy

International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings, January 2011, article number 5699482
Zhang, Minshu; Lee, Shi-wei; Wu, Hailong; Zhang, Rong
Conference paper

2010 4

Integration of phosphor printing and encapsulant dispensing processes for wafer level LED array packaging

Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010 / IEEE. Piscataway, NJ : IEEE, 2010, p. 1386-1392, Article number 5582822
Chen, Kewei; Zhang, Rong; Lee, Ricky Shi-wei
Conference paper

Silicon Interposer with Cavities and Copper-filled TSVs for 3D Packaging

Zhang, Rong; Lee, Ricky Shi-wei
Conference paper

Solid State Backlight Unit with Lateral-Emitting LEDs and a Light Distributing Plate

Lee, Ricky Shi-wei; Lo, Chi Chuen; Zhang, Rong
Conference paper

Solid state light tube with periodic units of lateral-emitting LEDs

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), June 2010, article number 5490788, p. 673-678
Lee, Ricky Shi-wei; Zhang, Rong; Leung, Wai Lok Wesley
Conference paper

2009 2

Development of surface mount compatible reel-to-reel assembly process of LED arrays for wide area general lighting

2008 International Conference on Electronic Materials and Packaging (EMAP 2008) / IEEE. Piscataway, NJ : IEEE, 2009, p. 255-258, Article number 4784277
Lee, Ricky Shi-wei; Tong, Yiu Wai; Chan, Yuen Sing; Lo, Chi Chuen; Zhang, Rong
Conference paper

Process development and prototyping for the assembly of LED arrays on flexible printed circuit tape for general solid state lighting

2009 Proceedings of 59th Electronic Components and Technology Conference, June 2009, article number 5074321, p. 2137-2142
Lee, Ricky Shi-wei; Tong, Yiu Wai; Chan, Yuen Sing; Lo, Chi Chuen; Zhang, Rong
Conference paper

2008 2

Wafer level encapsulation process for LED array packaging

2007 International Conference on Electronic Materials and Packaging / IEEE. Piscataway, NJ : IEEE, 2008, Article number 4510307
Zhang, Rong; Lee, Ricky Shi-wei
Conference paper

Wafer Level LED Packaging with Integrated DRIE Trenches for Encapsulation

Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008 / IEEE. Piscataway, NJ : IEEE, 2008, Article number 4607038
Zhang, Rong; Lee, Ricky Shi-wei
Conference paper

Article 2

iFUNDit: Visual Profiling of Fund Investment Styles

Computer Graphics Forum, 2023, p. 1-13
Zhang, Rong; Ku, B.K.; Wang, Y.; Yue, X.; Liu, S.; Li, K.; Qu, Huamin

Tax-Scheduler: An interactive visualization system for staff shifting and scheduling at tax authorities

Visual Informatics, v. 7, (2), June 2023, p. 30-40
Yuan, Linping; Li, Boyu; Li, Siqi; Wong, Kam Kwai; Zhang, Rong; Qu, Huamin

Article 1

TaxThemis: Interactive Mining and Exploration of Suspicious Tax Evasion Groups

IEEE Transactions on Visualization and Computer Graphics, v. 27, (2), February 2021, article number 9222068, p. 849-859
Lin, Yating; Wong, Kam Kwai; Wang, Yong; Zhang, Rong; Dong, Bo; Qu, Huamin; Zheng, Qinghua

Article 1

A spiral-based inspection path generation algorithm for efficient five-axis sweep scanning of freeform surfaces

Computer-Aided Design, v. 124, July 2020, article number 102838
Chen, Lufeng; Zhang, Rong; Tang, Kai; Hu, Pengcheng; Zhao, Pengyu; Li, Zhaoyu; Han, Zhenwei

Conference paper 1

Visual Analytics of Student Learning Behaviors on K-12 Mathematics E-learning Platforms

Xia, Meng; Wei, Huan; Xu, Min; Lo, Yu Ho; Wang, Yong; Zhang, Rong; Qu, Huamin

Article 1

Automatic Generation of Five-Axis Continuous Inspection Paths for Free-Form Surfaces

IEEE Transactions on Automation Science and Engineering, v. 14, (1), January 2017, article number 7731218, p. 83-97
Hu, Pengcheng; Zhang, Rong; Tang, Kai

Article 2

Five-axis finishing tool path generation for a mesh blade based on linear morphing cone

Journal of Computational Design and Engineering, v. 2, (4), October 2015, p. 268-275
Zhang, Rong; Hu, Pengcheng; Tang, Kai

Lens Forming by Stack Dispensing for LED Wafer Level Packaging

IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 5, (1), January 2015, article number 6965571, p. 15-20
Zhang, Rong; Lee, Shi-wei; Lo, Chi Chuen

Conference paper 1

Lens forming by stack dispensing for LED wafer level packaging

2014 International Conference on Electronics Packaging, ICEP 2014 / IEEE. Piscataway, NJ : IEEE, 2014, p. 670-675, Article number 6826763
Zhang, Rong; Lee, Ricky Shi Wei; Lo, Chi Chuen

Article 3

Design and Fabrication of a Silicon Interposer With TSVs in Cavities for Three-Dimensional IC Packaging

IEEE Transactions on Device and Materials Reliability, v. 12, (2), June 2012, article number 6168823, p. 189-193
Zhang, Rong; Lo, Chi Chuen; Lee, Shi-wei

Emerging trend for LED wafer level packaging

Frontiers of Optoelectronics, v. 5, (2), June 2012, p. 119-126
Lee, Shi-wei; Zhang, Rong; Chen, Kewei; Lo, Chi Chuen

Moldless encapsulation for LED wafer level packaging using integrated DRIE trenches

Microelectronics Reliability, v. 52, (5), May 2012, p. 922-932
Zhang, Rong; Lee, Shi-wei

Conference paper 2

LED packaging using silicon substrate with cavities for phosphor printing and copper-filled TSVs for 3D interconnection

Proceedings - 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), June 2011, article number 5898727, p. 1616-1621
Zhang, Rong; Lee, Shi-wei; Xiao, David Guowei; Chen, Haiying

Nondestructive inspection of through silicon via depth using scanning acoustic microscopy

International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings, January 2011, article number 5699482
Zhang, Minshu; Lee, Shi-wei; Wu, Hailong; Zhang, Rong

Conference paper 4

Integration of phosphor printing and encapsulant dispensing processes for wafer level LED array packaging

Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010 / IEEE. Piscataway, NJ : IEEE, 2010, p. 1386-1392, Article number 5582822
Chen, Kewei; Zhang, Rong; Lee, Ricky Shi-wei

Silicon Interposer with Cavities and Copper-filled TSVs for 3D Packaging

Zhang, Rong; Lee, Ricky Shi-wei

Solid State Backlight Unit with Lateral-Emitting LEDs and a Light Distributing Plate

Lee, Ricky Shi-wei; Lo, Chi Chuen; Zhang, Rong

Solid state light tube with periodic units of lateral-emitting LEDs

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), June 2010, article number 5490788, p. 673-678
Lee, Ricky Shi-wei; Zhang, Rong; Leung, Wai Lok Wesley

Conference paper 2

Development of surface mount compatible reel-to-reel assembly process of LED arrays for wide area general lighting

2008 International Conference on Electronic Materials and Packaging (EMAP 2008) / IEEE. Piscataway, NJ : IEEE, 2009, p. 255-258, Article number 4784277
Lee, Ricky Shi-wei; Tong, Yiu Wai; Chan, Yuen Sing; Lo, Chi Chuen; Zhang, Rong

Process development and prototyping for the assembly of LED arrays on flexible printed circuit tape for general solid state lighting

2009 Proceedings of 59th Electronic Components and Technology Conference, June 2009, article number 5074321, p. 2137-2142
Lee, Ricky Shi-wei; Tong, Yiu Wai; Chan, Yuen Sing; Lo, Chi Chuen; Zhang, Rong

Conference paper 2

Wafer level encapsulation process for LED array packaging

2007 International Conference on Electronic Materials and Packaging / IEEE. Piscataway, NJ : IEEE, 2008, Article number 4510307
Zhang, Rong; Lee, Ricky Shi-wei

Wafer Level LED Packaging with Integrated DRIE Trenches for Encapsulation

Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008 / IEEE. Piscataway, NJ : IEEE, 2008, Article number 4607038
Zhang, Rong; Lee, Ricky Shi-wei

2017 1

Automatic Generation of Five-Axis Continuous Inspection Paths for Free-Form Surfaces

IEEE Transactions on Automation Science and Engineering, v. 14, (1), January 2017, article number 7731218, p. 83-97
Hu, Pengcheng; Zhang, Rong; Tang, Kai
Article

2015 2

Five-axis finishing tool path generation for a mesh blade based on linear morphing cone

Journal of Computational Design and Engineering, v. 2, (4), October 2015, p. 268-275
Zhang, Rong; Hu, Pengcheng; Tang, Kai
Article

Lens Forming by Stack Dispensing for LED Wafer Level Packaging

IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 5, (1), January 2015, article number 6965571, p. 15-20
Zhang, Rong; Lee, Shi-wei; Lo, Chi Chuen
Article

2014 1

Lens forming by stack dispensing for LED wafer level packaging

2014 International Conference on Electronics Packaging, ICEP 2014 / IEEE. Piscataway, NJ : IEEE, 2014, p. 670-675, Article number 6826763
Zhang, Rong; Lee, Ricky Shi Wei; Lo, Chi Chuen
Conference paper

2012 3

Design and Fabrication of a Silicon Interposer With TSVs in Cavities for Three-Dimensional IC Packaging

IEEE Transactions on Device and Materials Reliability, v. 12, (2), June 2012, article number 6168823, p. 189-193
Zhang, Rong; Lo, Chi Chuen; Lee, Shi-wei
Article

Emerging trend for LED wafer level packaging

Frontiers of Optoelectronics, v. 5, (2), June 2012, p. 119-126
Lee, Shi-wei; Zhang, Rong; Chen, Kewei; Lo, Chi Chuen
Article

Moldless encapsulation for LED wafer level packaging using integrated DRIE trenches

Microelectronics Reliability, v. 52, (5), May 2012, p. 922-932
Zhang, Rong; Lee, Shi-wei
Article

2011 2

LED packaging using silicon substrate with cavities for phosphor printing and copper-filled TSVs for 3D interconnection

Proceedings - 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), June 2011, article number 5898727, p. 1616-1621
Zhang, Rong; Lee, Shi-wei; Xiao, David Guowei; Chen, Haiying
Conference paper

Nondestructive inspection of through silicon via depth using scanning acoustic microscopy

International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings, January 2011, article number 5699482
Zhang, Minshu; Lee, Shi-wei; Wu, Hailong; Zhang, Rong
Conference paper

2010 4

Integration of phosphor printing and encapsulant dispensing processes for wafer level LED array packaging

Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010 / IEEE. Piscataway, NJ : IEEE, 2010, p. 1386-1392, Article number 5582822
Chen, Kewei; Zhang, Rong; Lee, Ricky Shi-wei
Conference paper

Silicon Interposer with Cavities and Copper-filled TSVs for 3D Packaging

Zhang, Rong; Lee, Ricky Shi-wei
Conference paper

Solid State Backlight Unit with Lateral-Emitting LEDs and a Light Distributing Plate

Lee, Ricky Shi-wei; Lo, Chi Chuen; Zhang, Rong
Conference paper

Solid state light tube with periodic units of lateral-emitting LEDs

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), June 2010, article number 5490788, p. 673-678
Lee, Ricky Shi-wei; Zhang, Rong; Leung, Wai Lok Wesley
Conference paper

2009 2

Development of surface mount compatible reel-to-reel assembly process of LED arrays for wide area general lighting

2008 International Conference on Electronic Materials and Packaging (EMAP 2008) / IEEE. Piscataway, NJ : IEEE, 2009, p. 255-258, Article number 4784277
Lee, Ricky Shi-wei; Tong, Yiu Wai; Chan, Yuen Sing; Lo, Chi Chuen; Zhang, Rong
Conference paper

Process development and prototyping for the assembly of LED arrays on flexible printed circuit tape for general solid state lighting

2009 Proceedings of 59th Electronic Components and Technology Conference, June 2009, article number 5074321, p. 2137-2142
Lee, Ricky Shi-wei; Tong, Yiu Wai; Chan, Yuen Sing; Lo, Chi Chuen; Zhang, Rong
Conference paper

2008 2

Wafer level encapsulation process for LED array packaging

2007 International Conference on Electronic Materials and Packaging / IEEE. Piscataway, NJ : IEEE, 2008, Article number 4510307
Zhang, Rong; Lee, Ricky Shi-wei
Conference paper

Wafer Level LED Packaging with Integrated DRIE Trenches for Encapsulation

Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008 / IEEE. Piscataway, NJ : IEEE, 2008, Article number 4607038
Zhang, Rong; Lee, Ricky Shi-wei
Conference paper

No Publications

Teaching Assignment

2024-25 Fall 3 2023-24 Summer 0 2023-24 Spring 2 2023-24 Winter 0 2023-24 Fall 2 2022-23 Summer 0

EMIA2020	Cross-disciplinary Design Thinking
EMIA4900C	Independent Study
EMIA6500C	Metaverse Cross-disciplinary Design Thinking

EMIA2020	Cross-disciplinary Design Thinking
MSBD5005	Data Visualization

EMIA2020	Cross-disciplinary Design Thinking
EMIA6500C	Metaverse Cross-disciplinary Design Thinking

No Teaching Assignments

Projects

From January 2022 to December 2024

All Projects 2

No Projects.
AI-powered Audience Engagement Analysis for Virtual Communication

基於人工智能的虛擬溝通聽眾參與度分析 Participating

Innovation and Technology Fund
Project Team (HKUST)
QU Huamin (Lead)

CHENG Tim Kwang-Ting

ZHANG Rong
2021 - 2023
Key Technology Development of AI-powered Tax Service Platform and Its Commercialization

人工智能辦稅服務廳平臺系統關鍵技術研發與智能終端產業化 Participating

Nanhai People's Government of Foshan
Project Team (HKUST)
QU Huamin (Lead)

ZHANG Rong
2020 - 2023

Publications

2023 2

2021 1

2020 1

2019 1

2017 1

2015 2

2014 1

2012 3

2011 2

2010 4

2009 2

2008 2

Article 2

Article 1

Article 1

Conference paper 1

Article 1

Article 2

Conference paper 1

Article 3

Conference paper 2

Conference paper 4

Conference paper 2

Conference paper 2

2017 1

2015 2

2014 1

2012 3

2011 2

2010 4

2009 2

2008 2

Teaching Assignment

Projects

From January 2022 to December 2024

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