Association of hospital-treated infectious diseases and infection burden with cardiovascular diseases and life expectancy

3D Co-packaging of GaN/SiC Cascode Device for High-Frequency Power Switching Operation

Stability Study of Quantum Dot Color Converted Mini/Micro-LED Displays

A Flexible Thin-Film Inductor for High-Efficiency Wireless Power Transfer

Development of Uniform Polydimethylsiloxane Arrays through Inkjet Printing

Large-Emitting-Area Quantum Dot Light-Emitting Diodes Fabricated by an All-Solution Process

Assembly of Printed Interconnects for Immobilized Protein Microfluidic Assays

Assembly of Printed Interconnects for Immobilized Protein Microfluidic Assays

Effect of Sintering Conditions on Electrical Resistivity of Printed Silver Inks

Optimizing Train Car Passenger Loading via Platform Escalator Directions

Pillar-Cavity Copper-Copper Bonding for Face-to-Face Carbon Nanotube Synthesis

Quantum Dot Color Conversion Film with Enhanced Color Rendering Performance

Reliability and Lifetime of a Novel 222-nm KrCl Excilamp

Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing

From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, Applications

A UVC LED Disinfection Closet for Reuse of Protective Coats

Improved Inkjet Printing of Polydimethylsiloxane Droplets

Inkjet Printing High Resolution Polydimethylsiloxane Dots Array

Lifetime and Failure Analysis of LEDs Driven by the Constant-Amplitude Current with Pulse Width Modulation

Solderability Analysis of Inkjet-printed Silver Pads with SAC Solder Joints

Thermal-mechanical Reliability of Sintered Nano-Ag Bond Pads Printed by Aerosol Jet

Characterization And Evaluation Of 3D-printed Connectors For Microfluidics

Fabrication and Reliability Assessment of Cu Pillar Microbumps with Printed Polymer Cores

Implementation and characterisation of a sterilisation module consisting of novel 265 nm UVC LED packages

Mechanical System and Dynamic Control in Photolithography for Nanoscale Fabrication: A Critical Review

Phosphor-free microLEDs with ultrafast and broadband features for visible light communications

Evaluation and Reduction of Optical Crosstalk in Quantum Dot Color-Converted Mini/Micro-LED Displays

Life Projection of Far-UVC KrCl Excilamp with 222nm Peak Wavelength

Realizing Low Optical Crosstalk, Wide Color Gamut Mini-LED Displays via Laser-Patterned Quantum Dots Color Conversion Layer

Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer (RDL)

Synthesis of Face to Face Partially Fused Carbon Nanotubes for the Improvement of Thermal Management in 3D Die Stacking

The Study of Far-UVC 222-nm Excilamp and Germicidal-UVC 254-nm Low-pressure Hg Lamp: Optical Characteristics and Service Life

Assessment of Fatigue Induced Pad Cratering With a Universal Expression of Printed Circuit Board Fatigue Resistance

Directly Printed Hollow Connectors for Microfluidic Interconnection with UV-Assisted Coaxial 3D Printing

UV LED Assisted Printing Platform for Fabrication of Micro-Scale Polymer Pillars

Cross-sectioning Technique for Bonded Silicon Substrates with Face-to-Face Interlaced Carbon Nanotubes in Microchannels

Dimensionless Correlation between Empirical Modeling and T3ster Measurements for the Dynamic Thermal Characterization of the PWM-mode Current Driving UVLED

Printing Unifrom QDs Polymer Thin Film for QLED Applications

Quantum Dot Film Patterning on a Trenched Glass Substrate for Defining Pixel Arrays of a Full-color Mini/Micro-LED Display

Filler Particle-Induced Light Absorption in Underfill-Encapsulated Flip-Chip Light-Emitting Diodes

The Effect of Metallic Interconnect Spacing on the Thermal Resistance of Flip-Chip Light-Emitting Diodes With Underfill Encapsulation

Coaxial Nozzle-assisted 3D Printing with in-situ UV LED Curing for Microfluidic Connectors

Empirical Modeling and measurement of the Pulsed Junction Temperature of VCSEL

Evaluation and Benchmarking of Cu Pillar Micro-bumps with Printed Polymer Core

Feasibility study of fan-out panel-level packaging for heterogeneous integrations

Feasibility study of fan-out wafer-level packaging for heterogeneous integrations

Inkjet Printing PEDOT:PSS without Coffee Ring Effect for QLED Applicaitons

Investigation of Processing Parameters for the Fabrication of Microfluidic Connectors Using a UV-assisted Coaxial 3D Printing System

Junction Temperature Prediction of the Multi-LED Module with the Modified Thermal Resistance Matrix

Long-term Stability Evaluation of Thermal Interface Materials (TIMs)

A Novel Approach to Characterize Phosphor Particles for the Color Tuning of WLEDs

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration

Correlation of warpage distribution with the material property scattering for warpage range prediction of PBGA components

Design, materials, process, and fabrication of fan-out panel-level heterogeneous integration

Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging

Fan-Out Wafer-Level Packaging for Heterogeneous Integration

Reliability of Fan-Out Wafer-Level Heterogeneous Integration

Super flexible GaN light emitting diodes using microscale pyramid arrays through laser lift-off and dual transfer

A Power Inductor Integration Technology Using a Silicon Interposer for DC-DC Converter Applications

Additive Manufacturing of Micro-channels on a Silicon Substrate based on Coaxial Printing Dispenser with in-situ UV LED Curing

Additive Manufacturing of Micro-scale Tunnels on a Silicon Substrate with in-situ UV LED Curing for MEMS Applications

Analysis of pulse-driven LED junction temperature and its reliability

Broadband Emission of Asymmetric Pyramids obtained by Laser Drilling and SAG for Application of Phosphor Free White LEDs

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration

Determination of a Meaningful Warpage Acceptance Criterion for Large PBGA Components Through the Correlation with Scattering in Material Properties

Effect of Material Properties and Bump Parameters on Capillary Filling in Through-Silicon-Via Underfill Dispensing

Fan-out wafer-level packaging for heterogeneous integration

Investigation of Light Scattering Effect Impact on Optical Performance of Phosphor Converted White Light Emitting Diodes

Investigation of the Influence of Packaging Material Degradation on the Optical Performance of Phosphor Converted White Light Emitting Diodes

Measurement of Dynamic Junction Temperature for LED Flash Units of Camera

Quantum Dot Light Emitting Diodes Based on ZnO Nanoparticles

Reliability of Fan-out Wafer-level Packaging With Large Chips And Multiple Re-distributed Layers

Solderability Evaluation of Printed Silver Solder Pad for Wafer-level Packaging

Thermal Characterization of Multi-chip Light Emitting Diodes With Thermal Resistance Matrix

Thermal Simulation for High Power LED Systems with Remote Phosphor Layer

3D Chip Stacking with through Silicon-vias (TSVs) for Vertical Interconnect and Underfill Dispensing

Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs)

Growth, Characterization, and Application of Well-defined Separated Gan-based Pyramid Array on Micropatterned Sapphire Substrate

A Novel Chip-on-Board White Light-emitting Diode Design for Light Extraction Enhancement

Effect of the Surface Curvature of the Phosphor Layer on the Optical Performance of a WLED

Effects of Interconnect Layout and Underfill Thermal Conductivity on the Thermal Resistance of Flip-Chip LEDs

Investigation on the Influence of Phosphor Particle Size Gradient on the Optical Performance of White Light-Emitting Diodes

Investigation the Effect of Silane onto Fabricating Polymer Insulation Layer by Spin-coating for through Silicon Vias

Modeling of Residual Strain in BGA-PCB Assemblies for Pad Cratering Control

Packaging of UV LED with a Stacked Silicon Reflector for Converged UV Emission

Pad Cratering Based Failure Criterion for the Life Prediction of Board Level Cyclic Bending Test

Transient Light Emission Microscopy for Detecting the Non-Uniform Junction Temperature in Flip-Chip Light Emitting Diodes

An Implantable Medical Device for Transcorneal Electrical Stimulation: Packaging Structure, Process Flow, and Toxicology Test

Experimental investigation of the failure mechanism of Cu-Sn intermetallic compounds in SAC solder joints

Characterisation of Copper Diffusion in Through Silicon Vias

A Method for Measuring Thermal Conductivity of Paste Materials

Application of Nano Silver sintering Technique on the Chip Bonding for Flip-chip and Vertical Light Emitting Diodes

Characterization of Orthotropic CTE of BT Substrate for PBGA Warpage Evaluation

Correlation of Board and Joint Level Test Methods with Strain Dominant Failure Criteria for Improving the Resistance to Pad Cratering

Effect of Substrate Dimensions and Boundary Conditions on the Heat Spreading of LED Package

Electroplating Fabrication and Characterization of Sn-Ag-Cu Eutectic Solder Films

Experimental Parametric Study on the Bumping and Coining of Gold Studs for Flip Chip Bonding

Fabricating Photosensitive Polymer Insulation Layer by Spin-coating for Through Silicon Vias

Investigation of Reliability of EMC and SMC on Reflectance for UV LED Applications

Low Melting Alloy Composites as Thermal Interface Materials with Low Thermal Resistance

Low-dielectric-constant Novel Periodic Mesoporous Organosilica Thin Film for Interlayer Dielectric

Novel Periodic Mesoporous Organosilica Thin Film with Low Dielectric Constant and High Mechanical Property

Numerical Prediction and Experimental Validation of Multiple Phosphor White LED Spectrum

Sensitivity Study on the Precision of Data Acquisition for LED Life Prediction Based on the Degradation of Luminous Output

Void-Free Underfill Encapsulation for Flip Chip High Voltage LED Packaging

Failure Analysis and Experimental Verification for Through-Silicon-via Underfill Dispensing on 3-D Chip Stack Package

Lens Forming by Stack Dispensing for LED Wafer Level Packaging

Parameter Correlation and Computational Modeling for the Flow of Encapsulant in Through-Silicon-Via Underfill Dispensing

Detection of the Non-uniformity of Junction Temperature in Large Light-emitting Diode Using an Improved Forward Voltage Method

Fabricating Polymer Insulation Layer by Spin-coating for Through Silicon Vias

Fluxless Packaging of an Implantable Medical Device for Transcorneal Electrical Stimulation

Influence of Rubber Nanoparticles on the Properties of Novolac-diazonaphthoquinone Based Photoresist

Investigation of the Influence of Ag Reflective Layer on the Correlated Color Temperature and the Angular Color Uniformity of LED with Conformal Phosphor Coating

Investigation on the Thermal Degradation Mechanism of Cu-Sn Intermetallic Compound in SAC Solder Joints with Cohesive Zone Modeling

Modeling and Parametric Study of Light Scattering, Absorption and Emission of Phosphor in a White Light-Emitting Diode

Simulation and Optimization on Thermal Performance of LED Filament Light Bulb

Thermally Conductive Adhesives Based on Silver Coated Copper Flake Fillers

Wafer Level Bumping Technology for High Voltage LED Packaging

Comparison of ball pull strength among various Sn-Cu-Ni solder joints with different pad surface finishes

Electrical-thermal-luminous-chromatic model of phosphor-converted white light-emitting diodes

Impact of Ni Concentration on the Intermetallic Compound Formation and Brittle Fracture Strength of Sn-Cu-Ni (SCN) Lead-free Solder Joints

废旧BGA器件二次利用的焊接强度研究

Development of a real-time monitoring system with uni-photodetector for LED long term reliability tests

Lens forming by stack dispensing for LED wafer level packaging

Multilayer Dispensing of Remote Phosphor for LED Wafer Level Packaging with Pre-formed Silicone Lens

O2 plasma treatment in polymer insulation process for through silicon vias

Through Silicon Underfill Dispensing for 3D Die/Interposer Stacking

電子材料界面裂紋的新型濕氣壓力模型

Assessment of solder pad cratering strength using cold pin pull test method with pre-fabricated pin arrays

Brittle Fracture of Intermetallic Compounds in SAC Solder Joints under High Speed Ball Pull/Pin Pull and Charpy Impact Tests

Design and Implementation of Fine Pitch COB LED Display

Experimental Characterization of Adhesion Strength between the Silicone Encapsulant and the Bottom of a SMD LED Leadframe Cup

Investigation on the Properties and Processability of Polymeric Insulation Layers for Through Silicon Via

LED Wafer Level Packaging with a Heimisphrical Waffle Pack Remote Phosphor Layer

Measurement and Analysis of Interfacial Adhesion Strength between the Silicone Encapsulant and the Side Wall of a SMD LED Leadframe Cup

Optical Characterization of a Light Bulb with the Waffle Pack LED WLP Module

Quasi-conformal Phosphor Dispensing on LED for White Light Illumination

Remote Phosphor Deposition on LED Arrays with Pre-encapsulated Silicone Lens

Thermal Characterization of a Printed Circuit Board with Thermal Vias for The Application of High Brightness Light-emitting Diodes

Wetting Behavior of Polymer Liquid in Insulation Process for through Silicon via

Design and Fabrication of a Silicon Interposer With TSVs in Cavities for Three-Dimensional IC Packaging

Emerging trend for LED wafer level packaging

Moldless encapsulation for LED wafer level packaging using integrated DRIE trenches

Reliability of high-power LED packaging and assembly

電子塑封材料的高溫界面強度研究

绿色电子封装技术与材料

Assessment of Non-uniform Temperature Effect on BGA De-component Process

Comparative Study on Dendrite Formation on Solder Pads with ImAg and OSP Surface Finishes Using Water Drop Test Method

COMPARISON OF FATIGUE CRACK INITIATION/PROPAGATION AND DAISY-CHAIN RESISTANCE IN LEAD-FREE SOLDER JOINTS UNDER TEMPERATURE CYCLING TEST

Determination of Driving Current of RGB LEDs for White Light Illumination

Development of innovative cold pin pull test method for solder pad crater evaluation

Different Morphologies of Nano-ZnO Affection on Properties of Transparent Epoxy Resin Encapsulants

Effect of Die Attach Adhesive Defects on the Junction Temperature Uniformity of LED Chips

Effects of GaN Blue LED Chip and Phosphor on Optical Performance of White Light LED

Fast Copper Plating Process for Through Silicon Via (TSV) Filling

Investigation of fracture behaviors of Cu-Sn intermetallics using impact test

Investigation on Mechanical Properties and Bonding Parameters of Copper Wire Bonding

LED wafer level packaging with a remote phosphor cap

Reverse wire bonding and phosphor printing for LED wafer level packaging

TSV Plating Using Copper Methanesulfonate Electrolyte with Single Component Suppressor

Ultrasonic Inspection of Package Internal Defects Considering Multiple Interface Effects

Underfill dispensing for 3D die stacking with through silicon vias

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

Investigation on Copper Diffusion Depth in Copper Wire Bonding

Spacing optimization of high power LED arrays for solid state lighting

Shock test methods and test standards for portable electronic devices

Technologies and Materials for Green IC Packaging

A comparison of copper sulfate and methanesulfonate electrolytes in the copper plating process for through silicon via metallization

Advanced LED wafer level packaging technologies

Characterization and Comparison between the SnCuNi IMC in SnCu Solder with ENIG Pad Finish and in SnCuNi Solder with OSP Pad Finish

Computational parametric study on the strain hardening effect of lead-free solder joints in board level mechanical drop tests

Considerations in solution stabilization for thermal fatigue modeling of lead-free solder joints

Effect of interfacial strength between Cu6Sn5 and Cu3Sn intermetallics on the brittle fracture failure of lead-free solder joints with OSP pad finish

Enhancement of thermal conductivity of die attach adhesives (DAAs) using nanomaterials for high brightness light-emitting diode (HBLED)

Evaluation of polymer wafer bonding with silicone adhesive and patterned trenches

Investigation on lead-free solder joint reliability of edge-bonded CBGA under temperature cycling

LED packaging using silicon substrate with cavities for phosphor printing and copper-filled TSVs for 3D interconnection

Mechanical shock test performance of SAC105 (Sn-1.0Ag-0.5Cu) and Sn-3.5Ag, BGA components with SAC305 solder paste on NiAu and OSP board surface finishes

Nondestructive inspection of through silicon via depth using scanning acoustic microscopy

Study on copper plating solutions for fast filling of through silicon via (TSV) in 3D electronic packaging

3D IC Integration with TSV Interposers for High Performance Applications

3D LED and IC wafer level packaging

Fundamental Characteristics of Moisture Transport, Diffusion, and the Moisture-induced Damages in Polymeric Materials in Electronic Packaging

Hygrothermal Delamination Analysis of Quad Flat No-Lead (QFN) Packages

Nano-scale and Atomistic-scale Modeling of Advanced Materials

A novel vapor pressure transfusion model for the popcorning analysis of Quad Flat No-lead (QFN) packages

ASSESSMENT OF RELATIVE THERMAL FATIGUE LIFE OF SAC LEAD-FREE AND TIN-LEAD SOLDERS WITH CUSTOM-MADE BGA ASSEMBLIES CREATING VARIOUS STRESS RANGES

Comparative study of PWB pad cratering subject to reflow soldering and thermal impact

Detailed investigation on the creep damage accumulation of lead-free solder joints under accelerated temperature cycling

Effects of corner and edgebond epoxy adhesives on board level solder joint reliability of BGA mezzanine connectors

Embedded 3D hybrid IC integration System-in-Package (SiP) for opto-electronic interconnects in organic substrates

Integration of phosphor printing and encapsulant dispensing processes for wafer level LED array packaging

Modeling of board level solder joint reliability under mechanical drop test with the consideration of plastic strain hardening of lead-free solder

Nanoindentation characterization of lead-free solders and intermetallic compounds under thermal aging

Novel sequential electro-chemical and thermo-mechanical simulation methodology for annular through-silicon-via (TSV) design

Predictive Modeling and Experimental Validation of Lead-Free Solder Joint Reliability under Temperature Cycling

Silicon Interposer with Cavities and Copper-filled TSVs for 3D Packaging

Solid State Backlight Unit with Lateral-Emitting LEDs and a Light Distributing Plate

Solid state light tube with periodic units of lateral-emitting LEDs

Thermal-enhanced and cost-effective 3D IC integration with TSV (Through-Silicon Via) interposers for high-performance applications

Critical Review of the Engelmaier Model for Solder Joint Creep Fatigue Reliability

Experimental investigations and model study of moisture behaviors in polymeric materials

Micro thermoelectric cooler: Planar multistage

Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages

Comparison of thermal fatigue reliability of SnPb and SAC solders under various stress range conditions

Comparison of Thermal Fatigue Reliability of SnPb and SAC Solders under Various Stress Range Conditions

Correlation between Material Selection and Moisture Sensitivity Levels of Quad Flat No-lead (QFN) Packages

Determination of Optimal Component Spacing in a High Power Light Emitting Diode Array Assembly for Solid State Lighting

Development of surface mount compatible reel-to-reel assembly process of LED arrays for wide area general lighting

Effect of UBM and BCB layers on the thermo-mechanical reliability of Wafer Level Chip Scale Package (WLCSP)

Investigation of lead-free BGA solder joint reliability under 4-point bending using PWB strain-rate analysis

Investigation of Mixed SAC and SnPb Solder Balls under High Speed Ball Shear and Pull Tests

Investigation of the Relationship between Material Selections and Moisture Sensitivity Levels of Quad Flat No-lead (QFN) Packages

Material characterization of corner and edgebond epoxy adhesives for the improvement of board-level solder joint reliability

Process development and prototyping for the assembly of LED arrays on flexible printed circuit tape for general solid state lighting

Stress analysis of hygrothermal delamination of Quad Flat No-lead (QFN) packages

Surface analysis of outgassing contamination from edgebond epoxy adhesives on imag pads

Correlation between measurement and simulation of thermal warpage in PBGA with consideration of molding compound residual strain

Drop/impact tests and analysis of typical portable electronic devices

Eddy current induced heating for the solder reflow of area array packages

Gold Embrittlement of Solder Joints in Wafer-Level Chip-Scale Package on Printed Circuit Board With Ni/Au Surface Finish

Reliability Study of Surface Mount Printed Circuit Board Assemblies with Lead-free Solder Joints

A comprehensive parallel study on the board level reliability of SAC, SACX and SCN solders

Design and fabrication of an epoxy flow stopper with convex corner compensation of V-grooves on a silicon optical bench for the passive alignment of optical fibers

Design and fabrication of MEMS based microphone module by using 3D chip-on-chip package

Determination of solder bump stand-off height in a flip-chip sub-mount for Micro-Opto-Electro-Mechanical System (MOEMS) packaging applications

Development of novel dicing process by anisotropic wet etching with convex corner compensation

Fabrication of Nanoscale Vias by Offset Patterning

Investigation of Moisture Sensitivity Related Failure Mechanism of Quad Flat No-lead (QFN) Packages

Numerical analysis and experimental validation for the prediction of flip chip solder joint standoff height in MEMS microphone application

Wafer level encapsulation process for LED array packaging

Wafer Level LED Packaging with Integrated DRIE Trenches for Encapsulation

Electro-elastic analysis of piezoelectric laminated plates

Passive Alignment of Optical Fibers in V-grooves with Low Viscosity Epoxy Flow

Brittle failure mechanism of SnAgCu and SnPb solder balls during high speed ball shear and cold ball pull tests

Characteristics of copper-to-silicon diffusion in copper wire bonding

Characterization and comparison of five SAC-based solder pastes for pb-free reflow soldering

Characterization of Failure Modes and Analysis of Joint Strength Using Various Conditions for High Speed Solder Ball Shear and Cold Ball Pull Tests

Comparison of joint strength and fracture energy of lead-free solder balls in high speed ball shear/pull tests and their correlation with board level drop test

Design and fabrication of MEMS based microphone module by using 3D chip-on-chip package

Design of experiment (DoE) study on effects of various geometric parameters on copper diffusion in through silicon vias (TSVs)

Development of 2D modeling techniques for the thermal fatigue analysis of solder joints of a module mounted in a 3D cavity on a printed circuit board

Drop impact of a typical portable electronic device - experiments and modeling

Effect of thermal aging on high speed ball shear and pull tests of SnAgCu lead-free solder balls

Effect of V-groove side wall feature on epoxy flow in passive alignment of optical fiber

Effects of aging and underfills on mechanical-drop tests of SnAgCu PBGA (plastic ball grid array) packages on ImAg PCB (printed circuit board)

Effects of barrier layer on copper-to-silicon diffusion and intermetallic compound formation in copper wire bonding

Effects of tooling tip wear and fixture rigidity on solder ball shear and ball pull tests

Effects of underfills on the thermal-cycling tests of SnAgCu PBGA (Plastic Ball Grid Array) packages on ImAg PCB (Printed Circuit Board)

High-speed solder ball shear and pull tests vs. board level mechanical drop tests: Correlation of failure mode and loading speed

Multi-stacked flip chips with copper plated through silicon vias and re-distribution for 3D system-in-package integration

Reliability assessment on the re-balling of PBGA from SnPb to Pb-free solder spheres

Screen-printing of yellow phosphor powder on blue Light Emitting Diode (LED) arrays for white light illumination

Wetting characteristics of solder reflow on copper traces without solder mask

A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on UBM related intermetallic compound growth properties

便携式电子产品的跌落冲击响应试验，仿真和理论

Characterization of intermetallic compound formation and copper diffusion of copper wire bonding

Comparison between experimental measurement and numerical analysis of warpage in PBGA package and assembly with the consideration of residual strain in the molding compound

Corrosion of Sn-Ag-Cu lead-free solders and the corresponding effects on board level solder joint reliability

Design of shock table tests to mimic real-life drop conditions for portable electronic device

Design, process development and prototyping of 3D packaging with multi-stacked flip chips and peripheral through silicon via interconnection

Development and prototyping of a HB-LED array module for indoor solid state lighting

Development and prototyping of a HB-LED array module for indoor solid state lighting

Drop impact of a typical portable electronic device

Drop impact of typical portable electronic product device

Effect of high temperature storage on reliability of Sn-Ag-Cu flip chip solder bumps

Effect of Microstructure on Thermal and Mechanical Properties of PBGA Substrates

Effect of solder mask thickness on shear and pull tests of lead-free solder balls

Effects of Al pad deformation and TiW barrier layer on copper-to-silicon diffusion and intermetallic compound formation in copper wire bonding

Effects of microstructure on thermal and mechanical properties of PBGA substrates

Experimental testing and failure prediction of PBGA package assemblies under 3-point bending condition through computational stress analysis

Experimental testing and failure prediction of PBGA package assemblies under 3-point bending condition through computational stress analysis

Fracture analysis on popcorning of plastic packages during solder reflow

Impact of IMC thickness on lead-free solder joint reliability under thermal aging: Ball shear tests vs. cold bump pull tests

Investigation of IMC thickness effect on the lead-free solder ball attachment strength: Comparison between ball shear test and cold bump pull test results

Investigation of the effect of PCB base materials and pad surface finish on the thermal fatigue life of lead-free solder joints of PBGA and passive resistors

Isothermal fatigue tests of plastic ball grid array (PBGA) SnAgCu lead-free solder joints at 60°C

Multi-Stacked Flip Chips with Copper Plated Through Silicon Vias and Re-Distribution for 3D System-in-Package Integration

Process development for yellow phosphor coating on blue light emitting diodes (LEDs) for white light illumination

Thermal resistance analysis of a multi-stack flip chip 3-d package

Design and fabrication of a flip-chip-on-chip 3-D packaging structure with a through-silicon via for underfill dispensing

Foreword: Three-dimensional packaging

電子製造技術：利用無鉛、無鹵素和導電膠材料

3D stacked flip chip packaging with through silicon vias and copper plating or conductive adhesive filling

A systematic approach for determining the thermal fatigue-life of plastic ball array (PBGA) lead-free solder joints

Assessment of long-term reliability in lead-free assemblies

Characterization of copper-to-silicon diffusion for the application of 3D packaging with through silicon vias

Correlation between the strain on the printed circuit board and the stress in chips for the failure prediction of passive components

Effects of testing conditions and multiple reflows on cold bump pull test of Pb-free solder balls

Evaluation of bondability and reliability of single crystal copper wire bonding

Experimental investigation of the effect of reflow cooling rate on the IMC growth of SAC lead-free solder alloy

Experimental testing and computational stress analysis of printed circuit board for the failure prediction of passive components under the depaneling load condition

Fabrication of Sub-micron Silicon Vias by Deep Reactive Ion Etching

Multi-stack flip chip 3D packaging with copper plated through-silicon vertical interconnection

Optimization of epoxy flow for passive alignment of optical fiber arrays

Thermal-fatigue life prediction equation for Plastic Ball Grid Array (PBGA) SnAgCu lead-free solder joints

Comparison of solder ball shear strengths for various nickel platings on the bond pads of a PBGA substrate

Electronic Manufacturing Service Industries in China

A new method for the solder ball pull test using a shape memory alloy tube

Characteristics of Resistance of Daisy-Chained PBGA Solder Joints under Thermal Fatigue Load, Three-Point Bending Load and Mechanical Drop Load

Chip-on-chip 3D optical interconnect with passive alignment

Computational analyses on the effects of irregular conditions during accelerated thermal cycling tests on board level solder joint reliability

Computational model validation with experimental data from temperature cycling tests of PBGA assemblies for the analysis of board level solder joint reliability

Effects of underfill adhesion on flip chip package reliability

Experimental assessment of passive alignment of optical fibers With V-grooves on silicon optical bench

Finite element analysis for thermal fatigue life estimation of PBGA solder joints with model validation by experimental data

Formation and Plugging of Through-Silicon-Vias for 3D Packaging

Formation of through-silicon-vias by laser drilling and deep reactive ion etching

Gold embrittlement of solder joints in wafer level chip scale package on printed circuit board with Ni/Au surface finish

Modified passive alignment of optical fibers with low viscosity epoxy flow running in V-grooves

Thermal fatigue-life prediction of lead-free solder joints

Thermal-fatigue life prediction equation for wafer-level chip scale package (WLCSP) lead-free solder joints on lead-free printed circuit board (PCB)

Electronics Manufacturing with Lead-free, Halogen-free, and Conductive Adhesive Materials

芯片尺寸封裝: 設計, 材料, 工藝, 可靠性及應用

A Reliability Comparison of Electroplated and Stencil Printed Flip-Chip Solder Bumps Based on UBM Related Intermetallic Compound Growth Properties

Effects of thermal aging and Au addition on the electrical resistance of solder balls in flip chip and ultra-CSP packages

Effects of Thermal Aging and Au Addition on the Electrical Resistance of Solder Balls in Flip Chip and Ultra-CSP Packages

Multi-chip memory module with a flip-chip-on-chip structure and an optional center via hole for underfill dispensing

Optimization of electroplating, stencil printing, ball placement solder-bumping flip-chip process technologies

Optimization of stencil printing wafer bumping for fine pitch flip chip applications

Passive alignment of optical fiber in a V-groove with low viscosity epoxy flow

The impact of the AC current crowding effect on BJT RF noise modeling

Three-dimensional packaging for multi-chip module with through-the-silicon via hole

Analysis on solder ball shear testing conditions with a simple computational model

Assessment of board level solder joint reliability for PBGA assemblies with lead-free solders

Computational parametric analyzes on the solder joint reliability of bottom leaded plastic (BLP) package

Effects of build-up printed circuit board thickness on the solder joint reliability of a wafer level chip scale package (WLCSP)

Micro-machined Conformal silicon Molds for wafer bumping and probing

Modeling and analysis of 96.5Sn-3.5Ag lead-free solder joints of wafer level chip scale package on buildup microvia printed circuit board

Modeling of torsional vibration induced by extension-twisting coupling of anisotropic composite laminates with piezoelectric actuators

Nonlinear-Time-Dependent Analysis of Micro Via-in-Pad Substrates for Solder Bumped Flip Chip Applications

Effects of room temperature storage time on the shear strength of PBGA solder balls

Effects of Room Temperature Storage Time on the Shear Strength of PBGA Solder Balls

Evaluation of board level reliability of Pb-free PBGA solder joints

Experimental Evaluation on Solder Joint Reliability of PBGA Assembly under Mechanical Drop Test

Experimental investigation on the degradation of BGA solder ball shear strength due to room temperature aging

Experimental investigation on the progressive failure mechanism of solder balls during ball shear test

Reliability study and failure analysis of fine pitch solder-bumped flip chip on low-cost flexible substrate without using stiffener

Stress Relaxation in Plastic Molding Compounds

Thermal Analysis of Vertical-Cavity Surface-Emitting LED/VCSEL Assembly with Lead-Free Flip Chip Interconnects

Analysis and comparison of WLCSP-on-build-up PCB assemblies with various solders and microvia configurations

Computational Analysis on the Effects of Double-Layer Build-Up Printed Circuit Board on the Wafer Level Chip Scale Package (WLCSP) Assembly with Pb-Free Solder Joints

Reliability of Eutectic Sn-Pb Solder Bumps and Flip Chip Assemblies

Solder joint crack propagation analysis of wafer-level chip scale package on printed circuit board assemblies

以PZT薄膜为驱动和传感的微型陀螺研制

Microvias for Low-Cost High-Density Interconnects

Bending analysis of piezoelectric laminates

Characterization and analysis on the solder ball sheer testing conditions

Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Alloy

Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Using Split Hopkinson Torsional Bars (SHTB)

Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Using Split Hopkinson Torsional Bars (SHTB)

Dynamic structural coupling behaviours of an anti-symmetric piezoelectric laminate

Effects of plasma cleaning on the reliability of wire bonding

Reliability of 96.5Sn-3.5Ag lead-free solder-bumped wafer level chip scale package (WLCSP) on build-up microvia printed circuit board

Reliability study and failure analysis of fine pitch solder bumped flip chip on low-cost printed circuit board substrate

A damage evolution model for thermal fatigue analysis of solder joints

Characterization of strain rate-dependent shear response of 63Sn/37Pb solder under uniaxial torsion

Design and manufacturing of micro via-in-pad substrates for solder bumped flip chip applications

Effects of electric fields on the bending behavior of PZT-5H piezoelectric laminates

Failure analysis of solder bumped flip chip on low-cost substrates

Fracture mechanics analysis of low cost solder bumped flip chip assemblies with imperfect underfills

Modeling of a rotary motor driven by an anisotropic piezoelectric composite laminate

Solder joint reliability of plastic ball grid array with solder bumped flip chip

Temperature-dependent popcorning analysis of plastic ball grid array package during solder reflow with fracture mechanics method

一种新颖的四梁式压电薄膜微型陀螺

引线框架用铜合金与Sn-Pb共晶焊料界面组织研究

电子封装中的焊点及其可靠性

An analytical method of extension-twisting coupling vibration of piezoelectric composite laminates

Assessment on the effects of electroless nickel plating on the reliability of solder ball attachment to the bond pads of PBGA substrate

Effects of Build-Up Printed Circuit Board Thickness on the Solder Joint Reliability of a Wafer Level Chip Scale Package (WLCSP)

Effects of electric fields on the bending behavior of piezoelectric composite laminates

Experimental Characterization for the Shear Strength of Pb-Free Solder Balls on a PZT Substrate with Pd/Ag Pads

Modeling for prototyping of rotary piezoelectric motors

Reliability of Wafer Level Chip Scale Package (WLCSP) with 96.5Sn-3.5Ag Lead-Free Solder Joints on Build-Up Microvia Printed Circuit Board

Solder joint crack propagation analysis of wafer-level chip scale package on printed circuit board assemblies

Study on the Interfaces Between Copper Alloys for Lead Frame and Sn-Pb Solder Alloys

The Mechanical Properties Degradation of Solder Joints Under Thermal Cycling

Assembly of large PBGAs on printed circuit board with large PQFPs directly on the opposite side

Computational analysis for the torsional vibration control of an anti-symmetric piezoelectric composite laminate

Design and analysis of a microgyroscope with sol-gel piezoelectric plate

Effect of Heat-Spreader Sizes on the Thermal Performance of Large Cavity-Down Plastic Ball Grid Array Packages

Chip Scale Package (CSP): Design, Materials, Process, Reliability & Applications

Design and Performance of a Piezoelectric Microgyroscope

Effects of underfill delamination and chip size on the reliability of solder bumped flip chip on board

Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants

Global Collaborative Electronic Packaging Education

Computational modeling and analysis of a center-cracked panel repaired by bonded composite patch

Critical issues in computational modeling and fatigue life analysis for PBGA solder joints

Development and characterization of a rotary motor driven by anisotropic piezoelectric composite laminate

Effects of temperature profile on the life prediction of PBGA solder joints under thermal cycling

Experimental investigation of the shear strength of a unidirectional carbon/aluminum composite under dynamic torsional loading

Material response and failure mechanism of unidirectional metal matrix composites under impulsive shear loading

Sensitivity study on material properties for the fatigue life prediction of solder joints under cyclic thermal loading

Solder joint reliability of cavity-down plastic ball grid array assemblies

Special Issue on Piezoelectric Motors/Actuators and Their Applications - Preface

Thermal stress analysis of a PQFP moulding process: Comparison of viscoelastic and elastic models

Computational modeling and parametric study of a rotary actuator driven by piezoelectric composites

Thermal fatigue life prediction for solder joints with the consideration of damage evolution

Design for plastic ball grid array solder joint reliability

Effect of chip dimension and substrate thickness on the solder joint reliability of plastic ball grid array packages

Sensitivity study on material properties for the fatigue life prediction of solder joints under cyclic thermal loading

Warpage analysis of plastic ball grid array packages

An experimental investigation on the correlation between testing cycles and delamination of plastic ball grid array packages under thermal cycling with high humidity

Design for plastic ball grid array solder joint reliability

Solder joint reliability of plastic ball grid array with solder bumped flip chip

Impact performance of a woven fabric CFRP laminate

Anisotropic piezoelectric laminates for rotary actuators

Design of linear and rotary actuators using piezoelectric composite laminates

Impact response of woven fabrics and cross-plies carbon fibre composites

Mechanical property study of composite grid reinforced concrete

On the Apparent Bending Isotropy in Clamped Elliptic Composite Laminates

Actuation of Torsional Motion for Piezoelectric Laminated Beams

Bending/Twisting/Shearing Actuation and Sensing of Laminated Composite Beams with Piezopolymer Film

Evaluation of Residual Strength for Cracked Pressure Vessel Repaired by Composite Patch

On the Sensing and Actuation of Clamped Elliptic Piezoelectric Laminates

The Use of Clamped Circular Piezoelectric Laminates as Pressure Sensors

A Quasi-Static Penetration Model for Composite Laminates

Dynamic Penetration of Graphite/Epoxy Laminates Impacted by a Blunt-Ended Projectile

Bending Characteristics of Clamped Elliptic Symmetric Composite Laminates

Ballistic Limit Prediction of Composite Laminates by a Quasi-Static Penetration Model

Modeling Penetration Process of Composite Laminates Subjected to a Blunt-Ended Punch

Damage in Composite Laminates: Effects of Transverse Cracks

Three-Dimensional Analysis of Laminates with Cross Cracks

2-D and 3-D Damage Effects in Cross-Ply Laminates

A Novel Approach to Characterize Phosphor Particles for the Color Tuning of WLEDs

Article

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration

Article

Correlation of warpage distribution with the material property scattering for warpage range prediction of PBGA components

Article

Design, materials, process, and fabrication of fan-out panel-level heterogeneous integration

Article

Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging

Article

Fan-Out Wafer-Level Packaging for Heterogeneous Integration

Article

Reliability of Fan-Out Wafer-Level Heterogeneous Integration

Article

Super flexible GaN light emitting diodes using microscale pyramid arrays through laser lift-off and dual transfer

Article

A Power Inductor Integration Technology Using a Silicon Interposer for DC-DC Converter Applications

Conference paper

Additive Manufacturing of Micro-channels on a Silicon Substrate based on Coaxial Printing Dispenser with in-situ UV LED Curing

Conference paper

Additive Manufacturing of Micro-scale Tunnels on a Silicon Substrate with in-situ UV LED Curing for MEMS Applications

Conference paper

Analysis of pulse-driven LED junction temperature and its reliability

Conference paper

Broadband Emission of Asymmetric Pyramids obtained by Laser Drilling and SAG for Application of Phosphor Free White LEDs

Conference paper

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration

Conference paper

Determination of a Meaningful Warpage Acceptance Criterion for Large PBGA Components Through the Correlation with Scattering in Material Properties

Conference paper

Effect of Material Properties and Bump Parameters on Capillary Filling in Through-Silicon-Via Underfill Dispensing

Conference paper

Fan-out wafer-level packaging for heterogeneous integration

Conference paper

Investigation of Light Scattering Effect Impact on Optical Performance of Phosphor Converted White Light Emitting Diodes

Conference paper

Investigation of the Influence of Packaging Material Degradation on the Optical Performance of Phosphor Converted White Light Emitting Diodes

Conference paper

Measurement of Dynamic Junction Temperature for LED Flash Units of Camera

Conference paper

Quantum Dot Light Emitting Diodes Based on ZnO Nanoparticles

Conference paper

Reliability of Fan-out Wafer-level Packaging With Large Chips And Multiple Re-distributed Layers

Conference paper

Solderability Evaluation of Printed Silver Solder Pad for Wafer-level Packaging

Conference paper

Thermal Characterization of Multi-chip Light Emitting Diodes With Thermal Resistance Matrix

Conference paper

Thermal Simulation for High Power LED Systems with Remote Phosphor Layer

Conference paper

3D Chip Stacking with through Silicon-vias (TSVs) for Vertical Interconnect and Underfill Dispensing

Article

Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs)

Article

Growth, Characterization, and Application of Well-defined Separated Gan-based Pyramid Array on Micropatterned Sapphire Substrate

Article

A Novel Chip-on-Board White Light-emitting Diode Design for Light Extraction Enhancement

Conference paper

Effect of the Surface Curvature of the Phosphor Layer on the Optical Performance of a WLED

Conference paper

Effects of Interconnect Layout and Underfill Thermal Conductivity on the Thermal Resistance of Flip-Chip LEDs

Conference paper

Investigation on the Influence of Phosphor Particle Size Gradient on the Optical Performance of White Light-Emitting Diodes

Conference paper

Investigation the Effect of Silane onto Fabricating Polymer Insulation Layer by Spin-coating for through Silicon Vias

Conference paper

Modeling of Residual Strain in BGA-PCB Assemblies for Pad Cratering Control

Conference paper

Packaging of UV LED with a Stacked Silicon Reflector for Converged UV Emission

Conference paper

Pad Cratering Based Failure Criterion for the Life Prediction of Board Level Cyclic Bending Test

Conference paper

Transient Light Emission Microscopy for Detecting the Non-Uniform Junction Temperature in Flip-Chip Light Emitting Diodes

Conference paper

An Implantable Medical Device for Transcorneal Electrical Stimulation: Packaging Structure, Process Flow, and Toxicology Test

Article

Experimental investigation of the failure mechanism of Cu-Sn intermetallic compounds in SAC solder joints

Article

Characterisation of Copper Diffusion in Through Silicon Vias

Book chapter

A Method for Measuring Thermal Conductivity of Paste Materials

Conference paper

Application of Nano Silver sintering Technique on the Chip Bonding for Flip-chip and Vertical Light Emitting Diodes

Conference paper

Characterization of Orthotropic CTE of BT Substrate for PBGA Warpage Evaluation

Conference paper

Correlation of Board and Joint Level Test Methods with Strain Dominant Failure Criteria for Improving the Resistance to Pad Cratering

Conference paper

Effect of Substrate Dimensions and Boundary Conditions on the Heat Spreading of LED Package

Conference paper

Electroplating Fabrication and Characterization of Sn-Ag-Cu Eutectic Solder Films

Conference paper

Experimental Parametric Study on the Bumping and Coining of Gold Studs for Flip Chip Bonding

Conference paper

Fabricating Photosensitive Polymer Insulation Layer by Spin-coating for Through Silicon Vias

Conference paper

Investigation of Reliability of EMC and SMC on Reflectance for UV LED Applications

Conference paper

Low Melting Alloy Composites as Thermal Interface Materials with Low Thermal Resistance

Conference paper

Low-dielectric-constant Novel Periodic Mesoporous Organosilica Thin Film for Interlayer Dielectric

Conference paper

Novel Periodic Mesoporous Organosilica Thin Film with Low Dielectric Constant and High Mechanical Property

Conference paper

Numerical Prediction and Experimental Validation of Multiple Phosphor White LED Spectrum

Conference paper

Sensitivity Study on the Precision of Data Acquisition for LED Life Prediction Based on the Degradation of Luminous Output

Conference paper

Void-Free Underfill Encapsulation for Flip Chip High Voltage LED Packaging

Conference paper

Failure Analysis and Experimental Verification for Through-Silicon-via Underfill Dispensing on 3-D Chip Stack Package

Article

Lens Forming by Stack Dispensing for LED Wafer Level Packaging

Article

Parameter Correlation and Computational Modeling for the Flow of Encapsulant in Through-Silicon-Via Underfill Dispensing

Article

Detection of the Non-uniformity of Junction Temperature in Large Light-emitting Diode Using an Improved Forward Voltage Method

Conference paper

Fabricating Polymer Insulation Layer by Spin-coating for Through Silicon Vias

Conference paper

Fluxless Packaging of an Implantable Medical Device for Transcorneal Electrical Stimulation

Conference paper

Influence of Rubber Nanoparticles on the Properties of Novolac-diazonaphthoquinone Based Photoresist

Conference paper

Investigation of the Influence of Ag Reflective Layer on the Correlated Color Temperature and the Angular Color Uniformity of LED with Conformal Phosphor Coating

Conference paper

Investigation on the Thermal Degradation Mechanism of Cu-Sn Intermetallic Compound in SAC Solder Joints with Cohesive Zone Modeling

Conference paper

Modeling and Parametric Study of Light Scattering, Absorption and Emission of Phosphor in a White Light-Emitting Diode

Conference paper

Simulation and Optimization on Thermal Performance of LED Filament Light Bulb

Conference paper

Thermally Conductive Adhesives Based on Silver Coated Copper Flake Fillers

Conference paper

Wafer Level Bumping Technology for High Voltage LED Packaging

Conference paper

Comparison of ball pull strength among various Sn-Cu-Ni solder joints with different pad surface finishes

Article

Electrical-thermal-luminous-chromatic model of phosphor-converted white light-emitting diodes

Article

Impact of Ni Concentration on the Intermetallic Compound Formation and Brittle Fracture Strength of Sn-Cu-Ni (SCN) Lead-free Solder Joints

Article

废旧BGA器件二次利用的焊接强度研究

Article

Development of a real-time monitoring system with uni-photodetector for LED long term reliability tests

Conference paper

Lens forming by stack dispensing for LED wafer level packaging

Conference paper

Multilayer Dispensing of Remote Phosphor for LED Wafer Level Packaging with Pre-formed Silicone Lens

Conference paper

O2 plasma treatment in polymer insulation process for through silicon vias

Conference paper

Through Silicon Underfill Dispensing for 3D Die/Interposer Stacking

Conference paper

電子材料界面裂紋的新型濕氣壓力模型

Article

Assessment of solder pad cratering strength using cold pin pull test method with pre-fabricated pin arrays

Conference paper

Brittle Fracture of Intermetallic Compounds in SAC Solder Joints under High Speed Ball Pull/Pin Pull and Charpy Impact Tests

Conference paper

Design and Implementation of Fine Pitch COB LED Display

Conference paper

Experimental Characterization of Adhesion Strength between the Silicone Encapsulant and the Bottom of a SMD LED Leadframe Cup

Conference paper

Investigation on the Properties and Processability of Polymeric Insulation Layers for Through Silicon Via

Conference paper

LED Wafer Level Packaging with a Heimisphrical Waffle Pack Remote Phosphor Layer

Conference paper

Measurement and Analysis of Interfacial Adhesion Strength between the Silicone Encapsulant and the Side Wall of a SMD LED Leadframe Cup

Conference paper

Optical Characterization of a Light Bulb with the Waffle Pack LED WLP Module

Conference paper

Quasi-conformal Phosphor Dispensing on LED for White Light Illumination

Conference paper

Remote Phosphor Deposition on LED Arrays with Pre-encapsulated Silicone Lens

Conference paper

Thermal Characterization of a Printed Circuit Board with Thermal Vias for The Application of High Brightness Light-emitting Diodes

Conference paper

Wetting Behavior of Polymer Liquid in Insulation Process for through Silicon via

Conference paper

Design and Fabrication of a Silicon Interposer With TSVs in Cavities for Three-Dimensional IC Packaging

Article

Emerging trend for LED wafer level packaging

Article

Moldless encapsulation for LED wafer level packaging using integrated DRIE trenches

Article

Reliability of high-power LED packaging and assembly

Article

電子塑封材料的高溫界面強度研究

Article

绿色电子封装技术与材料

Book chapter

Assessment of Non-uniform Temperature Effect on BGA De-component Process

Conference paper

Comparative Study on Dendrite Formation on Solder Pads with ImAg and OSP Surface Finishes Using Water Drop Test Method

Conference paper

COMPARISON OF FATIGUE CRACK INITIATION/PROPAGATION AND DAISY-CHAIN RESISTANCE IN LEAD-FREE SOLDER JOINTS UNDER TEMPERATURE CYCLING TEST

Conference paper

Determination of Driving Current of RGB LEDs for White Light Illumination

Conference paper

Development of innovative cold pin pull test method for solder pad crater evaluation

Conference paper

Different Morphologies of Nano-ZnO Affection on Properties of Transparent Epoxy Resin Encapsulants

Conference paper

Effect of Die Attach Adhesive Defects on the Junction Temperature Uniformity of LED Chips

Conference paper

Effects of GaN Blue LED Chip and Phosphor on Optical Performance of White Light LED

Conference paper

Fast Copper Plating Process for Through Silicon Via (TSV) Filling

Conference paper

Investigation of fracture behaviors of Cu-Sn intermetallics using impact test

Conference paper

Investigation on Mechanical Properties and Bonding Parameters of Copper Wire Bonding

Conference paper

LED wafer level packaging with a remote phosphor cap

Conference paper

Reverse wire bonding and phosphor printing for LED wafer level packaging

Conference paper

TSV Plating Using Copper Methanesulfonate Electrolyte with Single Component Suppressor

Conference paper

Ultrasonic Inspection of Package Internal Defects Considering Multiple Interface Effects

Conference paper

Underfill dispensing for 3D die stacking with through silicon vias

Conference paper

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

Article

Investigation on Copper Diffusion Depth in Copper Wire Bonding

Article

Spacing optimization of high power LED arrays for solid state lighting

Article

Shock test methods and test standards for portable electronic devices

Book chapter

Technologies and Materials for Green IC Packaging

Book chapter

A comparison of copper sulfate and methanesulfonate electrolytes in the copper plating process for through silicon via metallization

Conference paper

Advanced LED wafer level packaging technologies

Conference paper

Characterization and Comparison between the SnCuNi IMC in SnCu Solder with ENIG Pad Finish and in SnCuNi Solder with OSP Pad Finish

Conference paper

Computational parametric study on the strain hardening effect of lead-free solder joints in board level mechanical drop tests

Conference paper

Considerations in solution stabilization for thermal fatigue modeling of lead-free solder joints

Conference paper

Effect of interfacial strength between Cu6Sn5 and Cu3Sn intermetallics on the brittle fracture failure of lead-free solder joints with OSP pad finish

Conference paper

Enhancement of thermal conductivity of die attach adhesives (DAAs) using nanomaterials for high brightness light-emitting diode (HBLED)

Conference paper

Evaluation of polymer wafer bonding with silicone adhesive and patterned trenches

Conference paper

Investigation on lead-free solder joint reliability of edge-bonded CBGA under temperature cycling

Conference paper

LED packaging using silicon substrate with cavities for phosphor printing and copper-filled TSVs for 3D interconnection

Conference paper

Mechanical shock test performance of SAC105 (Sn-1.0Ag-0.5Cu) and Sn-3.5Ag, BGA components with SAC305 solder paste on NiAu and OSP board surface finishes

Conference paper

Nondestructive inspection of through silicon via depth using scanning acoustic microscopy

Conference paper

Study on copper plating solutions for fast filling of through silicon via (TSV) in 3D electronic packaging

Conference paper

3D IC Integration with TSV Interposers for High Performance Applications

Article

3D LED and IC wafer level packaging

Article

Fundamental Characteristics of Moisture Transport, Diffusion, and the Moisture-induced Damages in Polymeric Materials in Electronic Packaging

Book chapter

Hygrothermal Delamination Analysis of Quad Flat No-Lead (QFN) Packages

Book chapter

Nano-scale and Atomistic-scale Modeling of Advanced Materials

Book chapter

A novel vapor pressure transfusion model for the popcorning analysis of Quad Flat No-lead (QFN) packages

Conference paper

ASSESSMENT OF RELATIVE THERMAL FATIGUE LIFE OF SAC LEAD-FREE AND TIN-LEAD SOLDERS WITH CUSTOM-MADE BGA ASSEMBLIES CREATING VARIOUS STRESS RANGES

Conference paper

Comparative study of PWB pad cratering subject to reflow soldering and thermal impact

Conference paper

Detailed investigation on the creep damage accumulation of lead-free solder joints under accelerated temperature cycling

Conference paper

Effects of corner and edgebond epoxy adhesives on board level solder joint reliability of BGA mezzanine connectors

Conference paper

Embedded 3D hybrid IC integration System-in-Package (SiP) for opto-electronic interconnects in organic substrates

Conference paper

Integration of phosphor printing and encapsulant dispensing processes for wafer level LED array packaging

Conference paper

Modeling of board level solder joint reliability under mechanical drop test with the consideration of plastic strain hardening of lead-free solder

Conference paper

Nanoindentation characterization of lead-free solders and intermetallic compounds under thermal aging

Conference paper

Novel sequential electro-chemical and thermo-mechanical simulation methodology for annular through-silicon-via (TSV) design

Conference paper

Predictive Modeling and Experimental Validation of Lead-Free Solder Joint Reliability under Temperature Cycling

Conference paper

Silicon Interposer with Cavities and Copper-filled TSVs for 3D Packaging

Conference paper

Solid State Backlight Unit with Lateral-Emitting LEDs and a Light Distributing Plate

Conference paper

Solid state light tube with periodic units of lateral-emitting LEDs

Conference paper

Thermal-enhanced and cost-effective 3D IC integration with TSV (Through-Silicon Via) interposers for high-performance applications

Conference paper

Critical Review of the Engelmaier Model for Solder Joint Creep Fatigue Reliability

Article

Experimental investigations and model study of moisture behaviors in polymeric materials

Article

Micro thermoelectric cooler: Planar multistage

Article

Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages

Article

Comparison of thermal fatigue reliability of SnPb and SAC solders under various stress range conditions

Conference paper

Comparison of Thermal Fatigue Reliability of SnPb and SAC Solders under Various Stress Range Conditions

Conference paper

Correlation between Material Selection and Moisture Sensitivity Levels of Quad Flat No-lead (QFN) Packages

Conference paper

Determination of Optimal Component Spacing in a High Power Light Emitting Diode Array Assembly for Solid State Lighting

Conference paper

Development of surface mount compatible reel-to-reel assembly process of LED arrays for wide area general lighting

Conference paper

Effect of UBM and BCB layers on the thermo-mechanical reliability of Wafer Level Chip Scale Package (WLCSP)

Conference paper

Investigation of lead-free BGA solder joint reliability under 4-point bending using PWB strain-rate analysis

Conference paper

Investigation of Mixed SAC and SnPb Solder Balls under High Speed Ball Shear and Pull Tests

Conference paper

Investigation of the Relationship between Material Selections and Moisture Sensitivity Levels of Quad Flat No-lead (QFN) Packages

Conference paper

Material characterization of corner and edgebond epoxy adhesives for the improvement of board-level solder joint reliability

Conference paper

Process development and prototyping for the assembly of LED arrays on flexible printed circuit tape for general solid state lighting

Conference paper

Stress analysis of hygrothermal delamination of Quad Flat No-lead (QFN) packages

Conference paper

Surface analysis of outgassing contamination from edgebond epoxy adhesives on imag pads

Conference paper

Correlation between measurement and simulation of thermal warpage in PBGA with consideration of molding compound residual strain

Article

Drop/impact tests and analysis of typical portable electronic devices

Article

Eddy current induced heating for the solder reflow of area array packages

Article

Gold Embrittlement of Solder Joints in Wafer-Level Chip-Scale Package on Printed Circuit Board With Ni/Au Surface Finish

Article

Reliability Study of Surface Mount Printed Circuit Board Assemblies with Lead-free Solder Joints

Article

A comprehensive parallel study on the board level reliability of SAC, SACX and SCN solders

Conference paper

Design and fabrication of an epoxy flow stopper with convex corner compensation of V-grooves on a silicon optical bench for the passive alignment of optical fibers

Conference paper

Design and fabrication of MEMS based microphone module by using 3D chip-on-chip package

Conference paper

Determination of solder bump stand-off height in a flip-chip sub-mount for Micro-Opto-Electro-Mechanical System (MOEMS) packaging applications

Conference paper

Development of novel dicing process by anisotropic wet etching with convex corner compensation

Conference paper

Fabrication of Nanoscale Vias by Offset Patterning

Conference paper

Investigation of Moisture Sensitivity Related Failure Mechanism of Quad Flat No-lead (QFN) Packages

Conference paper

Numerical analysis and experimental validation for the prediction of flip chip solder joint standoff height in MEMS microphone application

Conference paper

Wafer level encapsulation process for LED array packaging

Conference paper

Wafer Level LED Packaging with Integrated DRIE Trenches for Encapsulation

Conference paper

Electro-elastic analysis of piezoelectric laminated plates

Article

Passive Alignment of Optical Fibers in V-grooves with Low Viscosity Epoxy Flow

Book chapter

Brittle failure mechanism of SnAgCu and SnPb solder balls during high speed ball shear and cold ball pull tests

Conference paper

Characteristics of copper-to-silicon diffusion in copper wire bonding

Conference paper

Characterization and comparison of five SAC-based solder pastes for pb-free reflow soldering

Conference paper

Characterization of Failure Modes and Analysis of Joint Strength Using Various Conditions for High Speed Solder Ball Shear and Cold Ball Pull Tests

Conference paper

Comparison of joint strength and fracture energy of lead-free solder balls in high speed ball shear/pull tests and their correlation with board level drop test

Conference paper

Design and fabrication of MEMS based microphone module by using 3D chip-on-chip package

Conference paper

Design of experiment (DoE) study on effects of various geometric parameters on copper diffusion in through silicon vias (TSVs)

Conference paper

Development of 2D modeling techniques for the thermal fatigue analysis of solder joints of a module mounted in a 3D cavity on a printed circuit board

Conference paper

Drop impact of a typical portable electronic device - experiments and modeling

Conference paper

Effect of thermal aging on high speed ball shear and pull tests of SnAgCu lead-free solder balls

Conference paper

Effect of V-groove side wall feature on epoxy flow in passive alignment of optical fiber

Conference paper

Effects of aging and underfills on mechanical-drop tests of SnAgCu PBGA (plastic ball grid array) packages on ImAg PCB (printed circuit board)

Conference paper

Effects of barrier layer on copper-to-silicon diffusion and intermetallic compound formation in copper wire bonding

Conference paper

Effects of tooling tip wear and fixture rigidity on solder ball shear and ball pull tests

Conference paper

Effects of underfills on the thermal-cycling tests of SnAgCu PBGA (Plastic Ball Grid Array) packages on ImAg PCB (Printed Circuit Board)

Conference paper

High-speed solder ball shear and pull tests vs. board level mechanical drop tests: Correlation of failure mode and loading speed

Conference paper

Multi-stacked flip chips with copper plated through silicon vias and re-distribution for 3D system-in-package integration

Conference paper

Reliability assessment on the re-balling of PBGA from SnPb to Pb-free solder spheres

Conference paper

Screen-printing of yellow phosphor powder on blue Light Emitting Diode (LED) arrays for white light illumination

Conference paper

Wetting characteristics of solder reflow on copper traces without solder mask

Conference paper

A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on UBM related intermetallic compound growth properties

Article

便携式电子产品的跌落冲击响应试验，仿真和理论

Article

Characterization of intermetallic compound formation and copper diffusion of copper wire bonding

Conference paper

Comparison between experimental measurement and numerical analysis of warpage in PBGA package and assembly with the consideration of residual strain in the molding compound

Conference paper

Corrosion of Sn-Ag-Cu lead-free solders and the corresponding effects on board level solder joint reliability

Conference paper

Design of shock table tests to mimic real-life drop conditions for portable electronic device

Conference paper

Design, process development and prototyping of 3D packaging with multi-stacked flip chips and peripheral through silicon via interconnection

Conference paper

Development and prototyping of a HB-LED array module for indoor solid state lighting

Conference paper

Development and prototyping of a HB-LED array module for indoor solid state lighting

Conference paper

Drop impact of a typical portable electronic device

Conference paper

Drop impact of typical portable electronic product device

Conference paper

Effect of high temperature storage on reliability of Sn-Ag-Cu flip chip solder bumps

Conference paper

Effect of Microstructure on Thermal and Mechanical Properties of PBGA Substrates

Conference paper

Effect of solder mask thickness on shear and pull tests of lead-free solder balls

Conference paper

Effects of Al pad deformation and TiW barrier layer on copper-to-silicon diffusion and intermetallic compound formation in copper wire bonding

Conference paper

Effects of microstructure on thermal and mechanical properties of PBGA substrates

Conference paper

Experimental testing and failure prediction of PBGA package assemblies under 3-point bending condition through computational stress analysis

Conference paper

Experimental testing and failure prediction of PBGA package assemblies under 3-point bending condition through computational stress analysis

Conference paper

Fracture analysis on popcorning of plastic packages during solder reflow

Conference paper

Impact of IMC thickness on lead-free solder joint reliability under thermal aging: Ball shear tests vs. cold bump pull tests

Conference paper

Investigation of IMC thickness effect on the lead-free solder ball attachment strength: Comparison between ball shear test and cold bump pull test results

Conference paper

Investigation of the effect of PCB base materials and pad surface finish on the thermal fatigue life of lead-free solder joints of PBGA and passive resistors

Conference paper

Isothermal fatigue tests of plastic ball grid array (PBGA) SnAgCu lead-free solder joints at 60°C

Conference paper

Multi-Stacked Flip Chips with Copper Plated Through Silicon Vias and Re-Distribution for 3D System-in-Package Integration

Conference paper

Process development for yellow phosphor coating on blue light emitting diodes (LEDs) for white light illumination

Conference paper

Thermal resistance analysis of a multi-stack flip chip 3-d package

Conference paper

Design and fabrication of a flip-chip-on-chip 3-D packaging structure with a through-silicon via for underfill dispensing

Article

Foreword: Three-dimensional packaging

Article

電子製造技術：利用無鉛、無鹵素和導電膠材料

Book

3D stacked flip chip packaging with through silicon vias and copper plating or conductive adhesive filling

Conference paper

A systematic approach for determining the thermal fatigue-life of plastic ball array (PBGA) lead-free solder joints

Conference paper

Assessment of long-term reliability in lead-free assemblies

Conference paper

Characterization of copper-to-silicon diffusion for the application of 3D packaging with through silicon vias

Conference paper

Correlation between the strain on the printed circuit board and the stress in chips for the failure prediction of passive components

Conference paper

Effects of testing conditions and multiple reflows on cold bump pull test of Pb-free solder balls

Conference paper

Evaluation of bondability and reliability of single crystal copper wire bonding

Conference paper

Experimental investigation of the effect of reflow cooling rate on the IMC growth of SAC lead-free solder alloy

Conference paper

Experimental testing and computational stress analysis of printed circuit board for the failure prediction of passive components under the depaneling load condition

Conference paper

Fabrication of Sub-micron Silicon Vias by Deep Reactive Ion Etching

Conference paper

Multi-stack flip chip 3D packaging with copper plated through-silicon vertical interconnection

Conference paper

Optimization of epoxy flow for passive alignment of optical fiber arrays

Conference paper

Thermal-fatigue life prediction equation for Plastic Ball Grid Array (PBGA) SnAgCu lead-free solder joints

Conference paper

Comparison of solder ball shear strengths for various nickel platings on the bond pads of a PBGA substrate

Article

Electronic Manufacturing Service Industries in China

Book chapter

A new method for the solder ball pull test using a shape memory alloy tube

Conference paper

Characteristics of Resistance of Daisy-Chained PBGA Solder Joints under Thermal Fatigue Load, Three-Point Bending Load and Mechanical Drop Load

Conference paper

Chip-on-chip 3D optical interconnect with passive alignment

Conference paper

Computational analyses on the effects of irregular conditions during accelerated thermal cycling tests on board level solder joint reliability

Conference paper

Computational model validation with experimental data from temperature cycling tests of PBGA assemblies for the analysis of board level solder joint reliability

Conference paper

Effects of underfill adhesion on flip chip package reliability

Conference paper

Experimental assessment of passive alignment of optical fibers With V-grooves on silicon optical bench

Conference paper

Finite element analysis for thermal fatigue life estimation of PBGA solder joints with model validation by experimental data

Conference paper

Formation and Plugging of Through-Silicon-Vias for 3D Packaging

Conference paper

Formation of through-silicon-vias by laser drilling and deep reactive ion etching

Conference paper

Gold embrittlement of solder joints in wafer level chip scale package on printed circuit board with Ni/Au surface finish

Conference paper

Modified passive alignment of optical fibers with low viscosity epoxy flow running in V-grooves

Conference paper

Thermal fatigue-life prediction of lead-free solder joints

Conference paper

Thermal-fatigue life prediction equation for wafer-level chip scale package (WLCSP) lead-free solder joints on lead-free printed circuit board (PCB)

Conference paper

Electronics Manufacturing with Lead-free, Halogen-free, and Conductive Adhesive Materials

Book

芯片尺寸封裝: 設計, 材料, 工藝, 可靠性及應用

Book

A Reliability Comparison of Electroplated and Stencil Printed Flip-Chip Solder Bumps Based on UBM Related Intermetallic Compound Growth Properties

Conference paper

Effects of thermal aging and Au addition on the electrical resistance of solder balls in flip chip and ultra-CSP packages

Conference paper

Effects of Thermal Aging and Au Addition on the Electrical Resistance of Solder Balls in Flip Chip and Ultra-CSP Packages

Conference paper

Multi-chip memory module with a flip-chip-on-chip structure and an optional center via hole for underfill dispensing

Conference paper

Optimization of electroplating, stencil printing, ball placement solder-bumping flip-chip process technologies

Conference paper

Optimization of stencil printing wafer bumping for fine pitch flip chip applications

Conference paper

Passive alignment of optical fiber in a V-groove with low viscosity epoxy flow

Conference paper

The impact of the AC current crowding effect on BJT RF noise modeling

Conference paper

Three-dimensional packaging for multi-chip module with through-the-silicon via hole

Conference paper

Analysis on solder ball shear testing conditions with a simple computational model

Article

Assessment of board level solder joint reliability for PBGA assemblies with lead-free solders

Article

Computational parametric analyzes on the solder joint reliability of bottom leaded plastic (BLP) package

Article

Effects of build-up printed circuit board thickness on the solder joint reliability of a wafer level chip scale package (WLCSP)

Article

Micro-machined Conformal silicon Molds for wafer bumping and probing

Article

Modeling and analysis of 96.5Sn-3.5Ag lead-free solder joints of wafer level chip scale package on buildup microvia printed circuit board

Article

Modeling of torsional vibration induced by extension-twisting coupling of anisotropic composite laminates with piezoelectric actuators

Article

Nonlinear-Time-Dependent Analysis of Micro Via-in-Pad Substrates for Solder Bumped Flip Chip Applications

Article

Effects of room temperature storage time on the shear strength of PBGA solder balls

Conference paper

Effects of Room Temperature Storage Time on the Shear Strength of PBGA Solder Balls

Conference paper

Evaluation of board level reliability of Pb-free PBGA solder joints

Conference paper

Experimental Evaluation on Solder Joint Reliability of PBGA Assembly under Mechanical Drop Test

Conference paper

Experimental investigation on the degradation of BGA solder ball shear strength due to room temperature aging

Conference paper

Experimental investigation on the progressive failure mechanism of solder balls during ball shear test

Conference paper

Reliability study and failure analysis of fine pitch solder-bumped flip chip on low-cost flexible substrate without using stiffener

Conference paper

Stress Relaxation in Plastic Molding Compounds

Conference paper

Thermal Analysis of Vertical-Cavity Surface-Emitting LED/VCSEL Assembly with Lead-Free Flip Chip Interconnects

Conference paper

Analysis and comparison of WLCSP-on-build-up PCB assemblies with various solders and microvia configurations

Article

Computational Analysis on the Effects of Double-Layer Build-Up Printed Circuit Board on the Wafer Level Chip Scale Package (WLCSP) Assembly with Pb-Free Solder Joints

Article

Reliability of Eutectic Sn-Pb Solder Bumps and Flip Chip Assemblies

Article

Solder joint crack propagation analysis of wafer-level chip scale package on printed circuit board assemblies

Article

以PZT薄膜为驱动和传感的微型陀螺研制

Article

Microvias for Low-Cost High-Density Interconnects

Book

Bending analysis of piezoelectric laminates

Conference paper

Characterization and analysis on the solder ball sheer testing conditions

Conference paper

Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Alloy

Conference paper

Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Using Split Hopkinson Torsional Bars (SHTB)

Conference paper

Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Using Split Hopkinson Torsional Bars (SHTB)

Conference paper

Dynamic structural coupling behaviours of an anti-symmetric piezoelectric laminate

Conference paper

Effects of plasma cleaning on the reliability of wire bonding

Conference paper

Reliability of 96.5Sn-3.5Ag lead-free solder-bumped wafer level chip scale package (WLCSP) on build-up microvia printed circuit board

Conference paper

Reliability study and failure analysis of fine pitch solder bumped flip chip on low-cost printed circuit board substrate

Conference paper

A damage evolution model for thermal fatigue analysis of solder joints

Article

Characterization of strain rate-dependent shear response of 63Sn/37Pb solder under uniaxial torsion

Article

Design and manufacturing of micro via-in-pad substrates for solder bumped flip chip applications

Article

Effects of electric fields on the bending behavior of PZT-5H piezoelectric laminates

Article

Failure analysis of solder bumped flip chip on low-cost substrates

Article

Fracture mechanics analysis of low cost solder bumped flip chip assemblies with imperfect underfills

Article

Modeling of a rotary motor driven by an anisotropic piezoelectric composite laminate

Article

Solder joint reliability of plastic ball grid array with solder bumped flip chip

Article

Temperature-dependent popcorning analysis of plastic ball grid array package during solder reflow with fracture mechanics method

Article

一种新颖的四梁式压电薄膜微型陀螺

Article

引线框架用铜合金与Sn-Pb共晶焊料界面组织研究

Article

电子封装中的焊点及其可靠性

Article

An analytical method of extension-twisting coupling vibration of piezoelectric composite laminates

Conference paper

Assessment on the effects of electroless nickel plating on the reliability of solder ball attachment to the bond pads of PBGA substrate

Conference paper

Effects of Build-Up Printed Circuit Board Thickness on the Solder Joint Reliability of a Wafer Level Chip Scale Package (WLCSP)

Conference paper

Effects of electric fields on the bending behavior of piezoelectric composite laminates

Conference paper

Experimental Characterization for the Shear Strength of Pb-Free Solder Balls on a PZT Substrate with Pd/Ag Pads

Conference paper

Modeling for prototyping of rotary piezoelectric motors

Conference paper

Reliability of Wafer Level Chip Scale Package (WLCSP) with 96.5Sn-3.5Ag Lead-Free Solder Joints on Build-Up Microvia Printed Circuit Board

Conference paper

Solder joint crack propagation analysis of wafer-level chip scale package on printed circuit board assemblies

Conference paper

Study on the Interfaces Between Copper Alloys for Lead Frame and Sn-Pb Solder Alloys

Conference paper

The Mechanical Properties Degradation of Solder Joints Under Thermal Cycling

Conference paper

Assembly of large PBGAs on printed circuit board with large PQFPs directly on the opposite side

Article

Computational analysis for the torsional vibration control of an anti-symmetric piezoelectric composite laminate

Article

Design and analysis of a microgyroscope with sol-gel piezoelectric plate

Article

Effect of Heat-Spreader Sizes on the Thermal Performance of Large Cavity-Down Plastic Ball Grid Array Packages

Article

Chip Scale Package (CSP): Design, Materials, Process, Reliability & Applications

Book

Design and Performance of a Piezoelectric Microgyroscope

Conference paper

Effects of underfill delamination and chip size on the reliability of solder bumped flip chip on board

Conference paper

Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants

Conference paper

Global Collaborative Electronic Packaging Education

Conference paper

Computational modeling and analysis of a center-cracked panel repaired by bonded composite patch

Article

Critical issues in computational modeling and fatigue life analysis for PBGA solder joints

Article

Development and characterization of a rotary motor driven by anisotropic piezoelectric composite laminate

Article

Effects of temperature profile on the life prediction of PBGA solder joints under thermal cycling

Article

Experimental investigation of the shear strength of a unidirectional carbon/aluminum composite under dynamic torsional loading

Article

Material response and failure mechanism of unidirectional metal matrix composites under impulsive shear loading

Article

Sensitivity study on material properties for the fatigue life prediction of solder joints under cyclic thermal loading

Article

Solder joint reliability of cavity-down plastic ball grid array assemblies

Article

Special Issue on Piezoelectric Motors/Actuators and Their Applications - Preface

Article

Thermal stress analysis of a PQFP moulding process: Comparison of viscoelastic and elastic models

Article

Computational modeling and parametric study of a rotary actuator driven by piezoelectric composites

Conference paper

Thermal fatigue life prediction for solder joints with the consideration of damage evolution

Conference paper

Design for plastic ball grid array solder joint reliability

Article

Effect of chip dimension and substrate thickness on the solder joint reliability of plastic ball grid array packages

Article

Sensitivity study on material properties for the fatigue life prediction of solder joints under cyclic thermal loading

Article

Warpage analysis of plastic ball grid array packages

Article

An experimental investigation on the correlation between testing cycles and delamination of plastic ball grid array packages under thermal cycling with high humidity

Conference paper

Design for plastic ball grid array solder joint reliability

Conference paper

Solder joint reliability of plastic ball grid array with solder bumped flip chip

Conference paper

Impact performance of a woven fabric CFRP laminate

Article

Anisotropic piezoelectric laminates for rotary actuators

Conference paper

Design of linear and rotary actuators using piezoelectric composite laminates

Conference paper

Impact response of woven fabrics and cross-plies carbon fibre composites

Conference paper

Mechanical property study of composite grid reinforced concrete

Conference paper

On the Apparent Bending Isotropy in Clamped Elliptic Composite Laminates

Article

Actuation of Torsional Motion for Piezoelectric Laminated Beams

Conference paper

Bending/Twisting/Shearing Actuation and Sensing of Laminated Composite Beams with Piezopolymer Film

Conference paper

Evaluation of Residual Strength for Cracked Pressure Vessel Repaired by Composite Patch

Conference paper

On the Sensing and Actuation of Clamped Elliptic Piezoelectric Laminates

Conference paper

The Use of Clamped Circular Piezoelectric Laminates as Pressure Sensors

Conference paper

A Quasi-Static Penetration Model for Composite Laminates

Article

Dynamic Penetration of Graphite/Epoxy Laminates Impacted by a Blunt-Ended Projectile

Article

Bending Characteristics of Clamped Elliptic Symmetric Composite Laminates

Conference paper

Ballistic Limit Prediction of Composite Laminates by a Quasi-Static Penetration Model

Conference paper

Modeling Penetration Process of Composite Laminates Subjected to a Blunt-Ended Punch

Conference paper

Damage in Composite Laminates: Effects of Transverse Cracks

Article

Three-Dimensional Analysis of Laminates with Cross Cracks

Article

2-D and 3-D Damage Effects in Cross-Ply Laminates

Conference paper