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Ricky Shi-wei LEE
李世瑋

PhD in Aeronautical and Astronautical Engineering
Purdue University, 1992

Senior Advisor to the Vice-President for Research and Development

Chair Professor
Department of Mechanical and Aerospace Engineering

Executive Director of Shenzhen Platform Development Office

Director of Additive Manufacturing for Microelectronics & Microsystems Laboratory

Director of Electronic Packaging Laboratory

Director of HKUST Foshan Center for Technology and Commercialization

Director of HKUST Foshan Research Institute for Smart Manufacturing

Director of HKUST LED-FPD Technology Research and Development Center at Foshan

  • (86) 20 8833 5001
  • rickylee@ust.hk
  • Room W2-410, HKUST(GZ)
  • Personal Web

Google Scholar
0y5312YAAAAJ
ORCID
0000-0002-7706-522X
Scopus ID
8425908400
Research Interest Publications Projects RPG Supervision Space used

Research Interest


  • Electronic packaging
  • Optical fibers and light-emitting diode (LED) packaging
  • Microelectromechanical systems (MEMS)
  • Lead-free soldering
  • Computational modeling

Publications


All Years 414 2023 4 2022 7 2021 11 2020 7 2019 11 2018 25 2017 349

2023 4

A Flexible Thin-Film Inductor for High-Efficiency Wireless Power Transfer

IEEE Electron Device Letters, v. 44, (3), March 2023, article number 10032542, p. 504-507
Yao, Yuan; Qiu, Xing; Cheng, Yuanjie; Lo, Chi Chuen; Lee, Ricky Shi-wei; Ki, Wing Hung; Tsui, Chi Ying
Article

Development of Uniform Polydimethylsiloxane Arrays through Inkjet Printing

Polymers, v. 15, (2), January 2023, article number 462
Tu, Ning; Lo, Jeffery C. C.; Lee, Shi-wei
Article

Quantum Dot Color Conversion Film with Enhanced Color Rendering Performance

2023 International Conference on Electronics Packaging (ICEP) / IEEE. Piscataway, NJ : IEEE, 2023, p. 135-136, article number 10129754
Cheng, Yuanjie; Lo, Chi Chuen; Qiu, Xing; Xu, Hua; Tao, Mian; Lee, Shi-wei
Conference paper

Reliability and Lifetime of a Novel 222-nm KrCl Excilamp

Proceedings - 2022 19th China International Forum on Solid State Lighting and 2022 8th International Forum on Wide Bandgap Semiconductors, SSLCHINA: IFWS 2022 / IEEE. Piscataway, NJ : IEEE, 2023, p. 228-230, article number 10070975
Zhao, Fanny; Zeng, Yapei; Wu, Hao; Chen, Junquan; Yang, Guoming; Zhen, Li; Shieh, Brian; Lee, Ricky Shi-wei
Conference paper
2022 7

Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing

Journal of Electronic Packaging, v. 144, (4), December 2022, article number 041010
Zhang, Qiming; Lee, Shi-wei
Article

From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, Applications


Lee, Shi-wei; Lo, Chi Chuen; Tao, Mian; Ye, Huaiyu
Book

A UVC LED Disinfection Closet for Reuse of Protective Coats

2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022, 2022, article number 9873115
Qiu, Xing; Lo, Chi Chuen; Cheng, Yuanjie; Xu, Hua; Xu, Qianwen; Lee, Shi-wei
Conference paper

Improved Inkjet Printing of Polydimethylsiloxane Droplets

2022 International Conference on Electronics Packaging, ICEP 2022, 17 June 2022, article number 9795441, p. 241-242
Tu, Ning; Lo, Chi Chuen; Lee, Shi-wei
Conference paper

Inkjet Printing High Resolution Polydimethylsiloxane Dots Array

2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022, 2022, article number 9873331
Tu, Ning; Lo, Chi Chuen; Lee, Shi-wei
Conference paper

Solderability Analysis of Inkjet-printed Silver Pads with SAC Solder Joints

2022 International Conference on Electronics Packaging, ICEP 2022 / IEEE. IEEE, 2022, p. 65-66, Article number: 9795503
Jiang, Qian; Tu, Ning; Lo, Chi Chuen; Lee, Shi-wei
Conference paper

Thermal-mechanical Reliability of Sintered Nano-Ag Bond Pads Printed by Aerosol Jet

2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022, 2022, article number 9873290
Lo, Chi Chuen; Jiang, Qian; Qiu, Xing; Tu, Ning; Lee, Shi-wei
Conference paper
2021 11

Characterization And Evaluation Of 3D-printed Connectors For Microfluidics

Micromachines, v. 12, (8), August 2021, article number 874
Xu, Qianwen; Lo, Jeffery C. C.; Lee, Shi-wei
Article

Fabrication and Reliability Assessment of Cu Pillar Microbumps with Printed Polymer Cores

Journal of Electronic Packaging, Transactions of the ASME, v. 143, (3), September 2021, article number 031101
Qiu, Xing; Lo, Jeffery Chi Chuen; Cheng, Yuanjie; Lee, Shi-wei; Tseng, Yong Jhe; Chiu, Peter
Article

Implementation and characterisation of a sterilisation module consisting of novel 265 nm UVC LED packages

HKIE Transactions, v. 28, (4), 31 December 2021, p. 213-220
Qiu, Xing; Lo, Chi Chuen; Cheng, Yuanjie; Xu, Hua; Xu, Qianwen; Lee, Shi-wei
Article

Mechanical System and Dynamic Control in Photolithography for Nanoscale Fabrication: A Critical Review

International Journal of Mechanical System Dynamics, v. 1, (1), September 2021, p. 35-51
Song, Yi; Gui, Chengqun; Huo, Zongliang; Lee, Shi-wei; Liu, Sheng
Article

Phosphor-free microLEDs with ultrafast and broadband features for visible light communications

Photonics Research, v. 9, (4), April 2021, p. 452-459
Tian, Zhenhuan; Li, Qiang; Wang, Xuzheng; Zhang, Mingyin; Su, Xilin; Zhang, Ye; Li, Yufeng; Yun, Feng; Lee, Shi-wei
Article

Evaluation and Reduction of Optical Crosstalk in Quantum Dot Color-Converted Mini/Micro-LED Displays

2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021, 14 September 2021
Cheng, Yuanjie; Lo, Chi Chuen; Qiu, Xing; Lee, Shi-wei
Conference paper

Life Projection of Far-UVC KrCl Excilamp with 222nm Peak Wavelength

2021 18th China International Forum on Solid State Lighting and 2021 7th International Forum on Wide Bandgap Semiconductors, SSLChina: IFWS 2021, December 2021, article number 9675209, p. 239-242
Dong, Guoshuai; Zhao, Fanny; Wu, Hao; Yang, Guoming; Deng, Ronghua; Shieh, Brian; Lee, Ricky Shi-wei
Conference paper

Realizing Low Optical Crosstalk, Wide Color Gamut Mini-LED Displays via Laser-Patterned Quantum Dots Color Conversion Layer

2021 International Conference on Electronics Packaging, ICEP 2021, May 2021, article number 9451947, p. 153-154
Cheng, Yuanjie; Lo, Chi Chuen; Qiu, Xing; Lee, Shi-wei
Conference paper

Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer (RDL)

Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2021, October 2021, article number v001t07a025
Lee, Shi-wei; Lo, Chi Chuen; Qiu, Xing; Tu, Ning
Conference paper

Synthesis of Face to Face Partially Fused Carbon Nanotubes for the Improvement of Thermal Management in 3D Die Stacking

2021 IEEE 16th Nanotechnology Materials and Devices Conference, NMDC 2021, December 2021, article number 9677535
Xu, Hua; Lo, Chi Chuen; Lee, Shi-wei
Conference paper

The Study of Far-UVC 222-nm Excilamp and Germicidal-UVC 254-nm Low-pressure Hg Lamp: Optical Characteristics and Service Life

2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021, 14 September 2021, article number 9567948
Zhao, Fanny; Dong, Guoshuai; Wu, Hao; Yang, Guoming; Shieh, Brian; Lee, Ricky Shi-wei; Deng, Ronghua
Conference paper
2020 7

Assessment of Fatigue Induced Pad Cratering With a Universal Expression of Printed Circuit Board Fatigue Resistance

Journal of Electronic Packaging, v. 142, (2), June 2020, article number 021008
Zhang, Qiming; Lee, Shi-wei
Article

Directly Printed Hollow Connectors for Microfluidic Interconnection with UV-Assisted Coaxial 3D Printing

Applied Sciences, v. 10, (10), May 2020, article number 3384
Xu, Qianwen; Lo, Jeffery Chi Chuen; Lee, Shi-wei
Article

UV LED Assisted Printing Platform for Fabrication of Micro-Scale Polymer Pillars

Journal of Microelectromechanical Systems, v. 29, (6), December 2020, article number 9214960, p. 1523-1530
Qiu, Xing; Lo, Chi Chuen; Cheng, Yuanjie; Lee, Shi-wei; Tseng, Yong Jhe; Yi, Hung Kuan; Chiu, Peter
Article

Cross-sectioning Technique for Bonded Silicon Substrates with Face-to-Face Interlaced Carbon Nanotubes in Microchannels

Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, v. 2020, July 2020, article number 9261020
Xu, Hua; Lo, Jeffrey Chi Chuen; Lee, Shi-wei
Conference paper

Dimensionless Correlation between Empirical Modeling and T3ster Measurements for the Dynamic Thermal Characterization of the PWM-mode Current Driving UVLED

2020 17th China International Forum on Solid State Lighting and 2020 International Forum on Wide Bandgap Semiconductors China, SSLChina: IFWS 2020, November 2020, article number 9308826, p. 260-265
Zhao, Fanny; Zeng, Yapei; Dong, Guoshuai; Yang, Guoming; Shieh, Brian; Lee, Shi-wei
Conference paper

Printing Unifrom QDs Polymer Thin Film for QLED Applications

Proceedings - Electronic Components and Technology Conference, v. 2020-June, June 2020, article number 9159247, p. 1992-1998
Tu, Ning; Lo, Jeffery Chi Chuen; Lee, Shi-wei
Conference paper

Quantum Dot Film Patterning on a Trenched Glass Substrate for Defining Pixel Arrays of a Full-color Mini/Micro-LED Display

2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020, August 2020, article number 9201924
Cheng, Yuanjie; Lo, Chi Chuen; Qiu, Xing; Shieh, Brian; Lee, Shi-wei
Conference paper
2019 11

Filler Particle-Induced Light Absorption in Underfill-Encapsulated Flip-Chip Light-Emitting Diodes

IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 9, (3), March 2019, article number 8463575, p. 562-566
Shang, Andrew Weber; Lo, Chi Chuen; Lee, Shi-wei
Article

The Effect of Metallic Interconnect Spacing on the Thermal Resistance of Flip-Chip Light-Emitting Diodes With Underfill Encapsulation

IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 9, (5), May 2019, article number 8533406, p. 871-876
Shang, Andrew Weber; Lo, Jeffery C. C.; Lee, Shi-wei
Article

Coaxial Nozzle-assisted 3D Printing with in-situ UV LED Curing for Microfluidic Connectors

2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019 / IEEE. New York, NY, USA : IEEE, 2019, Article no.: 9080964
Xu, Qianwen; Lee, Shi-wei; Lo, Jeffery C. C.
Conference paper

Empirical Modeling and measurement of the Pulsed Junction Temperature of VCSEL

2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019 / IEEE. New York, NY, USA : IEEE, 2019, Article no.: 9081173
Shieh, Brian; Zeng, Fangyun; Yang, Guoming; Zhao, Fanny; Sher, Chin-Wei; Lee, Shi-wei
Conference paper

Evaluation and Benchmarking of Cu Pillar Micro-bumps with Printed Polymer Core

2019 International Conference on Electronics Packaging, ICEP 2019, April 2019, article number 8733457, p. 24-27
Qiu, Xing; Lo, Chi Chuen; Lee, Shi-wei; Liou, Ying-Hong; Chiu, Peter
Conference paper

Feasibility study of fan-out panel-level packaging for heterogeneous integrations

Proceedings - Electronic Components and Technology Conference, v. 2019-May, May 2019, article number 8811162, p. 14-20
Ko, Cheng-Ta; Yang, Henry; Lau, John H.; Li, Ming; Lin, Curry; Chang, Chieh Lin; Pan, Jhih Yuan; Wu, Hsing Hui; Xu, Iris; Chen, Tony; Li, Zhang; Tan, Kim Hwee; Lo, Penny; So, R.; Chen, Y. H.; Fan, Nelson; Kuah, Eric; Lin, Marc; Cheung, Y. M.; Ng, Eric; Xi, Cao; Beica, Rozalia; Lim, Sze Pei; Lee, N.C.; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei
Conference paper

Feasibility study of fan-out wafer-level packaging for heterogeneous integrations

Proceedings - Electronic Components and Technology Conference, v. 2019-May, May 2019, article number 8811333, p. 903-909
Lau, John; Li, Ming; Xu, Iris; Chen, Tony; Tan, Kim Hwee; Li, Zhang; Fan, Nelson; Kuah, Eric; So, Raymond; Lo, Penny; Cheung, Y. M.; Xi, Cao; Beica, Rozalia; Lim, Sze Pei; Lee, N.C.; Ko, Cheng Ta; Yang, Henry; Chen, Y. H.; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei
Conference paper

Inkjet Printing PEDOT:PSS without Coffee Ring Effect for QLED Applicaitons

2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019 / IEEE. New York, NY, USA : IEEE, 2019, Article no.: 9081009
Tu, Ning; Lee, Shi-wei
Conference paper

Investigation of Processing Parameters for the Fabrication of Microfluidic Connectors Using a UV-assisted Coaxial 3D Printing System

2019 IEEE 21st Electronics Packaging Technology Conference, EPTC 2019, v. 2019, December 2019, article number 9026686, p. 640-644
Xu, Qianwen; Lo, Jeffery Chi Chuen; Lee, Shi-wei
Conference paper

Junction Temperature Prediction of the Multi-LED Module with the Modified Thermal Resistance Matrix

2019 16th China International Forum on Solid State Lighting and 2019 International Forum on Wide Bandgap Semiconductors China, SSLChina: IFWS 2019, November 2019, article number 9019796, p. 252-255
Zhao, Fanny; Shieh, Brian; Zeng, Fangyun; Yang, Guoming; Lee, Shi-wei
Conference paper

Long-term Stability Evaluation of Thermal Interface Materials (TIMs)

2019 20th International Conference on Electronic Packaging Technology, ICEPT / IEEE. New York, NY, USA : IEEE, 2019, Article no.: 9081271
Lo, Chi Chuen; Tao, Mian; Cheng, Yuanjie; Xu, Qianwen; Xiao, Kunhui; Lee, Shi-wei
Conference paper
2018 25

A Novel Approach to Characterize Phosphor Particles for the Color Tuning of WLEDs

IEEE Photonics Technology Letters, v. 30, (6), March 2018, p. 513-516
Wang, Jiaqi; Lo, Chi Chuen; Lee, Shi-wei; Tao, Mian; Zou, Huayong; Yun, Feng
Article

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration

IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 8, (9), September 2018, article number 8410452, p. 1561-1572
Ko, Cheng-Ta; Yang, Henry; Lau, John H.; Li, Ming; Li, Margie; Lin, Curry; Lin, J.W.; Chen, Tony; Xu, Iris; Chang, Chieh-Lin; Pan, Jhih-Yuan; Wu, Hsing-Hui; Yong, Qing Xiang; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee; Cheung, Yiu-Ming; Ng, Eric; Kai, Wu; Hao, Ji; Beica, Rozalia; Lin, Marc; Chen, Yu-Hua; Cheng, Zhong; Wee, Koh Sau; Ran, Jiang; Xi, Cao; Lim, Sze Pei; Lee, N.C.; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei
Article

Correlation of warpage distribution with the material property scattering for warpage range prediction of PBGA components

Journal of Electronic Packaging, Transactions of the ASME, v. 140, (4), December 2018, article number 041005
Zhang, Qiming; Lo, Chi Chuen; Lee, Shi-wei; Xu, Wei
Article

Design, materials, process, and fabrication of fan-out panel-level heterogeneous integration

Journal of Microelectronics and Electronic Packaging, v. 15, (4), October 2018, p. 141-147
Ko, Cheng Ta; Yang, Henry; Lau, John; Li, Ming; Li, Margie; Lin, Curry; Lin, J.W.; Chang, Chieh Lin; Pan, Jhih Yuan; Wu, Hsing Hui; Chen, Y. H.; Chen, Tony; Xu, Iris; Lo, Penny; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee; Lin, Chia Hung; Beica, Rozalia; Lin, Marc; Xi, Cao; Lim, Sze Pei; Lee, N.C.; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei
Article

Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging

IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 8, (6), June 2018, p. 991-1002
Lau, John H.; Li, Ming; Li, Qingqian Margie; Xu, Iris; Chen, Tony; Li, Zhang; Tan, Kim Hwee; Yong, Qing Xiang; Cheng, Zhong; Wee, Koh Sau; Beica, Rozalia; Ko, C. T.; Lim, Sze Pei; Fan, Nelson; Kuah, Eric; Kai, Wu; Cheung, Yiu-Ming; Ng, Eric; Xi, Cao; Ran, Jiang; Yang, Henry; Chen, Y. H.; Lee, N. C.; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei
Article

Fan-Out Wafer-Level Packaging for Heterogeneous Integration

IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 8, (9), September 2018, article number 8410488, p. 1544-1560
Lau, John Hon Shing; Li, Ming; Li, Margie Qingqian; Chen, Tony; Xu, Iris; Yong, Qing Xiang; Cheng, Zhong; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee Raymond; Cheung, Yiu Ming; Ng, Eric; Lo, Penny; Kai, Wu; Hao, Ji; Wee, Koh Sau; Ran, Jiang; Xi, Cao; Beica, Rozalia; Lim, Sze Pei; Lee, N. C.; Ko, Cheng Ta; Yang, Henry; Chen, Yu Hua; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei
Article

Reliability of Fan-Out Wafer-Level Heterogeneous Integration

Journal of Microelectronics and Electronic Packaging, v. 15, (4), 2018, p. 148-162
Lau, John; Li, Ming; Lei, Yang; Li, Margie; Xu, Iris; Chen, Tony; Yong, Qing X; Cheng, Zhong; Kai, Wu; Lo, Penny; Li, Zhang; Tan, KIm H; Cheung, Yiu Ming; Fan, Nelson; Kuah, Eric; Xi, Cao; Ran, Jiang; Beica, Rozalia; Lim, Sze P; Lee, Ning Cheng; Ko, Cheng-Ta; Yang, Henry; Chen, Yu-Hua; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei
Article

Super flexible GaN light emitting diodes using microscale pyramid arrays through laser lift-off and dual transfer

Optics Express, v. 26, (2), January 2018, p. 1817-1824
Tian, Zhenhuan; Li, Yufeng; Su, Xilin; Feng, Lungang; Wang, Shuai; Ding, Wen; Li, Qiang; Zhang, Ye; Guo, Maofeng; Yun, Feng; Lee, Shi-wei
Article

A Power Inductor Integration Technology Using a Silicon Interposer for DC-DC Converter Applications

Proceedings of the International Symposium on Power Semiconductor Devices and ICs, v. 2018-May, June 2018, p. 347-350
Ding, Yixiao; Fang, Xiangming; Gao, Yuan; Cai, Yuefei; Qiu, Xing; Mok, Kwok Tai Philip; Lee, Shi-wei; Lau, Kei May; Sin, Johnny Kin On
Conference paper

Additive Manufacturing of Micro-channels on a Silicon Substrate based on Coaxial Printing Dispenser with in-situ UV LED Curing

EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging / IEEE. New York, NY, USA : IEEE, 2018, Article no.: 8660886
Xu, Qianwen; Lee, Shi-wei; Lo, Chi Chuen
Conference paper

Additive Manufacturing of Micro-scale Tunnels on a Silicon Substrate with in-situ UV LED Curing for MEMS Applications

2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings, 26 November 2018, article number 8546382
Lee, Shi-wei; Xu, Qianwen; Lo, Chi Chuen
Conference paper

Analysis of pulse-driven LED junction temperature and its reliability

2018 15th China International Forum on Solid State Lighting: International Forum on Wide Bandgap Semiconductors China, SSLChina: IFWS 2018 / IEEE. New York, NY, USA : IEEE, 2018, p. 23-26, Article no.: 8587392
Yang, Nick G. M.; Shieh, Brian Y. R.; Zeng, Trio F. Y.; Lee, Shi-wei
Conference paper

Broadband Emission of Asymmetric Pyramids obtained by Laser Drilling and SAG for Application of Phosphor Free White LEDs

EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging, March 2019, article number 8660821
Tian, Zhenhuan; Li, Qiang; Su, Xilin; Zhang, Ye; Guo, Maofeng; Zhang, Minyan; Ding, Wen; Li, Yufeng; Yun, Feng; Lee, Shi-wei
Conference paper

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration

Proceedings - Electronic Components and Technology Conference, v.2018-May, August 2018, article number 8429574, p. 355-363
Ko, Cheng-Ta; Yang, Henry; Lau, John H.; Li, Ming; Li, Margie; Lin, Curry; Lin, J.W.; Chen, Tony; Xu, Iris; Chang, Chieh-Lin; Pan, Jhih-Yuan; Wu, Hsing-Hui; Yong, Qing Xiang; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee; Cheung, Yiu Ming; Ng, Eric; Kai, Wu; Hao, Ji; Beica, Rozalia; Lin, Marc; Chen, Yu-Hua; Cheng, Zhong; Wee, Koh Sau; Ran, Jiang; Xi, Cao; Lim, Sze Pei; Lee, N.C.; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei
Conference paper

Determination of a Meaningful Warpage Acceptance Criterion for Large PBGA Components Through the Correlation with Scattering in Material Properties

Proceedings - Electronic Components and Technology Conference, v. 2018-May, August 2018, article number 8429625, p. 718-723
Zhang, Qiming; Lo, Jeffery.C.C.; Lee, Shi-wei; Xu, Wei
Conference paper

Effect of Material Properties and Bump Parameters on Capillary Filling in Through-Silicon-Via Underfill Dispensing

2018 20th International Conference on Electronic Materials and Packaging (EMAP), March 2019, article number 8660884
Le, Fuliang; Lee, Shi-wei; Tao, Mian; Lo, Chi Chuen
Conference paper

Fan-out wafer-level packaging for heterogeneous integration

Proceedings - Electronic Components and Technology Conference, v.2018-May, August 2018, article number 8429869, p. 2360-2366
Lau, John H.; Li, Ming; Li, Margie; Chen, Tony; Xu, Iris; Yong, Qing Xiang; Cheng, Zhong; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee; Cheung, Yiu Ming; Ng, Eric; Lo, Penny; Kai, Wu; Hao, Ji; Wee, Koh Sau; Ran, Jiang; Xi, Cao; Beica, Rozalia; Lim, Sze Pei; Lee, N. C.; Ko, Cheng-Ta; Yang, Henry; Chen, Yu-Hua; Tao, Mian; Lo, Jeffery; Lee, Shi-wei
Conference paper

Investigation of Light Scattering Effect Impact on Optical Performance of Phosphor Converted White Light Emitting Diodes

EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging, March 2019, article number 8660928
Wang, Jiaqi; Lee, Shi-wei; Shieh, Brian
Conference paper

Investigation of the Influence of Packaging Material Degradation on the Optical Performance of Phosphor Converted White Light Emitting Diodes

EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging, March 2019, article number 8660758
Wang, Jiaqi; Lee, Shi-wei; Shieh, Brian
Conference paper

Measurement of Dynamic Junction Temperature for LED Flash Units of Camera

Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018 / IEEE. New York, NY, USA : IEEE, 2018, Article no.: 8480831
Shieh, Brian; Zeng, Fangyun; Lee, Shi-wei; Yang, Guoming
Conference paper

Quantum Dot Light Emitting Diodes Based on ZnO Nanoparticles

EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging, March 2019, article number 8660807
Tu, Ning; Kwok, Z. H. Eric; Lee, Shi-wei
Conference paper

Reliability of Fan-out Wafer-level Packaging With Large Chips And Multiple Re-distributed Layers

Proceedings - Electronic Components and Technology Conference, v. 2018-May, August 2018, article number 8429752, p. 1574-1582
Lau, John Hon Shing; Li, Ming; Yang, Lei; Yong, Qing Xiang; Cheng, Zhong; Chen, Tony; Xu, Iris; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee Raymond; Cheung, Yiu Ming; Ng, Eric; Lo, Penny; Kai, Wu; Hao, Ji; Beica, Rozalia; Wee, Koh Sau; Ran, Jiang; Xi, Cao; Lim, Sze Pei; Lee, NC; Ko, Cheng Ta; Yang, Henry; Chen, YH; Tao, Mian; Lo, Jeffery C.C.; Lee, Shi-wei
Conference paper

Solderability Evaluation of Printed Silver Solder Pad for Wafer-level Packaging

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018, 1 January 2018, article number 8374321, p. 350-354
Tao, Mian; Lo, Chi Chuen; Liou, Ying Hong; Chiu, Peter; Lee, Shi-wei
Conference paper

Thermal Characterization of Multi-chip Light Emitting Diodes With Thermal Resistance Matrix

2017 14th China International Forum on Solid State Lighting: International Forum on Wide Bandgap Semiconductors China, SSLChina: IFWS 2017, v. 2018-January, January 2018, p. 32-37
Zou, Huayong; Lu, Lingyan; Wang, Jiaqi; Shieh, Brian; Lee, Shi-wei
Conference paper

Thermal Simulation for High Power LED Systems with Remote Phosphor Layer

EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging, March 2019, article number 8660903
Zhang, Minshu; Xie, An; Lo, Chi Chuen; Lee, Shi-wei; Ahmatjan, Madina; Hong, Feichi; Yin, Haotian
Conference paper
2017 12

3D Chip Stacking with through Silicon-vias (TSVs) for Vertical Interconnect and Underfill Dispensing

Journal of Micromechanics and Microengineering, v. 27, (4), March 2017, article number 045012
Le, Fuliang; Lee, Shi-wei; Zhang, Qiming
Article

Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs)

Journal of Microelectronics and Electronic Packaging, v. 14, (4), October 2017, p. 123-131
Lau, John H.; Li, Ming; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee; Chen, Tony; Xu, Iris; Li, Margie; Cheung, Y.M.; Kai, Wu; Hao, Ji; Beica, Rozalia; Taylor, Tom; Ko, C. T.; Yang, Henry; Chen, Y. H.; Lim, Sze Pei; Lee, N. C.; Ran, Jiang; Wee, Koh Sau; Yong, Qingxiang; Xi, Cao; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei
Article

Growth, Characterization, and Application of Well-defined Separated Gan-based Pyramid Array on Micropatterned Sapphire Substrate

Applied Physics Express, v. 10, (9), September 2017, article number 092101
Tian, Zhenhuan; Li, Yufeng; Su, Xilin; Feng, Lungang; Wang, Shuai; Zhang, Minyan; Ding, Wen; Li, Qiang; Zhang, Ye; Guo, Maofeng; Yun, Feng; Lee, Shi-wei
Article

A Novel Chip-on-Board White Light-emitting Diode Design for Light Extraction Enhancement

Conference Proceedings - 2016 13th China International Forum on Solid State Lighting, SSLCHINA 2016 / IEEE. New York, NY, USA : IEEE, 2017, p. 24-27, Article no.: 7804342
Zou, Huayong; Wang, Jiaqi; Feng, Mingxin; Shieh, Brian; Lee, Shi-wei
Conference paper

Effect of the Surface Curvature of the Phosphor Layer on the Optical Performance of a WLED

Conference Proceedings - 2016 13th China International Forum on Solid State Lighting, SSLCHINA 2016 / IEEE. New York, NY, USA : IEEE, 2016, p. 20-23, Article no.: 7804341
Wang, Jiaqi; Lee, Shi-wei; Zou, Huayong
Conference paper

Effects of Interconnect Layout and Underfill Thermal Conductivity on the Thermal Resistance of Flip-Chip LEDs


Shang, Andrew Weber; Cai, Yuefei; Lo, Chi Chuen; Lee, Shi-wei
Conference paper

Investigation on the Influence of Phosphor Particle Size Gradient on the Optical Performance of White Light-Emitting Diodes

Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016 / IEEE. New York, NY, USA : IEEE, 2017, p. 259-263, Article no.: 7861483
Wang, Jiaqi; Lee, Shi-wei; Zou, Huayong
Conference paper

Investigation the Effect of Silane onto Fabricating Polymer Insulation Layer by Spin-coating for through Silicon Vias

18th International Conference on Electronic Packaging Technology, ICEPT 2017, September 2017, article number 8046728, p. 1537-1541
Liu, Qiang; Zhang, Guoping; Sun, Rong; Lee, Shi-wei; Wong, C.P.
Conference paper

Modeling of Residual Strain in BGA-PCB Assemblies for Pad Cratering Control

Proceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017 / IEEE. New York, NY, USA : IEEE, 2017, p. 1153-1160, Article no.: 7992619
Zhang, Qiming; Lo, Chi Chuen; Lee, Shi-wei
Conference paper

Packaging of UV LED with a Stacked Silicon Reflector for Converged UV Emission

2017 International Conference on Electronics Packaging, ICEP 2017 / IEEE. New York, NY, USA : IEEE, 2017, p. 259-263, Article no.: 7939371
Qiu, Xing; Lo, Chi Chuen; Lee, Shi-wei
Conference paper

Pad Cratering Based Failure Criterion for the Life Prediction of Board Level Cyclic Bending Test

Proceedings - IEEE 67th Electronic Components and Technology Conference, 1 August 2017, article number 7999729, p. 448-455
Zhang, Qiming; Lo, Chi Chuen; Lee, Shi-wei
Conference paper

Transient Light Emission Microscopy for Detecting the Non-Uniform Junction Temperature in Flip-Chip Light Emitting Diodes

Proceedings IEEE Semiconductor Thermal Measurement and Management Symposium, v. 2017, April 2017, article number 7896944, p. 297-301, 2017 Thirty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Semi-Therm)
Tao, Mian; Lee, Shi-wei
Conference paper
2016 18

An Implantable Medical Device for Transcorneal Electrical Stimulation: Packaging Structure, Process Flow, and Toxicology Test

IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 6, (8), Aug 2016, article number 7509610, p. 1174-1180
Le, Fuliang; Lo, Chi Chuen; Qiu, Xing; Lee, Shi-wei; Li, Xing; Tsui, Chi Ying; Ki, Wing Hung
Article

Experimental investigation of the failure mechanism of Cu-Sn intermetallic compounds in SAC solder joints

Microelectronics Reliability, v. 62, July 2016, p. 130-140
Yang, Chaoran; Le, Fuliang; Lee, Shi-wei
Article

Characterisation of Copper Diffusion in Through Silicon Vias

Materials for Advanced Packaging / Edited by Daniel Lu, C. P. Wong. Cham, Switzerland : Springer, 2016, p. 923-951, Ch. 22
Zhang, Xiaodong; Lee, Shi-wei; Le, Fuliang
Book chapter

A Method for Measuring Thermal Conductivity of Paste Materials

2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, 4 October 2016, article number 7583185, p. 510-513
Feng, Wilson; Zhao, Fanny; Shieh, Brian; Lee, Shi-wei
Conference paper

Application of Nano Silver sintering Technique on the Chip Bonding for Flip-chip and Vertical Light Emitting Diodes

2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, October 2016, article number 7583297, p. 1004-1009
Tao, Mian; Mei, Yunhui; Lee, Shi-wei; Yun, Feng; Lu, Guoquan
Conference paper

Characterization of Orthotropic CTE of BT Substrate for PBGA Warpage Evaluation

Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016 / IEEE. New York, NY, USA : IEEE, 2016, p. 1312-1319, Article no.: 7517700
Zhang, Qiming; Lo, Chi Chuen; Lee, Shi-wei; Xu, Wei; Yang, Weihua
Conference paper

Correlation of Board and Joint Level Test Methods with Strain Dominant Failure Criteria for Improving the Resistance to Pad Cratering

2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, October 2016, article number 7583078, p. 1-6
Zhang, Qiming; Lo, Chi Chuen; Lee, Shi-wei
Conference paper

Effect of Substrate Dimensions and Boundary Conditions on the Heat Spreading of LED Package

2016 International Conference on Electronics Packaging (ICEP), June 2016, article number 7486781, p. 52-56
Lee, Shi-wei; Tian, Zhenhuan; Zhang, Minshu; Xie, An
Conference paper

Electroplating Fabrication and Characterization of Sn-Ag-Cu Eutectic Solder Films

2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, October 2016, article number 7583144, p. 318-321
Xie, Jinqi; Zhong, Zhe; Zhang, Kai; Yuen, Matthew Ming Fai; Lee, Shi-wei; Fu, Xianzhu; Sun, Rong; Wong, Chingping
Conference paper

Experimental Parametric Study on the Bumping and Coining of Gold Studs for Flip Chip Bonding

China Semiconductor Technology International Conference 2016, CSTIC 2016 / IEEE. New York, NY, USA : IEEE, 2016, Article no.: 7463955
Ren, Rongbin; Qiu, Xing; Lo, Chi Chuen; Lee, Shi-wei
Conference paper

Fabricating Photosensitive Polymer Insulation Layer by Spin-coating for Through Silicon Vias

2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, October 2016, article number 7583171, p. 439-442
Liu, Qiang; Zhang, Guoping; Sun, Rong; Lee, Shi-wei; Wong, Chingping
Conference paper

Investigation of Reliability of EMC and SMC on Reflectance for UV LED Applications

2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016 / IEEE. New York, NY, USA : IEEE, 2016, p. 658-664, Article no.: 7463398
Qiu, Xing; Lo, Chi Chuen; Shang, Andrew W.; Lee, Shi-wei
Conference paper

Low Melting Alloy Composites as Thermal Interface Materials with Low Thermal Resistance

2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, October 2016, article number 7583147, p. 331-333
Wen, Haoran; Ji, Yaqiang; Zhang, Kai; Yuen, Matthew Ming Fai; Lee, Shi-wei; Fu, Xianzhu; Sun, Rong; Wong, Chingping
Conference paper

Low-dielectric-constant Novel Periodic Mesoporous Organosilica Thin Film for Interlayer Dielectric

2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, October 2016, article number 7583109, p. 153-156
Zhang, Jiawei; Zhang, Guoping; Sun, Rong; Lee, Shi-wei; Wong, Chingping
Conference paper

Novel Periodic Mesoporous Organosilica Thin Film with Low Dielectric Constant and High Mechanical Property

China Semiconductor Technology International Conference 2016, CSTIC 2016 / IEEE. New York, NY, USA : IEEE, 2016, Article no.: 7463952
Zhang, Jiawei; Zhang, Guoping; Sun, Rong; Lee, Shi-wei; Wong, Chingping
Conference paper

Numerical Prediction and Experimental Validation of Multiple Phosphor White LED Spectrum

2016 International Conference on Electronics Packaging, ICEP 2016, June 2016, article number 7486782, p. 57-61
Lo, Chi Chuen; Lee, Shi-wei; Guo, Xungao; Zhao, Huishan
Conference paper

Sensitivity Study on the Precision of Data Acquisition for LED Life Prediction Based on the Degradation of Luminous Output

2016 6th Electronic System-Integration Technology Conference, ESTC 2016 / IEEE. New York, NY, USA : IEEE, 2016, Article no.:7764509
Lo, Jeffrey Chi Chuen; Yang, Guoming; Tao, Mian; Lee, Shi-wei
Conference paper

Void-Free Underfill Encapsulation for Flip Chip High Voltage LED Packaging

China Semiconductor Technology International Conference 2016, CSTIC 2016 / IEEE. New York, NY, USA : IEEE, 2016, Article no.: 7463954
Shang, Andrew Weber; Qiu, Xing; Lo, Chi Chuen; Lee, Shi-wei; Le, Fuliang
Conference paper
2015 13

Failure Analysis and Experimental Verification for Through-Silicon-via Underfill Dispensing on 3-D Chip Stack Package

IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 5, (10), October 2015, p. 1525-1532
Le, Fuliang; Lee, Shi-wei; Lo, Chi Chuen; Yang, Chaoran
Article

Lens Forming by Stack Dispensing for LED Wafer Level Packaging

IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 5, (1), January 2015, article number 6965571, p. 15-20
Zhang, Rong; Lee, Shi-wei; Lo, Chi Chuen
Article

Parameter Correlation and Computational Modeling for the Flow of Encapsulant in Through-Silicon-Via Underfill Dispensing

IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 5, (8), August 2015, article number 7163313, p. 1178-1185
Le, Fuliang; Lee, Shi-wei; Yang, Chaoran; Lo, Chi Chuen
Article

Detection of the Non-uniformity of Junction Temperature in Large Light-emitting Diode Using an Improved Forward Voltage Method

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015 / IEEE. New York, NY, USA : IEEE, 2015, Article no.: 7103108
Tao, Mian; Lee, Shi-wei
Conference paper

Fabricating Polymer Insulation Layer by Spin-coating for Through Silicon Vias

Proceedings - Electronic Components and Technology Conference, v. 2015-July, July 2015, article number 7159872, p. 1973-1979
Zhang, Guoping; Jiang, Kun; Liu, Qiang; Li, Jinhui; Sun, Rong; Lee, Shi-wei; Wong, C. P.
Conference paper

Fluxless Packaging of an Implantable Medical Device for Transcorneal Electrical Stimulation

Proceedings of the Electronic Packaging Technology Conference, EPTC, v. 2016-February, February 2016, article number 7412282
Le, Fuliang; Lo, Chi Chuen; Qiu, Xing; Lee, Shi-wei; Li, Xing; Tsui, Chi Ying; Ki, Wing Hung
Conference paper

Influence of Rubber Nanoparticles on the Properties of Novolac-diazonaphthoquinone Based Photoresist

16th International Conference on Electronic Packaging Technology, ICEPT 2015 / He, H., Bi, K., & Zhu, W. eds.. New York, NY, USA : IEEE, 2015, p. 1039-1042, Article no.: 7236757
Liu, Qiang; Zhang, Guoping; Sun, Rong; Lee, Shi-wei; Wong, Chingping
Conference paper

Investigation of the Influence of Ag Reflective Layer on the Correlated Color Temperature and the Angular Color Uniformity of LED with Conformal Phosphor Coating

16th International Conference on Electronic Packaging Technology, ICEPT 2015 / He, H., Bi, K., & Zhu., W eds. New York, NY, USA : IEEE, 2015, p. 830-834, Article no.: 7236709
Tian, Zhenhuan; Lo, Chi Chuen; Lee, Shi-wei; Yun, Feng; Sun, Rong
Conference paper

Investigation on the Thermal Degradation Mechanism of Cu-Sn Intermetallic Compound in SAC Solder Joints with Cohesive Zone Modeling

Proceedings - Electronic Components and Technology Conference, v. 2015-July, July 2015, article number 7159722, p. 1029-1037
Yang, Chaoran; Lee, Shi-wei
Conference paper

Modeling and Parametric Study of Light Scattering, Absorption and Emission of Phosphor in a White Light-Emitting Diode

International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2015, v. 2, 2015, article number V002T02A046
Wang, Jiaqi; Lo, Chi Chuen; Lee, Shi-wei; Yun, Feng; Tao, Mian
Conference paper

Simulation and Optimization on Thermal Performance of LED Filament Light Bulb

2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015 / IEEE. New York, NY, USA : IEEE, 2015, p. 88-92, Article no.: 7360696
Feng, Wilson; Feng, Bruce; Zhao, Fanny; Shieh, Brian; Lee, Shi-wei
Conference paper

Thermally Conductive Adhesives Based on Silver Coated Copper Flake Fillers

16th International Conference on Electronic Packaging Technology, ICEPT 2015 / He, H., Bi, K., & Zhu, W. eds. New York, NY, USA : IEEE, 2015, p. 294-296, Article no.: 7236595
Xie, Jinqi; Ren, Huming; Zhang, Kai; Yuen, Matthew Ming Fai; Lee, Shi-wei; Fu, Xianzhu; Sun, Rong; Wong, Chingping
Conference paper

Wafer Level Bumping Technology for High Voltage LED Packaging

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings / IEEE. New York, NY, USA : IEEE, 2015, p. 54-57, Article no. 7365183
Wei, Tiwei; Qiu, Xing; Lo, Chi Chuen; Lee, Shi-wei
Conference paper
2014 9

Comparison of ball pull strength among various Sn-Cu-Ni solder joints with different pad surface finishes

Journal of Electronic Packaging, Transactions of the ASME, v. 136, (1), March 2014, article number 011003
Yang, Chaoran; Song, Fubin; Lee, Shi-wei
Article

Electrical-thermal-luminous-chromatic model of phosphor-converted white light-emitting diodes

Applied Thermal Engineering, v. 63, (2), February 2014, p. 588-597
Ye, Huaiyu; Koh, Sau Wee; Yuan, Cadmus; van Zeijl, Henk; Gielen, Alexander W.J.; Lee, Shi-wei; Zhang, Guoqi
Article

Impact of Ni Concentration on the Intermetallic Compound Formation and Brittle Fracture Strength of Sn-Cu-Ni (SCN) Lead-free Solder Joints

Microelectronics Reliability, v.`54, (2), February 2014, p. 435-446
Yang, Chaoran; Song, Fubin; Lee, Shi-wei
Article

废旧BGA器件二次利用的焊接强度研究

电子元件与材料=Electronic Components & Materials, v. 33, (12), December 2014, p. 94-97
张旻澍; 谢安; 卢智铨; 李世玮
Article

Development of a real-time monitoring system with uni-photodetector for LED long term reliability tests

Proceedings: 2014 15th International Conference on Electronic Packaging Technology (ICEPT 2014), August 2014, article number 6922933, p. 1477-1481
Zhang, Grace G.; Lu, Sophie L.Y.; Yang, Nick G.M.; Zou, Sam H.Y.; Zhong, Steven D.L.; Lo, Chi Chuen; Lee, Ricky Shi Wei
Conference paper

Lens forming by stack dispensing for LED wafer level packaging

2014 International Conference on Electronics Packaging, ICEP 2014 / IEEE. Piscataway, NJ : IEEE, 2014, p. 670-675, Article number 6826763
Zhang, Rong; Lee, Ricky Shi Wei; Lo, Chi Chuen
Conference paper

Multilayer Dispensing of Remote Phosphor for LED Wafer Level Packaging with Pre-formed Silicone Lens

Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, 2014, article number 6962713
Lo, Chi Chuen Jeffrey; Lee, Ricky Shi Wei; Guo, Xungao; Zhao, Huishan
Conference paper

O2 plasma treatment in polymer insulation process for through silicon vias

Proceedings of the Electronic Packaging Technology Conference, EPTC, October 2014, article number 6922644, p. 235-238
Zhuang, Lulu; Jiang, Kun; Zhang, Guoping; Tang, Jiaoning; Sun, Rong; Lee, Ricky Shi Wei
Conference paper

Through Silicon Underfill Dispensing for 3D Die/Interposer Stacking

Proceedings - Electronic Components and Technology Conference, September 2014, article number 6897397, p. 919-924
Le, Fuliang; Lee, Ricky Shi-wei; Lau, Kei May; Yue, Chik Patrick; Sin, Johnny Kin On; Mok, Philip Kwok Tai; Ki, Wing Hung; Choi, Hoi Wai
Conference paper
2013 13

電子材料界面裂紋的新型濕氣壓力模型

電子元件與材料=Electronic Components & Materials, (2), 2013, p. 62-65
張旻澍; 李世瑋; 盧智銓
Article

Assessment of solder pad cratering strength using cold pin pull test method with pre-fabricated pin arrays

Proceedings - 2013 IEEE 63rd Electronic Components Conference, May 2013, article number 6575818, p. 1788-1793
Zhang, Qiming; Yang, Chaoran; Tao, Mian; Song, Fubin; Lee, Shi Wei Ricky
Conference paper

Brittle Fracture of Intermetallic Compounds in SAC Solder Joints under High Speed Ball Pull/Pin Pull and Charpy Impact Tests

2013 IEEE 63rd Electronic Components and Technology Conference (ECTC 2013), Institute of Electrical and Electronics Engineers (IEEE), 2013, p. 1294-1299
Yang, Chaoran; Xu, Guangsui; Lee, Ricky Shi-wei; Zhang, Xinping
Conference paper

Design and Implementation of Fine Pitch COB LED Display

2013 10th China International Forum on Solid State Lighting, ChinaSSL 2013, 2013, article number 7177325, p. 108-111
Yang, Nick G.M.; Jin, Gavin S.G.; Niu, Mike D.Y.; Gao, Andy G.X.; Lee, S. W. Ricky
Conference paper

Experimental Characterization of Adhesion Strength between the Silicone Encapsulant and the Bottom of a SMD LED Leadframe Cup

Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, 2013, article number 6756676, p. 1212-1216
Zou, Sam H.Y.; Tao, Mian; Lo, Chi Chuen; Lee, Shi-Wei Ricky
Conference paper

Investigation on the Properties and Processability of Polymeric Insulation Layers for Through Silicon Via

Proceedings - Electronic Components and Technology Conference, 2013, article number 6575554, p. 81-85
Zhao, Songfang; Zhang, Guoping; Peng, Chongnan; Sun, Rong; Lee, Ricky S W; Zhu, Wenhui; Lai, Fangqi
Conference paper

LED Wafer Level Packaging with a Heimisphrical Waffle Pack Remote Phosphor Layer


Liu, Huihua; Lo, Chi Chuen; Lee, Shi-Wei Ricky; Zhao, Huishan
Conference paper

Measurement and Analysis of Interfacial Adhesion Strength between the Silicone Encapsulant and the Side Wall of a SMD LED Leadframe Cup

Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, 2013, article number 6756544, p. 612-616
Zhong, Steven D.L.; Zou, Sam H.Y.; Lo, Chi Chuen; Lee, Shi-Wei Ricky
Conference paper

Optical Characterization of a Light Bulb with the Waffle Pack LED WLP Module

2013 10th China International Forum on Solid State Lighting, ChinaSSL 2013, 2013, article number 7177334, p. 142-146
Liu, Huihua; Lo, Jeffery C.C.; Lee, Shi Wei Ricky
Conference paper

Quasi-conformal Phosphor Dispensing on LED for White Light Illumination

2013 IEEE 63rd Electronic Components and Technology Conference (ECTC 2013), Institute of Electrical and Electronics Engineers (IEEE), 2013, p. 563-567
Lee, Shi Wei Ricky; Guo, Xungao; Niu, Daoyuan; Lo, Chi Chuen
Conference paper

Remote Phosphor Deposition on LED Arrays with Pre-encapsulated Silicone Lens

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013), Institute of Electrical and Electronics Engineers (IEEE), 2013
Lo, Chi Chuen; Liu, Huihua; Lee, Shi Wei Ricky; Gu, Xungao; Zhao, Huishan
Conference paper

Thermal Characterization of a Printed Circuit Board with Thermal Vias for The Application of High Brightness Light-emitting Diodes

China International Forum on Solid State Lighting, ChinaSSL, v. 2013, 2013, article number 7177331, p. 128-131
Tao, Mian; Feng, Zicheng; Swanson, John; Ganjei, John; Lo, Chi Chuen; Lee, Shi Wei Ricky
Conference paper

Wetting Behavior of Polymer Liquid in Insulation Process for through Silicon via

2013 14th International Conference on Electronic Packaging Technology (ICEPT 2013), Institute of Electrical and Electronics Engineers (IEEE), 2013, p. 360-363
Zhao, S.; Zhang, G.; Sun, R.; Lee, S.W.R.
Conference paper
2012 22

Design and Fabrication of a Silicon Interposer With TSVs in Cavities for Three-Dimensional IC Packaging

IEEE Transactions on Device and Materials Reliability, v. 12, (2), June 2012, article number 6168823, p. 189-193
Zhang, Rong; Lo, Chi Chuen; Lee, Shi-wei
Article

Emerging trend for LED wafer level packaging

Frontiers of Optoelectronics, v. 5, (2), June 2012, p. 119-126
Lee, Shi-wei; Zhang, Rong; Chen, Kewei; Lo, Chi Chuen
Article

Moldless encapsulation for LED wafer level packaging using integrated DRIE trenches

Microelectronics Reliability, v. 52, (5), May 2012, p. 922-932
Zhang, Rong; Lee, Shi-wei
Article

Reliability of high-power LED packaging and assembly

Microelectronics Reliability, 52, (5), May 2012, p. 761-761
Liu, Cheng-Yi; Lee, Shi-wei; Shin, Moo Whan; Lai, Yi-Shao
Article

電子塑封材料的高溫界面強度研究

电子元件与材料=Electronic Components & Materials, v. 31, (7), 2012, p. 67-69
張旻澍; 謝安; 李世瑋; 盧智銓
Article

绿色电子封装技术与材料

绿色微纳电子学 /王阳元 编. 北京: 科学出版社, 2010, p. 223-306
李世玮; 程玉华; 宋复斌; Lo, Chi Chuen
Book chapter

Assessment of Non-uniform Temperature Effect on BGA De-component Process

2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, p. 977-980
Tang, Kun; Song, Fubin; Lee, Ricky Shi Wei; Lo, Chi Chuen
Conference paper

Comparative Study on Dendrite Formation on Solder Pads with ImAg and OSP Surface Finishes Using Water Drop Test Method

12th International Conference on Electronics Packaging (ICEP), Tokyo, Japan, April 17-20 2012, p. 274-279
Tang, Kun; Song, Fubin; Lee, Shi-Wei Ricky
Conference paper

COMPARISON OF FATIGUE CRACK INITIATION/PROPAGATION AND DAISY-CHAIN RESISTANCE IN LEAD-FREE SOLDER JOINTS UNDER TEMPERATURE CYCLING TEST

PROCEEDINGS OF THE ASME PACIFIC RIM TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC SYSTEMS, MEMS AND NEMS 2011, VOL 1, 2012, p. 579-583
Chan, Yuen Sing; Song, Fubin; Lee, Shi Wei Ricky; Yang, Chaoran; Lo, Chi Chuen
Conference paper

Determination of Driving Current of RGB LEDs for White Light Illumination

2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, p. 1540-1545
Zhao, Huishan; Lee, Ricky Shi Wei
Conference paper

Development of innovative cold pin pull test method for solder pad crater evaluation


Zhang, Qiming; Yang, Chaoran; Tao, Mian; Song, Fubin; Lee, Ricky Shi Wei
Conference paper

Different Morphologies of Nano-ZnO Affection on Properties of Transparent Epoxy Resin Encapsulants

14th International Conference on Electronic Materials and Packaging, EMAP 2012, 2012, sesion P048, article number 6507893
Peng, Chongnan; Zhang, Guoping; Sun, Rong; Lee, Ricky
Conference paper

Effect of Die Attach Adhesive Defects on the Junction Temperature Uniformity of LED Chips

35th International Electronics Manufacturing Technology (IEMT) Conference, Ipoh, Malaysia, 6-8 November 2012, session number P141
Tao, Mian; Lee, Shi-Wei Ricky; Yuen, Mathew M.F.; Zhang, Guoqi; Driel, W. van
Conference paper

Effects of GaN Blue LED Chip and Phosphor on Optical Performance of White Light LED

2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012, Kyoto, Japan, 10-12 Dec 2012, session P11-3, article number 6523414
Zhao, Huishan; Chen, Changying; Lee, Shi-Wei Ricky
Conference paper

Fast Copper Plating Process for Through Silicon Via (TSV) Filling

ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011, v. 11, 2011, p. 855-863
Wang, Su; Lee, Shi-wei Ricky
Conference paper

Investigation of fracture behaviors of Cu-Sn intermetallics using impact test

2012 2nd IEEE CPMT Symposium Japan, ICSJ, Kyoto, Japan, 10-12 Dec 2012, session P11-4, article number 6523420
Yang, Chaoran; Lee, Ricky Shi-wei
Conference paper

Investigation on Mechanical Properties and Bonding Parameters of Copper Wire Bonding

12th International Conference on Electronics Packaging (ICEP), Tokyo, Japan, 17-20 April 2012, p. 654-660
Cao, Jun; Ding, Yutian; Lee, Shi-Wei Ricky
Conference paper

LED wafer level packaging with a remote phosphor cap

14th International Conference on Electronic Materials and Packaging, EMAP 2012, 2012, session P068, article number 6507885
Liu, Huihua; Zhang, Rong; Lo, Chi Chuen; Lee, Shi-Wei Ricky
Conference paper

Reverse wire bonding and phosphor printing for LED wafer level packaging

Proceedings - Electronic Components Conference, 2012, p. 1814-1818
Lo, Chi Chuen; Lee, Shi-Wei Ricky; Zhang, Rong; Li, Mei
Conference paper

TSV Plating Using Copper Methanesulfonate Electrolyte with Single Component Suppressor

4th IEEE Electronics System-integration Technology Conference (ESTC), Amsterdam, Netherlands, 17-20 September, p. 1-5
Wu, Hailong; Lee, Shi-Wei Ricky
Conference paper

Ultrasonic Inspection of Package Internal Defects Considering Multiple Interface Effects

14th International Conference on Electronic Materials and Packaging, EMAP 2012, 2012, session P061, article number 6507881
Zhang, Minshu; Lo, Chi Chuen; Lee, Shi-Wei Ricky
Conference paper

Underfill dispensing for 3D die stacking with through silicon vias

Proceedings - 2012 45th International Symposium on Microelectronics, IMAPS 2012, San Diego, California, USA, 2012, p. 548-553
Le, Fuliang; Lee, Ricky Shi-wei; Wu, Jingshen; Yuen, Matthew Ming Fai
Conference paper
2011 18

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

Journal of Electronic Packaging, Transactions of ASME, v. 133, (3), September 2011, article number 031010
Lau, John H.; Zhang, M. S.; Lee, Shi-wei
Article

Investigation on Copper Diffusion Depth in Copper Wire Bonding

Microelectronics Reliability, v. 51, (1), January 2011, p. 166-170
Chen, Catherine H.; Zhang, Shawn X.; Lee, Shi-wei; Mohamed, Lebbai
Article

Spacing optimization of high power LED arrays for solid state lighting

Journal of Semiconductors, v. 32, (1), January 2011, article number 014005
Chan, Yuen Sing; Lee, Shi-wei
Article

Shock test methods and test standards for portable electronic devices

Structural Dynamics of Electronic and Photonic Systems / Edited by Ephraim Suhir, David S. Steinberg, T. X. Yu. Hoboken, New Jersey : John Wiley & Sons, Inc., 2011, p. 159-173, Ch. 7
Zhou, C.Y.; Yu, Tongxi; Lee, Shi-wei; Suhir, Ephraim
Book chapter

Technologies and Materials for Green IC Packaging

Green Micro/Nano Electronics / Wang, Yangyuan, Cheng, Yuhua, Chi, Minhwa. Berlin: Springer, p. 248-359
Lee, Ricky Shi Wei; Cheng, Y.; Song, F.; Lo, Irene M C
Book chapter

A comparison of copper sulfate and methanesulfonate electrolytes in the copper plating process for through silicon via metallization

Advanced Packaging Materials, International Symposium on, 2011, p. 291-296
Wu, H.L.H.; Lee, Ricky Shi Wei
Conference paper

Advanced LED wafer level packaging technologies

Proceedings of technical papers, 2011, p. 71-74
Lee, Shi-Wei Ricky
Conference paper

Characterization and Comparison between the SnCuNi IMC in SnCu Solder with ENIG Pad Finish and in SnCuNi Solder with OSP Pad Finish

2011 International Conference on Electronic Materials and Packaging (EMAP), Kyoto, Japan, 2011
Yang, Chaoran; Song, Fubin; Lee, Ricky Shi-wei
Conference paper

Computational parametric study on the strain hardening effect of lead-free solder joints in board level mechanical drop tests

EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings, 2011
Jiang, Tong; Xu, Zhengjian; Lee, Shi Wei Ricky; Song, Fubin; Lo, Chi Chuen; Yang, Chaoran
Conference paper

Considerations in solution stabilization for thermal fatigue modeling of lead-free solder joints

Proceedings - Electronic Components Conference, 2011, p. 1070-1078
Chan, Y.S.; Lee, Ricky Shi Wei
Conference paper

Effect of interfacial strength between Cu6Sn5 and Cu3Sn intermetallics on the brittle fracture failure of lead-free solder joints with OSP pad finish

Proceedings - Electronic Components Conference, 2011, p. 971-978
Yang, C.; Song, F.; Lee, Ricky Shi Wei
Conference paper

Enhancement of thermal conductivity of die attach adhesives (DAAs) using nanomaterials for high brightness light-emitting diode (HBLED)

Proceedings - Electronic Components Conference, 2011, p. 667-672
Lu, D.; Liu, C.; Lang, X.; Wang, B.; Li, Z.; Lee, W.M.P.; Lee, Ricky Shi Wei
Conference paper

Evaluation of polymer wafer bonding with silicone adhesive and patterned trenches

2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 2011
Lo, Chi Chuen; Zhang, R.; Lee, Ricky Shi Wei; Wang, Z.
Conference paper

Investigation on lead-free solder joint reliability of edge-bonded CBGA under temperature cycling

ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging, 2011, p. 500-505, Article number6066885
Chan, Y.S.; Song, F.; Lee, Ricky Shi Wei
Conference paper

LED packaging using silicon substrate with cavities for phosphor printing and copper-filled TSVs for 3D interconnection

Proceedings - 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), June 2011, article number 5898727, p. 1616-1621
Zhang, Rong; Lee, Shi-wei; Xiao, David Guowei; Chen, Haiying
Conference paper

Mechanical shock test performance of SAC105 (Sn-1.0Ag-0.5Cu) and Sn-3.5Ag, BGA components with SAC305 solder paste on NiAu and OSP board surface finishes

IPC APEX EXPO Technical Conference 2011, v. 4, 2011, p. 3014-3077
Bath, Jasbir; Eagar, Wade; Bigcraft, Chad; Newman, Keith; Hu, Livia; Henshall, Gregory; Nguyen, Jennefier; Lee, M.J.; Syed, Ahmer; Xie, Weidong; Song, Fubin; Lee, Ricky
Conference paper

Nondestructive inspection of through silicon via depth using scanning acoustic microscopy

International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings, January 2011, article number 5699482
Zhang, Minshu; Lee, Shi-wei; Wu, Hailong; Zhang, Rong
Conference paper

Study on copper plating solutions for fast filling of through silicon via (TSV) in 3D electronic packaging

Proceedings of technical papers, 2011, p. 343-346
Wu, H. L. Henry; Lee, Ricky Shi Wei
Conference paper
2010 20

3D IC Integration with TSV Interposers for High Performance Applications

Chip scale review, v. 14, (5), September 2010, p. 26-29
Lau, John H.; Chan, Y. S.; Lee, Shi-wei
Article

3D LED and IC wafer level packaging

Microelectronics International, v. 27, (2), May 2010, p. 98-105
Lau, John; Lee, Shi-wei; Yuen, Ming Fai; Chan, Philip Ching Ho
Article

Fundamental Characteristics of Moisture Transport, Diffusion, and the Moisture-induced Damages in Polymeric Materials in Electronic Packaging

Moisture Sensitivity of Plastic Packages of IC Devices / Edited by X.J. Fan, E. Suhir. New York: Springer, c2010, chapter 1, p. 1-28
Fan, X.J.; Lee, S.W.R.
Book chapter

Hygrothermal Delamination Analysis of Quad Flat No-Lead (QFN) Packages

Moisture Sensitivity of Plastic Packages of IC Devices / Edited by X.J. Fan, E. Suhir. New York: Springer, c2010, chapter 15, p. 389-409
Zhang, M.S.; Lee, S.W.R.; Fan, X.J.
Book chapter

Nano-scale and Atomistic-scale Modeling of Advanced Materials

Nano-bio-electronic, Photonic and MEMS Packaging / Edited by C.P. Wong, Kyoung-Sik (Jack) Moon, Yi Li. New York: Springer, c2010, p. 719-758
Dai, Ruo Li; Liao, Wei-Hsin; Lin, Chun-Te; Chiang, Kuo-Ning; Lee, Shi-Wei Ricky
Book chapter

A novel vapor pressure transfusion model for the popcorning analysis of Quad Flat No-lead (QFN) packages

Electronics System Integration Technology Conference, ESTC 2010 - Proceedings, 2010
Zhang, Minshu; Lee, Ricky Shi Wei
Conference paper

ASSESSMENT OF RELATIVE THERMAL FATIGUE LIFE OF SAC LEAD-FREE AND TIN-LEAD SOLDERS WITH CUSTOM-MADE BGA ASSEMBLIES CREATING VARIOUS STRESS RANGES

IPACK 2009: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2009, VOL 1, 2010, p. 803-807
Chan, Y.S.; Yang, C.; Lee, S. W. Ricky
Conference paper

Comparative study of PWB pad cratering subject to reflow soldering and thermal impact

Proceedings - Electronic Components and Technology Conference, 2010, p. 464-470
Yang, Chaoran; Song, Fubin; Lee, Ricky Shi Wei; Newman, K.
Conference paper

Detailed investigation on the creep damage accumulation of lead-free solder joints under accelerated temperature cycling

2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010, 2010
Chan, Y.S.; Lee, Ricky Shi Wei
Conference paper

Effects of corner and edgebond epoxy adhesives on board level solder joint reliability of BGA mezzanine connectors

Proceedings - Electronic Components and Technology Conference, 2010, p. 926-934
Song, F.; Yang, C.; Henry Wu, H.L.; Lo, Chi Chuen; Ricky Lee, S.W.; Newman, K.
Conference paper

Embedded 3D hybrid IC integration System-in-Package (SiP) for opto-electronic interconnects in organic substrates

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION 2010, v. 4, 2010, p. 129-136
Lau, John H.; Zhang, Minshu; Lee, Shi-wei
Conference paper

Integration of phosphor printing and encapsulant dispensing processes for wafer level LED array packaging

Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010 / IEEE. Piscataway, NJ : IEEE, 2010, p. 1386-1392, Article number 5582822
Chen, Kewei; Zhang, Rong; Lee, Ricky Shi-wei
Conference paper

Modeling of board level solder joint reliability under mechanical drop test with the consideration of plastic strain hardening of lead-free solder

2010 IEEE CPMT Symposium Japan, ICSJ10, 2010
Xu, Z.J.; Jiang, Tong; Song, Fubin; Lo, Jeffery; Lee, Ricky Shi Wei
Conference paper

Nanoindentation characterization of lead-free solders and intermetallic compounds under thermal aging

43rd International Symposium on Microelectronics 2010, IMAPS 2010, 2010, p. 314-318
Jiang, T.; Song, Fubin; Yang, Cheng; Ricky Lee, S.W.
Conference paper

Novel sequential electro-chemical and thermo-mechanical simulation methodology for annular through-silicon-via (TSV) design

Proceedings - Electronic Components and Technology Conference, 2010, p. 1166-1172
Xie, B.; Shi, X.Q.; Chung, C.H.; Lee, Ricky Shi Wei
Conference paper

Predictive Modeling and Experimental Validation of Lead-Free Solder Joint Reliability under Temperature Cycling

2010 PROGNOSTICS AND SYSTEM HEALTH MANAGEMENT CONFERENCE, 2010, p. 585-592
Chan, Y.S.; Song, F.; Lo, C. C. Jeffery; Lee, Eddie; Lee, S. W. Ricky
Conference paper

Silicon Interposer with Cavities and Copper-filled TSVs for 3D Packaging


Zhang, Rong; Lee, Ricky Shi-wei
Conference paper

Solid State Backlight Unit with Lateral-Emitting LEDs and a Light Distributing Plate


Lee, Ricky Shi-wei; Lo, Chi Chuen; Zhang, Rong
Conference paper

Solid state light tube with periodic units of lateral-emitting LEDs

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), June 2010, article number 5490788, p. 673-678
Lee, Ricky Shi-wei; Zhang, Rong; Leung, Wai Lok Wesley
Conference paper

Thermal-enhanced and cost-effective 3D IC integration with TSV (Through-Silicon Via) interposers for high-performance applications

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE), v. 4, 2010, p. 137-144
Lau, John Hon Shing; Chan, Yuen Sing; Lee, Shi-wei
Conference paper
2009 17

Critical Review of the Engelmaier Model for Solder Joint Creep Fatigue Reliability

IEEE Transactions on Components and Packaging Technologies, v. 32, (3), September 2009, p. 693-700
Chauhan, Preeti; Osterman, Michael; Lee, S. W. Ricky; Pecht, Michael
Article

Experimental investigations and model study of moisture behaviors in polymeric materials

Microelectronics Reliability, v. 49, (8), August 2009, p. 861-871
Fan, X.J.; Lee, Ricky Shi Wei; Han, Q.
Article

Micro thermoelectric cooler: Planar multistage

International Journal of Heat and Mass Transfer, v. 52, (7-8), March 2009, p. 1843-1852
Hwang, Gisuk; Gross, Andrew J.; Kim, Hanseup; Lee, S. W.; Ghafouri, Niloufar; Huang, Baoling; Lawrence, Christin; Uher, Ctirad; Najafi, Khalil; Kaviany, Massound
Article

Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages

IEEE Transactions on Components and Packaging Technologies, v. 32, (4), December 2009, p. 901-908
Nie, Lei; Osterman, Michael; Song, Fubin; Lo, Jeffery; Lee, S. W. Ricky; Pecht, Michael
Article

Comparison of thermal fatigue reliability of SnPb and SAC solders under various stress range conditions

2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009, 2009, p. 1119-1123
Yang, C.; Chan, Yuen Sing; Lee, Ricky Shi Wei; Ye, Y.; Liu, S.
Conference paper

Comparison of Thermal Fatigue Reliability of SnPb and SAC Solders under Various Stress Range Conditions

2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009), 2009, p. 1038-1042
Yang, Chaoran; Chan, Yuen Sing; Lee, S. W. Ricky; Ye, Yuming; Liu, Sang
Conference paper

Correlation between Material Selection and Moisture Sensitivity Levels of Quad Flat No-lead (QFN) Packages

2009 EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE (EMPC 2009), VOLS 1 AND 2, 2009, p. 563-568
Zhang, Minshu; Lee, S. W. Ricky; Zhang, Jack; Yun, Howard; Starkey, Dale; Chau, Hung
Conference paper

Determination of Optimal Component Spacing in a High Power Light Emitting Diode Array Assembly for Solid State Lighting

42nd International Symposium on Microelectronics (IMAPS), San Jose, CA,USA, 1-5 November, pp. 937-944
Chan, Yuan Sing; Lee, Shi-Wei Ricky
Conference paper

Development of surface mount compatible reel-to-reel assembly process of LED arrays for wide area general lighting

2008 International Conference on Electronic Materials and Packaging (EMAP 2008) / IEEE. Piscataway, NJ : IEEE, 2009, p. 255-258, Article number 4784277
Lee, Ricky Shi-wei; Tong, Yiu Wai; Chan, Yuen Sing; Lo, Chi Chuen; Zhang, Rong
Conference paper

Effect of UBM and BCB layers on the thermo-mechanical reliability of Wafer Level Chip Scale Package (WLCSP)

Procceedings of 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference / IEEE. Taiwan : IEEE, 2009, p. 407-410
Chan, Yuen Sing; Lee, Shi-wei; Song, Fubin; Lo, Chi Chuen; Jiang, T.
Conference paper

Investigation of lead-free BGA solder joint reliability under 4-point bending using PWB strain-rate analysis

Proceedings of the Electronic Packaging Technology Conference, EPTC, 2009, p. 863-868
Song, Fubin; Newman, K.; Yang, C.; Lee, Ricky Shi Wei
Conference paper

Investigation of Mixed SAC and SnPb Solder Balls under High Speed Ball Shear and Pull Tests

EUROSIME 2009: THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS, 2009, p. 245-252
Song, Fubin; Jiang, Tong; Lo, Chi Chuen; Lee, Ricky Shi Wei; Newman, Keith
Conference paper

Investigation of the Relationship between Material Selections and Moisture Sensitivity Levels of Quad Flat No-lead (QFN) Packages

17th European Microelectronics and Packaging Conference and Exhibition (EMPC 2009), Palacongressi, Rimini (Italy), 14-17 Jun 2009
Zhang, Minshu; Lee, Ricky S W
Conference paper

Material characterization of corner and edgebond epoxy adhesives for the improvement of board-level solder joint reliability

Proceedings - Electronic Components and Technology Conference, 2009, p. 125-133
Wu, H.L.H.; Song, F.; Lo, Chi Chuen; Jiang, T.; Newman, K.; Lee, S.W.R.
Conference paper

Process development and prototyping for the assembly of LED arrays on flexible printed circuit tape for general solid state lighting

2009 Proceedings of 59th Electronic Components and Technology Conference, June 2009, article number 5074321, p. 2137-2142
Lee, Ricky Shi-wei; Tong, Yiu Wai; Chan, Yuen Sing; Lo, Chi Chuen; Zhang, Rong
Conference paper

Stress analysis of hygrothermal delamination of Quad Flat No-lead (QFN) packages

ASME International Mechanical Engineering Congress and Exposition, Proceedings, v. 12, 2009, p. 339-347
Zhang, Minshu; Lee, Ricky Shi Wei; Fan, Xuejun
Conference paper

Surface analysis of outgassing contamination from edgebond epoxy adhesives on imag pads

Proceedings - Electronic Components and Technology Conference, 2009, p. 155-160
Wu, H.L.H.; Song, F.; Newman, K.; Lee, S.W.R.
Conference paper
2008 15

Correlation between measurement and simulation of thermal warpage in PBGA with consideration of molding compound residual strain

IEEE Transactions on Components and Packaging Technologies, v. 31, (3), September 2008, p. 683-690
Tsai, Ming-Yi; Chen, YuC; Lee, Shi Wei Ricky
Article

Drop/impact tests and analysis of typical portable electronic devices

International Journal of Mechanical Sciences, v. 50, (5), May 2008, p. 905-917
Zhou, C.Y.; Yu, T.X.; Lee, Ricky S.W.
Article

Eddy current induced heating for the solder reflow of area array packages

IEEE Transactions on Advanced Packaging, v. 31, (2), May 2008, p. 399-403
Li, Mingyu; Xu, Hongbo; Lee, Shi-Wei Ricky; Kim, Jongmyung; Kim, Daewon
Article

Gold Embrittlement of Solder Joints in Wafer-Level Chip-Scale Package on Printed Circuit Board With Ni/Au Surface Finish

IEEE Transactions on Electronics Packaging Manufacturing, v. 31, (3), July 2008, p. 185-191
Huang, Xingjia; Lee, Shi Wei Ricky; Li, Ming; Chen, William T.
Article

Reliability Study of Surface Mount Printed Circuit Board Assemblies with Lead-free Solder Joints

Soldering & Surface Mount Technology, v. 20, (2), April 2008, p. 30-38
Lo, Chi Chuen; Jia, B.F.; Liu, Zhe; Zhu, Jungao; Lee, Shi Wei Ricky
Article

A comprehensive parallel study on the board level reliability of SAC, SACX and SCN solders

Proceedings - Electronic Components and Technology Conference, 2008, p. 146-154
Song, Fubin; Lo, Chi Chuen; Lam, Jimmy K.S.; Jiang, Tong; Lee, Shi Wei Ricky
Conference paper

Design and fabrication of an epoxy flow stopper with convex corner compensation of V-grooves on a silicon optical bench for the passive alignment of optical fibers

Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC, 2008, p. 321-326
Lam, Jimmy K.S.; Lee, Shi Wei Ricky
Conference paper

Design and fabrication of MEMS based microphone module by using 3D chip-on-chip package

ASME International Mechanical Engineering Congress and Exposition, Proceedings, v. 5, 2008, p. 47-53
Lo, Chi Chuen; Lee, Shi Wei Ricky
Conference paper

Determination of solder bump stand-off height in a flip-chip sub-mount for Micro-Opto-Electro-Mechanical System (MOEMS) packaging applications

Proceedings - Electronic Components and Technology Conference, 2008, p. 1887-1892
Lo, Chi Chuen; Lee, Shi Wei Ricky; Wu, Henry Hailong; Lam, Jimmy K.S.
Conference paper

Development of novel dicing process by anisotropic wet etching with convex corner compensation

10th Electronics Packaging Technology Conference, EPTC 2008, 2008, p. 161-166
Lam, Jimmy K.S.; Lee, Ricky Shi Wei
Conference paper

Fabrication of Nanoscale Vias by Offset Patterning

MicroNano2008-2nd International Conference on Integration and Commercialization of Micro and Nanosystems, Proceedings, 2008, p. 615-618
Lau, Chi Ho; Lee, Ricky Shi Wei
Conference paper

Investigation of Moisture Sensitivity Related Failure Mechanism of Quad Flat No-lead (QFN) Packages

Proc. ASME International Mechanical Engineering Congress & Exposition, Boston, MA, 31 October-6 November, IMECE2008/68120 (on CD-ROM)
Zhang, M.; Lee, Ricky Shi Wei
Conference paper

Numerical analysis and experimental validation for the prediction of flip chip solder joint standoff height in MEMS microphone application

IEEE 9th VLSI Packaging Workshop in Japan, VPWJ 2008, 2008, p. 45-48
Lo, Chi Chuen; Lee, Ricky Shi Wei
Conference paper

Wafer level encapsulation process for LED array packaging

2007 International Conference on Electronic Materials and Packaging / IEEE. Piscataway, NJ : IEEE, 2008, Article number 4510307
Zhang, Rong; Lee, Ricky Shi-wei
Conference paper

Wafer Level LED Packaging with Integrated DRIE Trenches for Encapsulation

Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008 / IEEE. Piscataway, NJ : IEEE, 2008, Article number 4607038
Zhang, Rong; Lee, Ricky Shi-wei
Conference paper
2007 22

Electro-elastic analysis of piezoelectric laminated plates

Advanced Composite Materials, v. 16, (1), January 2007, p. 63-81
Zhao, Ming-Hao; Qian, Caifu; Lee, Shi Wei Ricky; Tong, Pin; Suemasu, H.; Zhang, Tongyi
Article

Passive Alignment of Optical Fibers in V-grooves with Low Viscosity Epoxy Flow

Micro- and Opto-electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging / Vol. 2, Physical Design--Reliability and Packaging/ Edited by E. Suhir, Y.C. Lee, C.P. Wong. New York: Springer, c2007, chapter 6, p. 151-173
Lee, Shi-Wei Ricky; Lo, Chi Chuen
Book chapter

Brittle failure mechanism of SnAgCu and SnPb solder balls during high speed ball shear and cold ball pull tests

Proceedings - Electronic Components Conference, 2007, p. 364-372
Song, Fubin; Lee, S. W. Ricky; Newman, Keith; Sykes, Bob; Clark, Stephen
Conference paper

Characteristics of copper-to-silicon diffusion in copper wire bonding

Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT, 2007, p. 2-9
Zhang, Shawn X.; Lee, Shi Wei Ricky; Lau, A.K.M.; Tsang, Paul P.H.; Mohamed, Lebbai; Chan, C.Y.; Dirkzwager, Maarten
Conference paper

Characterization and comparison of five SAC-based solder pastes for pb-free reflow soldering

HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration, 2007, p. 10-17
Chen, Catherine H.; Wong, Wallace; Lo, Chi Chuen; Song, Fubin; Lee, Shi Wei Ricky
Conference paper

Characterization of Failure Modes and Analysis of Joint Strength Using Various Conditions for High Speed Solder Ball Shear and Cold Ball Pull Tests

Proc. 16th European Microelectronics & Packaging Conference (EMPC), Oulu, Finland, 17-20 June, pp. 213-218
Song, Fubin; Lee, Shi-Wei Ricky; Clark, Stephen; Sykes, Bob; Newman, Keith
Conference paper

Comparison of joint strength and fracture energy of lead-free solder balls in high speed ball shear/pull tests and their correlation with board level drop test

Proceedings of the Electronic Packaging Technology Conference, EPTC, 2007, p. 450-458
Song, F.; Ricky Lee, S.W.; Newman, K.; Clark, S.; Sykes, B.
Conference paper

Design and fabrication of MEMS based microphone module by using 3D chip-on-chip package

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE), v. 5, 2007, p. 47-54
Lo, Chi Chuen; Lee, Shi Wei Ricky
Conference paper

Design of experiment (DoE) study on effects of various geometric parameters on copper diffusion in through silicon vias (TSVs)

ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, p. 32-37
Zhang, Shawn X.; Lee, S. W. Ricky
Conference paper

Development of 2D modeling techniques for the thermal fatigue analysis of solder joints of a module mounted in a 3D cavity on a printed circuit board

EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings, 2007, p. 713-718
Chan, Yuen Sing; Lee, Shi Wei Ricky; Ye, Yuming; Liu, Sang
Conference paper

Drop impact of a typical portable electronic device - experiments and modeling

Proceedings of the 7th International Conference on Shock and Impact Loads on Structures, 2007, p. 61-70
Yu, Tongxi; Zhou, C.Y.; Lee, Ricky S.W.
Conference paper

Effect of thermal aging on high speed ball shear and pull tests of SnAgCu lead-free solder balls

Proceedings of the Electronic Packaging Technology Conference, EPTC, 2007, p. 463-470
Song, F.; Ricky Lee, S.W.; Newman, K.; Reynolds, H.; Clark, S.; Sykes, B.
Conference paper

Effect of V-groove side wall feature on epoxy flow in passive alignment of optical fiber

6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Proceedings 2007, 2007, p. 202-208
Lam, K. S. Jimmy; Lee, S. W. Ricky
Conference paper

Effects of aging and underfills on mechanical-drop tests of SnAgCu PBGA (plastic ball grid array) packages on ImAg PCB (printed circuit board)

Proc. 9th International Conference on Electronic Materials and Packaging (EMAP), Daejon, Korea, 19-22 November, EMAP2007-P013
Lau, John H.; Lo, Chi Chuen; Lam, Jimmy K.S.; Soon, E.L.; Chow, W.S.; Lee, Shi-Wei Ricky
Conference paper

Effects of barrier layer on copper-to-silicon diffusion and intermetallic compound formation in copper wire bonding

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, v. 2007, 2007, p. 39
Zhang, Shawn; Chen, Catherine; Lee, Ricky; Lau, A.K.M.; Tsang, P.P.H.; Mohamed, L.; Chan, C.Y.; Dirkzwager, M.
Conference paper

Effects of tooling tip wear and fixture rigidity on solder ball shear and ball pull tests

IPACK 2007: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2007, VOL 2, 2007, p. 889-894
Song, Fubin; Lee, S. W. Ricky
Conference paper

Effects of underfills on the thermal-cycling tests of SnAgCu PBGA (Plastic Ball Grid Array) packages on ImAg PCB (Printed Circuit Board)

Proceedings of the Electronic Packaging Technology Conference, EPTC, 2007, p. 785-790
Lau, J.; Lo, Chi Chuen; Lam, J.; Soon, E.L.; Chow, W.S.; Lee, R.
Conference paper

High-speed solder ball shear and pull tests vs. board level mechanical drop tests: Correlation of failure mode and loading speed

Proceedings - Electronic Components and Technology Conference, 2007, p. 1504-1513
Song, Fubin; Lee, Shi Wei Ricky; Newman, Keith; Sykes, Bob; Clark, Stephen
Conference paper

Multi-stacked flip chips with copper plated through silicon vias and re-distribution for 3D system-in-package integration

Materials Research Society Symposium Proceedings, v. 970, 2007, p. 179-190
Lee, Shi-Wei Ricky; Hon, Ronald
Conference paper

Reliability assessment on the re-balling of PBGA from SnPb to Pb-free solder spheres

ESTC 2006 - 1st Electronics Systemintegration Technology Conference, v. 1, 2007, p. 474-480
Song, F.; Ricky Lee, S.W.
Conference paper

Screen-printing of yellow phosphor powder on blue Light Emitting Diode (LED) arrays for white light illumination

2007 Proceedings of the ASME InterPack Conference, IPACK 2007, v. 1, 2007, p. 19-24
Lee, Ka Ho; Lee, Shi Wei Ricky
Conference paper

Wetting characteristics of solder reflow on copper traces without solder mask

ESTC 2006 - 1st Electronics Systemintegration Technology Conference, v. 1, 2007, p. 438-443
Lo, Chi Chuen; Lee, Shi Wei Ricky; Lam, Jimmy K.S.; Wong, Wallace K.H.
Conference paper
2006 26

A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on UBM related intermetallic compound growth properties

IEEE Transactions on Components and Packaging Technologies, v. 29, (1), March 2006, p. 164-172
Gong, JF; Chan, PCH; Xiao, GW; Lee, RSW; Yuen, MMF
Article

便携式电子产品的跌落冲击响应试验,仿真和理论

力学进展=Advances in Mechanics, v. 36, (2), May 2006, p. 239-246
周春燕; 余同希; 李世瑋
Article

Characterization of intermetallic compound formation and copper diffusion of copper wire bonding

Proceedings - Electronic Components and Technology Conference, v. 2006, 2006, p. 1821-1826
Zhang, S.; Chen, C.; Lee, R.; Lau, A.K.M.; Tsang, P.P.H.; Mohamed, L.; Chan, C.Y.; Dirkzwager, M.
Conference paper

Comparison between experimental measurement and numerical analysis of warpage in PBGA package and assembly with the consideration of residual strain in the molding compound

2006 International Conference on Electronic Materials and Packaging, EMAP, 2006
Tsai, Ming Yi; Chen, Yung Cheng; Lee, Shi Wei Ricky
Conference paper

Corrosion of Sn-Ag-Cu lead-free solders and the corresponding effects on board level solder joint reliability

Proceedings - Electronic Components and Technology Conference, v. 2006, 2006, p. 891-898
Song, Fubin; Lee, Shi Wei Ricky
Conference paper

Design of shock table tests to mimic real-life drop conditions for portable electronic device

2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, (EMAP2006) Hong Kong, 11-14 December, 2006., v. 1-3, p. 674-678
Zhou, C.Y.; Yu, T.X.; Lee, Ricky S.W.
Conference paper

Design, process development and prototyping of 3D packaging with multi-stacked flip chips and peripheral through silicon via interconnection

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, 2006, p. 80-85
Hon, Ronald; Lee, Shi Wei Ricky
Conference paper

Development and prototyping of a HB-LED array module for indoor solid state lighting

2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06), Proceedings, 2006, p. 192-196
Lee, S. W. Ricky; Lau, C.H.; Chan, S.P.; Ma, K.Y.; Ng, M.H.; Ng, Y.W.; Lee, K.H.; Lo, Jeffery C.C.
Conference paper

Development and prototyping of a HB-LED array module for indoor solid state lighting

2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06, 2006, p. 141-145
Lee, Shi Wei Ricky; Lau, C.H.; Chan, Siu Ping; Ma, K.Y.; Ng, M.H.; Ng, Y.W.; Lee, K.H.; Lo, Chi Chuen
Conference paper

Drop impact of a typical portable electronic device

WIT Transactions on the Built Environment, v. 87, 2006, p. 505-514
Zhou, C.Y.; Yu, T.X.; Lee, R.S.W.
Conference paper

Drop impact of typical portable electronic product device

The 9th Int. Conf. on Structures Under Shock & Impact (SUSI 2006), New Forest, UK,, 3-5 July, 2006.
Zhou, C.Y.; Yu, Tongxi; Lee, R.S.W.
Conference paper

Effect of high temperature storage on reliability of Sn-Ag-Cu flip chip solder bumps

International Conference on Electronic Materials and Packaging, EMAP, v. 2006, December 2006, article number 4430604
Huang, Xingjia; Lee, Shi Wei Ricky; Li, Ming; Chen, William T.
Conference paper

Effect of Microstructure on Thermal and Mechanical Properties of PBGA Substrates

Proc. 8th International Conference on Electronic Materials and Packaging (EMAP), Kowloon, Hong Kong, 11-14 December, pp. 533-539
Tang, G.C.W.; Shing, J.W.K.; Chen, Haibin; Lee, Shi-Wei Ricky; Wu, Jingshen; McLellan, Neli
Conference paper

Effect of solder mask thickness on shear and pull tests of lead-free solder balls

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, 2006
Song, Fubin; Lee, Shi Wei Ricky
Conference paper

Effects of Al pad deformation and TiW barrier layer on copper-to-silicon diffusion and intermetallic compound formation in copper wire bonding

IEEE CPMT: International Symposium and Exhibition on Advanced Packaging Materials: Processes, Properties and Interfaces, 2006, p. 189-195
Zhang, Shawn; Chen, Catherine; Lee, Ricky; Lau, Angie K.M.; Tsang, Paul P.H.; Mohamed, Lebbai; Chan, C.Y.; Dirkzwager, M.
Conference paper

Effects of microstructure on thermal and mechanical properties of PBGA substrates

2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3, 2006, p. 830-836
Tang, George Cw; Shing, Jacqueline Wk; Chen, Haibin; Lee, Ricky; Wu, Jingshen
Conference paper

Experimental testing and failure prediction of PBGA package assemblies under 3-point bending condition through computational stress analysis

ICEPT: 2006 7th International Conference on Electronics Packaging Technology, Proceedings, 2006, p. 866-872
Lau, Dennis; Chan, Y.S.; Lee, Shi Wei Ricky; Fu, Lifeng; Ye, Yuming; Liu, Sang
Conference paper

Experimental testing and failure prediction of PBGA package assemblies under 3-point bending condition through computational stress analysis

ICEPT: 2006 7th International Conference on Electronics Packaging Technology, Proceedings, 2006, p. 687-693
Lau, Dennis; Chan, Y.S.; Lee, S. W. Ricky; Fu, Lifeng; Ye, Yuming; Liu, Sang
Conference paper

Fracture analysis on popcorning of plastic packages during solder reflow

Fracture of Nano and Engineering Materials and Structures: Proceedings of the 16th European Conference of Fracture, Alexandroupolis, Greece, July 3-7, 2006 / Edited by E. E. Gdoutos. The Netherlands : Springer, 2006, p. 749-750
Lee, Shi-Wei Ricky; Lau, Dennis Chung Yin
Conference paper

Impact of IMC thickness on lead-free solder joint reliability under thermal aging: Ball shear tests vs. cold bump pull tests

2006 International Microsystems, Packaging, Assembly Conference Taiwan (IMPACT), Proceedings, 2006, p. 109-112
Lee, Shi Wei Ricky; Song, Fubin
Conference paper

Investigation of IMC thickness effect on the lead-free solder ball attachment strength: Comparison between ball shear test and cold bump pull test results

Proceedings - Electronic Components and Technology Conference, v. 2006, 2006, p. 1196-1203
Song, Fubin; Lee, Shi Wei Ricky
Conference paper

Investigation of the effect of PCB base materials and pad surface finish on the thermal fatigue life of lead-free solder joints of PBGA and passive resistors

2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3, 2006, p. 166-172
Song, Fubin; Lee, Shi Wei Ricky; Osterman, Michael; Pecht, Michael
Conference paper

Isothermal fatigue tests of plastic ball grid array (PBGA) SnAgCu lead-free solder joints at 60°C

Electronic Components and Technology Conference, v. 2006, May 2006, article number 1645851, p. 1476-1483
Lau, John; Lee, Shi-wei; Song, Fubin; Lau, Chung Yin; Shangguan, Dongkai
Conference paper

Multi-Stacked Flip Chips with Copper Plated Through Silicon Vias and Re-Distribution for 3D System-in-Package Integration

Proc. MRS Symposium on Enabling Technologies for 3D Integration, Vol. 970, Boston, MA, 27-29 November pp. 179-190
Lee, Shi-Wei Ricky; Hon, R.
Conference paper

Process development for yellow phosphor coating on blue light emitting diodes (LEDs) for white light illumination

Proceedings of the Electronic Packaging Technology Conference, EPTC, 2006, p. 379-384
Lee, Ka Ho; Lee, Shi Wei Ricky
Conference paper

Thermal resistance analysis of a multi-stack flip chip 3-d package

2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3, 2006, p. 145-149
Chan, Yuen Sing; Lee, Shi Wei Ricky
Conference paper
2005 16

Design and fabrication of a flip-chip-on-chip 3-D packaging structure with a through-silicon via for underfill dispensing

IEEE Transactions on Advanced Packaging, v. 28, (3), August 2005, p. 413-420
Tsui, Yat Kit; Lee, Shi Wei Ricky
Article

Foreword: Three-dimensional packaging

IEEE Transactions on Advanced Packaging, v. 28, (3), August 2005, p. 354-355
Bauer, Charles E.; Lee, Shi Wei Ricky
Article

電子製造技術:利用無鉛、無鹵素和導電膠材料


劉, 漢誠; 汪, 正平; 李, 寧成; 李, 世瑋
Book

3D stacked flip chip packaging with through silicon vias and copper plating or conductive adhesive filling

Proceedings - Electronic Components and Technology Conference, v. 1, 2005, p. 795-801
Lee, Shi Wei Ricky; Hon, Ronald; Zhang, Shawn Xiaodong; Wong, Chun Keung
Conference paper

A systematic approach for determining the thermal fatigue-life of plastic ball array (PBGA) lead-free solder joints

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, v. 0, 2005, p. 1021-1029
Lau, J.; Lee, R.; Dauksher, W.; Shangguan, D.; Song, F.; Lau, D.
Conference paper

Assessment of long-term reliability in lead-free assemblies

Proceeding of 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC, v. 2005, 2005, p. 140-155
Ganesan, S.; Wu, J.; Pecht, M.; Lee, R.; Lo, Chi Chuen; Fu, Y.; Li, Y.; Xu, M.
Conference paper

Characterization of copper-to-silicon diffusion for the application of 3D packaging with through silicon vias

2005 6th International Conference on Electronic Packaging Technology, v. 2005, 2005, article number 1564666, p. 51-56
Zhang, Xiaodong; Lee, Shi-Wei Ricky; Weng, Lutao; So, Sylvia
Conference paper

Correlation between the strain on the printed circuit board and the stress in chips for the failure prediction of passive components

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 5, 2005, p. 115-121
Lau, Dennis Chung Yin; Lee, Shi Wei Ricky
Conference paper

Effects of testing conditions and multiple reflows on cold bump pull test of Pb-free solder balls

2005 6th International Conference on Electronics Packaging Technology, v. 2005, 2005
Song, Fubin; Lee, Shi Wei Ricky
Conference paper

Evaluation of bondability and reliability of single crystal copper wire bonding

Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05), 2005, p. 238-244
Chen, Hua; Lee, Shi Wei Ricky; Ding, Yutian
Conference paper

Experimental investigation of the effect of reflow cooling rate on the IMC growth of SAC lead-free solder alloy

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 5, 2005, p. 123-129
Song, Fubin; Lee, Shi Wei Ricky
Conference paper

Experimental testing and computational stress analysis of printed circuit board for the failure prediction of passive components under the depaneling load condition

Proceedings - Electronic Components Conference, 2005, p. 1783-1791
Lau, D.; Tsang, M.; Lee, SWR; Lo, Chi Chuen; Fu, LF; Jin, JW; Liu, S.
Conference paper

Fabrication of Sub-micron Silicon Vias by Deep Reactive Ion Etching

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging, San Francisco, California, USA, 17-22 July 2005, p. 947-953 (IPACK2005/73299 on CD-ROM)
Zhang, Xiaodong; Hon, Ronald; Lee, Shi-Wei Ricky
Conference paper

Multi-stack flip chip 3D packaging with copper plated through-silicon vertical interconnection

PROCEEDINGS OF THE 7TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS. 1 AND 2, 2005, p. 384-389
Hon, R.; Lee, SWR; Zhang, SX; Wong, CK
Conference paper

Optimization of epoxy flow for passive alignment of optical fiber arrays

Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, v. 2005, 2005, p. 132-136
Lo, Chi Chuen; Li, Chung Yeung; Tai, Chung Leung; Lee, Shi Wei Ricky
Conference paper

Thermal-fatigue life prediction equation for Plastic Ball Grid Array (PBGA) SnAgCu lead-free solder joints

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, v. 0, 2005, p. 1013-1019
Lau, John; Lee, Shi Wei Ricky; Song, Fubin; Shangguan, Dongkai; Lau, Dennis C.; Dauksher, Walter
Conference paper
2004 16

Comparison of solder ball shear strengths for various nickel platings on the bond pads of a PBGA substrate

Soldering & Surface Mount Technology, v. 16, (2), 2004, p. 21-26
Yan, Eric C.C.; Lee, Shi Wei Ricky; Huang, Xingjia
Article

Electronic Manufacturing Service Industries in China

China's Electronics Industries / Edited by M.G. Pecht, Y.C. Chan, College Park, Maryland: CALCE EPSC Press, 2004, p.109-136
Donahoe, Daniel; Lee, Shi-Wei Ricky
Book chapter

A new method for the solder ball pull test using a shape memory alloy tube

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 4, 2004, p. 237-242
Lo, Chi Chuen; Lau, Dennis Chung Yin; Lee, Shi Wei Ricky; Chan, Simon; Chan, Franky; Chau, K.C.
Conference paper

Characteristics of Resistance of Daisy-Chained PBGA Solder Joints under Thermal Fatigue Load, Three-Point Bending Load and Mechanical Drop Load

6th International Symposium on Electronic Materials and Packaging (EMAP2004), Penang, Malaysia, December 5-7, pp. 204-209
Lui, Ben Hoi Wai; Lee, Shi-Wei Ricky; Zhang, Shawn Xiao Dong
Conference paper

Chip-on-chip 3D optical interconnect with passive alignment

Proceedings - Electronic Components and Technology Conference, v. 2, 2004, p. 2015-2019
Lo, Chi Chuen; Lee, Ricky Shi Wei; Wu, Jingshen; Kim, Jang Kyo; Yuen, Matthew Ming Fai
Conference paper

Computational analyses on the effects of irregular conditions during accelerated thermal cycling tests on board level solder joint reliability

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004, 2004, p. 516-521
Lau, Dennis Chung Yin; Lee, Shi Wei Ricky
Conference paper

Computational model validation with experimental data from temperature cycling tests of PBGA assemblies for the analysis of board level solder joint reliability

Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004, 2004, p. 115-120
Lee, Shi Wei Ricky; Lau, Dennis Chung Yin
Conference paper

Effects of underfill adhesion on flip chip package reliability

Proceedings of 2004 International IEEE Conference on the Asian Green Electronics (AGEC), 2004, p. 96-101
Sham, Man Lung; Kim, Jang Kyo; Lee, R.S.W.; Wu, Jingshen; Yuen, Matthew Ming Fai
Conference paper

Experimental assessment of passive alignment of optical fibers With V-grooves on silicon optical bench

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004, 2004, p. 375-380
Lo, Chi Chuen; Lee, Shi Wei Ricky
Conference paper

Finite element analysis for thermal fatigue life estimation of PBGA solder joints with model validation by experimental data

ITHERM 2004, VOL 2, 2004, p. 724
Lee, SWR
Conference paper

Formation and Plugging of Through-Silicon-Vias for 3D Packaging

7th VLSI Packaging Workshop of Japan (VLSI2004), Kyoto, Japan, 29 November-2 December, pp. 105-108,
Lee, Shi-Wei Ricky; Hon, Ronald; Zhang, Shawn Xiao Dong; So, Sylvia
Conference paper

Formation of through-silicon-vias by laser drilling and deep reactive ion etching

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 4, 2004, p. 243-248
Hon, Ronald; Zhang, Shawn Xiaodong; Lee, Shi Wei Ricky
Conference paper

Gold embrittlement of solder joints in wafer level chip scale package on printed circuit board with Ni/Au surface finish

Proceedings - Electronic Components and Technology Conference, v. 1, 2004, p. 400-406
Huang, Xingjia; Lee, Shi Wei Ricky; Li, Ming; Chen, William T.
Conference paper

Modified passive alignment of optical fibers with low viscosity epoxy flow running in V-grooves

Proceedings - Electronic Components and Technology Conference, v. 1, 2004, p. 830-834
Lo, Chi Chuen; Lee, Shi Wei Ricky; Lee, Steve Han Keung; Wu, Jingshen; Yuen, Matthew Ming Fai
Conference paper

Thermal fatigue-life prediction of lead-free solder joints

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 4, November 2004, article number IMECE2004-62493, p. 265-270
Lau, John H.; Lee, Shi-Wei Ricky; Shangguan, Dongkai
Conference paper

Thermal-fatigue life prediction equation for wafer-level chip scale package (WLCSP) lead-free solder joints on lead-free printed circuit board (PCB)

Proceedings - Electronic Components and Technology Conference, v. 2, 2004, p. 1563-1569
Lau, John H.; Shangguan, Dongkai; Lau, Dennis Chung Yin; Kung, Terry T.W.; Lee, Shi Wei Ricky
Conference paper
2003 11

Electronics Manufacturing with Lead-free, Halogen-free, and Conductive Adhesive Materials


Lau, John; Wong, C.P.; Lee, N.C.; Lee, S. W. Ricky
Book

芯片尺寸封裝: 設計, 材料, 工藝, 可靠性及應用


劉, 漢誠; 李, 世瑋; 賈, 松良; 王, 水弟; 蔡, 堅
Book

A Reliability Comparison of Electroplated and Stencil Printed Flip-Chip Solder Bumps Based on UBM Related Intermetallic Compound Growth Properties

53rd Electronic Components and Technology Conference, ECTC, New Orleans, USA, 27-30 May, pp. 685-691
Gong, Jing-Feng; Xiao, Guo-Wei; Chan, Philip C.H.; Lee, Ricky S.W.; Yuen, Matthew M.F.
Conference paper

Effects of thermal aging and Au addition on the electrical resistance of solder balls in flip chip and ultra-CSP packages

ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 1, 2003, p. 831-836
Huang, XJ; Lee, SWR; Li, M.; Chen, W.
Conference paper

Effects of Thermal Aging and Au Addition on the Electrical Resistance of Solder Balls in Flip Chip and Ultra-CSP Packages

Proceedings of InterPACK’03, Maui, Hawaii, U.S.A., July 6-11, IPACK2003-35246 on CD-ROM
Huang, Xingjia; Lee, Shi-Wei Ricky; Li, Ming; Chen, William
Conference paper

Multi-chip memory module with a flip-chip-on-chip structure and an optional center via hole for underfill dispensing

Proceedings - Electronic Components and Technology Conference, 2003, p. 864-869
Lee, Shi Wei Ricky; Tsui, Yat Kit; So, Raymond; Luo, Le
Conference paper

Optimization of electroplating, stencil printing, ball placement solder-bumping flip-chip process technologies

Proceedings - Electronic Components and Technology Conference, 2003, p. 1850-1855
Xiao, G.W.; Gong, J.F.; Yau, E.W.C.; Chan, P.C.H.; Lee, R.S.W.; Yuen, M.M.F.
Conference paper

Optimization of stencil printing wafer bumping for fine pitch flip chip applications

Proceedings - Electronic Components and Technology Conference, 2003, p. 1724-1730
Gong, J.F.; Yau, E.W.C.; Chan, P.C.H.; Lee, R.S.W.; Yuen, M.M.F.
Conference paper

Passive alignment of optical fiber in a V-groove with low viscosity epoxy flow

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 3, November 2003, article number IMECE2003-43902, p. 403-406
Lo, Chi Chuen; Yung, C.S.; Lee, Shi-wei; Lee, Steve Han Keung; Wu, Jingshen; Yuen, Matthew Ming Fai
Conference paper

The impact of the AC current crowding effect on BJT RF noise modeling

2003 IEEE CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS, 2003, p. 327-330
Lee, Wai Kit; Man, Tsz Yin; Mok, Philip K.T.; Ko, Ping Keung; Chan, Man Sun
Conference paper

Three-dimensional packaging for multi-chip module with through-the-silicon via hole

PROCEEDINGS OF 5TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2003, p. 1-7
Tsui, Yat Kit; Lee, Ricky S W; Wu, Jingshen; Kim, Jang Kyo; Yuen,Matthew Ming Fai
Conference paper
2002 17

Analysis on solder ball shear testing conditions with a simple computational model

Soldering & Surface Mount Technology, v. 14, (1), April 2002, p. 45-48
Lee, SWR; Huang, XJ
Article

Assessment of board level solder joint reliability for PBGA assemblies with lead-free solders

Soldering & Surface Mount Technology, v. 14, (3), 2002, p. 46-50
Lee, Shi Wei Ricky; Lui, Ben Hoi Wai; Kong, YH; Baylon, Bernard; Leung, Timothy; Umali, Pompeo; Agtarap, Hector
Article

Computational parametric analyzes on the solder joint reliability of bottom leaded plastic (BLP) package

IEEE Transactions on Advanced Packaging, v. 25, (4), November 2002, p. 514-521
Zhang, Xiao Wu; Lee, Shi Wei Ricky; Choi, Kwang Seong; Kim, Young Gon
Article

Effects of build-up printed circuit board thickness on the solder joint reliability of a wafer level chip scale package (WLCSP)

IEEE Transactions on Components and Packaging Technologies, v. 25, (1), March 2002, p. 3-14
Lau, John H.; Lee, Shi Wei Ricky
Article

Micro-machined Conformal silicon Molds for wafer bumping and probing

International Journal of Nonlinear Sciences and Numerical Simulation, v. 3, (3-4, Sp. Iss. SI), 2002, p. 399-404
Lee, Shi Wei Ricky; Lo, Chi Chuen; Law, K.H.
Article

Modeling and analysis of 96.5Sn-3.5Ag lead-free solder joints of wafer level chip scale package on buildup microvia printed circuit board

IEEE Transactions on Electronics Packaging Manufacturing, v. 25, (1), January 2002, p. 51-58
Lau, John H.; Lee, Shi Wei Ricky
Article

Modeling of torsional vibration induced by extension-twisting coupling of anisotropic composite laminates with piezoelectric actuators

Smart Materials and Structures, v. 11, (1), February 2002, p. 55-62
Zhu, Mei-Ling; Lee, Shi-wei; Li, Hing Leung; Zhang, Tongyi; Tong, Pin
Article

Nonlinear-Time-Dependent Analysis of Micro Via-in-Pad Substrates for Solder Bumped Flip Chip Applications

Journal of Electronic Packaging, v. 124, (3), July 2002, p. 205-211
Lau, John; Lee, Ricky Shi Wei; Pan, S.H.; Chang, Chris
Article

Effects of room temperature storage time on the shear strength of PBGA solder balls

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 2, 2002, p. 259-262
Lee, Shi Wei Ricky; Tsui, Yat-Kit; Hunag, Xingjia; Yan, Eric C.C.
Conference paper

Effects of Room Temperature Storage Time on the Shear Strength of PBGA Solder Balls

14th Symposium on Mechanics of SMT & Photonic Structures, ASME International Mechanical Engineering Congress & Exposition, November 17-22, New Orleans, Louisiana, USA, pp. 1-4 (IMECE2002/39514 on CD-ROM)
Lee, S. W. Ricky; Tsui, Y.K.; Huang, X.; Yan, C.C.
Conference paper

Evaluation of board level reliability of Pb-free PBGA solder joints

International Advanced Packaging Materials Symposium, v. 2002, March 2002, article number 990368, p. 82-89
Lee, Shi-wei; Lui, Hon Wai Ben; Kong, Y.K.; Baylon, Bernard; Leung, Timothy; Umali, Pompeo; Agtarap, Hector
Conference paper

Experimental Evaluation on Solder Joint Reliability of PBGA Assembly under Mechanical Drop Test

14th Symposium on Mechanics of SMT & Photonic Structures, ASME International Mechanical Engineering Congress & Exposition, November 17-22, New Orleans, Louisiana, USA, pp. 1-5 (IMECE2002/39493 on CD-ROM)
Lee, Shi Wei Ricky; Li, Tracy Yin Lai; Lui, Ben Hoi Wai
Conference paper

Experimental investigation on the degradation of BGA solder ball shear strength due to room temperature aging

PROCEEDINGS OF THE 4TH INTERNATIONAL SYMPOSIUM ON ELECTRONIC MATERIALS AND PACKAGING, 2002, p. 478-481
Tsui, YK; Lee, SWR; Huang, XJ
Conference paper

Experimental investigation on the progressive failure mechanism of solder balls during ball shear test

Proceedings - Electronic Components and Technology Conference, 2002, p. 968-973
Huang, Xingjia; Lee, Shi Wei Ricky; Yan, Chien Chun
Conference paper

Reliability study and failure analysis of fine pitch solder-bumped flip chip on low-cost flexible substrate without using stiffener

Proceedings - Electronic Components and Technology Conference, 2002, p. 112-118
Xiao, G.W.; Chan, P.C.H.; Lee, R.S.W.; Yuen, M.M.F.
Conference paper

Stress Relaxation in Plastic Molding Compounds

International Symposium on Electronic Materials & Packaging (EMAP2002), December 4-6, Kaohsiung, Taiwan, pp. 37-42
Lee, M.; Pecht, M.G.; Huang, X.; Lee, S. W. Ricky
Conference paper

Thermal Analysis of Vertical-Cavity Surface-Emitting LED/VCSEL Assembly with Lead-Free Flip Chip Interconnects

PhoPack2002, July 14-16, Stanford, California, U.S.A., pp. 26-30
Lau, John; Lee, S. W. Ricky
Conference paper
2001 15

Analysis and comparison of WLCSP-on-build-up PCB assemblies with various solders and microvia configurations

Circuit World, v. 28, (2), 2001, p. 32-38
Lee, Shi-Wei Ricky; Lau, John H.
Article

Computational Analysis on the Effects of Double-Layer Build-Up Printed Circuit Board on the Wafer Level Chip Scale Package (WLCSP) Assembly with Pb-Free Solder Joints

International Journal of Microcircuits & Electronic Packaging, 24(2), 89-104
Lau, John; Lee, S. W. Ricky
Article

Reliability of Eutectic Sn-Pb Solder Bumps and Flip Chip Assemblies

International Journal of Microcircuits & Electronic Packaging, v. 24, (2), 2001, p. 246-262
Huang, Xingjia; Kallmayer, Christine; Aschenbrenner, Rolf; Lee, S. W. Ricky
Article

Solder joint crack propagation analysis of wafer-level chip scale package on printed circuit board assemblies

IEEE Transactions on Components and Packaging Technologies, v. 24, (2), June 2001, p. 285-292
Lau, John H.; Chang, Chris; Lee, Shi Wei Ricky
Article

以PZT薄膜为驱动和传感的微型陀螺研制

壓電與聲光, v. 23, (1), February 2001, p. 18-22
马薇; 李世玮; 虞吉林
Article

Microvias for Low-Cost High-Density Interconnects


Lau, John; Lee, S. W. Ricky
Book

Bending analysis of piezoelectric laminates

Solid Mechanics and Its Applications, v. 89, 2000, p. 275-282
Zhao, Ming-Hao; Qian, C.F.; Lee, Shi-wei; Tong, P.; Zhang, Tongyi
Conference paper

Characterization and analysis on the solder ball sheer testing conditions

Proceedings - Electronic Components Conference, 2001, p. 1065-1071
Huang, XJ; Lee, SWR; Yan, CC; Hui, S.
Conference paper

Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Alloy

Advances in Electronic Packaging, v. 1, 2001, p. 307-313
Dai, Lanhong; Lee, Shi-Wei Ricky
Conference paper

Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Using Split Hopkinson Torsional Bars (SHTB)

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 1, 2001, p. 237-242
Lee, Shi-Wei Ricky; Dai, Lanhong
Conference paper

Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Using Split Hopkinson Torsional Bars (SHTB)

ASME International Mechanical Engineering Congress and Exposition, Proceedings, v. 2, 2001, p. 2301-2306
Lee, Shi-Wei Ricky; Dai, Lanhong
Conference paper

Dynamic structural coupling behaviours of an anti-symmetric piezoelectric laminate

Proceedings of SPIE - The International Society for Optical Engineering, v. 4326, 2001, p. 331-339
Wong, Kelvin H.L.; Lee, Shi-Wei Ricky
Conference paper

Effects of plasma cleaning on the reliability of wire bonding

Advances in Electronic Materials and Packaging, v. 2001, November 2001, article number 983955, p. 39-43
Nowful, J.M.; Lok, S.C.; Lee, Shi-wei
Conference paper

Reliability of 96.5Sn-3.5Ag lead-free solder-bumped wafer level chip scale package (WLCSP) on build-up microvia printed circuit board

2001 HD Interntional Conference on Hig-Density Interconnect and Systems Packaging, Santa Clara, CA, United States, 17-20 April 2001; Proceedings of SPIE - The International Society for Optical Engineering, v. 4428, 2001, p. 314-322
Lau, John H.; Lee, Shi Wei Ricky
Conference paper

Reliability study and failure analysis of fine pitch solder bumped flip chip on low-cost printed circuit board substrate

Proceedings - Electronic Components and Technology Conference, 2001, p. 598-605
Xiao, G.; Chan, P.C.H.; Teng, A.; Lee, R.S.W.; Yuen, M.M.F.
Conference paper
2000 22

A damage evolution model for thermal fatigue analysis of solder joints

Journal of electronic packaging, v. 122, (3), September 2000, p. 200-206
Zhang, Xiao Wu; Lee, Shi Wei Ricky; Pao, Yihsin
Article

Characterization of strain rate-dependent shear response of 63Sn/37Pb solder under uniaxial torsion

Key Engineering Materials, v. 177, (Part 1&2), 2000, p. 267-272
Dai, Lan Hong; Lee, Shi Wei Ricky; Huang, Xing Jia
Article

Design and manufacturing of micro via-in-pad substrates for solder bumped flip chip applications

Journal of Electronics Manufacturing, v. 10, (1), March 2000, p. 79-87
Lau, J.; Chang, C.; Lee, R.; Chen, T.Y.; Cheng, D.; Tseng, T.J.; Lin, D.
Article

Effects of electric fields on the bending behavior of PZT-5H piezoelectric laminates

Smart Materials and Structures, v. 9, (6), December 2000, p. 824-831
Cheng, Jinquan; Qian, Caifu; Zhao, Ming-Hao; Lee, Shi Wei Ricky; Tong, Pin; Zhang, Tongyi
Article

Failure analysis of solder bumped flip chip on low-cost substrates

IEEE Transactions on Electronics Packaging Manufacturing, v. 23, (1), January 2000, p. 19-27
Lau, John H.; Chang, Chris C.P.; Lee, Shi Wei Ricky
Article

Fracture mechanics analysis of low cost solder bumped flip chip assemblies with imperfect underfills

Journal of Electronic Packaging, Transactions of the ASME, v. 112, (4), 2000, Dec, p. 306-310
Lau, John H.; Lee, Shi Wei Ricky
Article

Modeling of a rotary motor driven by an anisotropic piezoelectric composite laminate

IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, v. 47, (6), November 2000, p. 1561-1574
Zhu, Mei Ling; Lee, Shi-wei; Zhang, Tongyi; Tong, Pin
Article

Solder joint reliability of plastic ball grid array with solder bumped flip chip

Soldering & Surface Mount Technology, v. 12, (2), 2000, p. 16-23
Lee, Shi Wei Ricky; Lau, John H.
Article

Temperature-dependent popcorning analysis of plastic ball grid array package during solder reflow with fracture mechanics method

Journal of Electronic Packaging, Transactions of the ASME, v. 122, (1), March 2000, p. 34-41
Lau, John H.; Lee, Shi Wei Ricky
Article

一种新颖的四梁式压电薄膜微型陀螺

中國科學技術大學學報=Journal of china university of science and technology, v. 30, (4), August 2000
马薇; 李世玮; 虞吉林
Article

引线框架用铜合金与Sn-Pb共晶焊料界面组织研究

功能材料, v. 31, (5), 2000, p. 494-495
王谦; Lee, Shi Wei Ricky; 曹育文; 唐祥云; 马莒生
Article

电子封装中的焊点及其可靠性

電子元件與材料=Electronic Components & Materials, v. 19, (2), 2000, p. 24-26
王谦; LEE, Shi-Wei Ricky; 汪刚强; 耿志挺; 黄乐; 唐祥云; 马莒生
Article

An analytical method of extension-twisting coupling vibration of piezoelectric composite laminates

Structural Dynamics : Recent Advances : Proceedings of the 7th International Conference / edited by N. S. Ferguson. Southampton : Institute of Sound and Vibration Research, University of Southampton, 2000, p. 121-134
Zhu, M.L.; Lee, Ricky Shi-wei; Zhang, Tongyi; Tong, Pin
Conference paper

Assessment on the effects of electroless nickel plating on the reliability of solder ball attachment to the bond pads of PBGA substrate

50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, p. 868-873
Lee, Shi Wei Ricky; Yan, Chien Chun; Karim, Zaheed; Huang, Xing Jia
Conference paper

Effects of Build-Up Printed Circuit Board Thickness on the Solder Joint Reliability of a Wafer Level Chip Scale Package (WLCSP)

International Symposium on Electronic Materials and Packaging, EMAP 2000, 2000, Article number 904141, p. 115-126
Lau, John H.; Lee, Ricky S W
Conference paper

Effects of electric fields on the bending behavior of piezoelectric composite laminates

Materials Research Society Symposium - Proceedings, v. 604, 2000, p. 59-64
Cheng, Jin Quan; Zhang, Tongyi; Zhao, Ming Hao; Qian, Cai Fu; Lee, Shi-wei; Tong, Pin
Conference paper

Experimental Characterization for the Shear Strength of Pb-Free Solder Balls on a PZT Substrate with Pd/Ag Pads

Proceedings of the Electronic Packaging Technology Conference, EPTC, v. 2000, 2000, Article number 906354, p. 86-90
Huang, Xingjia; Lee, Ricky S W; Tse, Wansze
Conference paper

Modeling for prototyping of rotary piezoelectric motors

Structures and Materials, v. 7, 2000, p. 21-30
Lee, Shi-Wei Ricky; Zhu, Mei-Lirig; Wong, H.L.
Conference paper

Reliability of Wafer Level Chip Scale Package (WLCSP) with 96.5Sn-3.5Ag Lead-Free Solder Joints on Build-Up Microvia Printed Circuit Board

International Symposium on Electronic Materials and Packaging, EMAP 2000, 2000, Article number 904133, p. 55-63
Lau, John H.; Lee, Ricky S W
Conference paper

Solder joint crack propagation analysis of wafer-level chip scale package on printed circuit board assemblies

50th Electronic Components and Technology Conference, Las Vegas, NV, USA, 2000, p. 1360-1368
Lau, John; Chang, Chris; Lee, Shi Wei Ricky
Conference paper

Study on the Interfaces Between Copper Alloys for Lead Frame and Sn-Pb Solder Alloys

International Symposium on Electronic Materials and Packaging, EMAP 2000, 2000, Article number 904185, p. 388-390
Qian, Wang; Lee, Ricky S W; Yuwen, Cao; Jusheng, Ma A.
Conference paper

The Mechanical Properties Degradation of Solder Joints Under Thermal Cycling


Wang, Qian; Lee, Ricky S W; Wang, Gangqiang; Chen, Guohai; Hung, Le; Ma, Jusheng
Conference paper
1999 9

Assembly of large PBGAs on printed circuit board with large PQFPs directly on the opposite side

Journal of Electronics Manufacturing, v. 9, (4), 1999, p. 293-298
Lau, John H.; Lee, Shi-Wei Ricky; Chao, Henry
Article

Computational analysis for the torsional vibration control of an anti-symmetric piezoelectric composite laminate

Journal of Intelligent Material Systems and Structures, v. 10, (7), July 1999, p. 530-533
Lee, Shi Wei Ricky; Li, Hing Leung
Article

Design and analysis of a microgyroscope with sol-gel piezoelectric plate

Smart Materials and Structures, v. 8, (2), April 1999, p. 212-217
He, Guohong; Nguyen, Christopher C.T.; Hui, JCM; Lee, Shi Wei Ricky; Luong, Howard Cam
Article

Effect of Heat-Spreader Sizes on the Thermal Performance of Large Cavity-Down Plastic Ball Grid Array Packages

Journal of Electronic Packaging, Transactions of the ASME, v. 121, (4), December 1999, p. 242-248
Lau, John; Chen, Tony; Lee, Shi Wei Ricky
Article

Chip Scale Package (CSP): Design, Materials, Process, Reliability & Applications


Lau, J.H.; Lee, S.W.R.
Book

Design and Performance of a Piezoelectric Microgyroscope

10th International Conference on Solid-State Sensors and Actuators (Transducers' 99), June 1999
Cheung, V.S.L.; Ma, W.; Luong, H.C.; Lee, R.
Conference paper

Effects of underfill delamination and chip size on the reliability of solder bumped flip chip on board

Proceedings of the 1999 International Symposium on Microelectronics, Chicago, IL, USA, v.3906, 26-28 October 1999, p. 592-598
Lau, John H.; Lee, Shi Wei Ricky; Ouyang, Chien
Conference paper

Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants

Proceedings of the 1999 49th Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, 1-4 June 1999, p. 571-582
Lau, John H.; Lee, Shi Wei Ricky; Chang, Chris; Ouyang, Chien
Conference paper

Global Collaborative Electronic Packaging Education

49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, p. 907-911
Tong, Pin; Lam, David C C; Yuen, Matthew Ming Fai; Kim, Jang Kyo; Lee, Ricky S W; Lee, Steve Han Keung; Chan, Philip Ching Ho
Conference paper
1998 12

Computational modeling and analysis of a center-cracked panel repaired by bonded composite patch

Key Engineering Materials, v. 145-149, 1998, p. 601-606
Chau, RWT; Lee, Shi Wei Ricky
Article

Critical issues in computational modeling and fatigue life analysis for PBGA solder joints

International Journal of Microcircuits and Electronic Packaging, v. 21, (3), April 1998, p. 253-261
Zhang, Xiaowu; Lee, Shi Wei Ricky
Article

Development and characterization of a rotary motor driven by anisotropic piezoelectric composite laminate

Smart Materials and Structures, v. 7, (3), June 1998, p. 327-336
Lee, SWR; Li, HL
Article

Effects of temperature profile on the life prediction of PBGA solder joints under thermal cycling

Key Engineering Materials, v. 145-149, (Part 1&2), 1998, p. 1133-1138
Zhang, Xiao Wu; Lee, Shi Wei Ricky
Article

Experimental investigation of the shear strength of a unidirectional carbon/aluminum composite under dynamic torsional loading

Composites Science and Technology, v. 58, (10), October 1998, p. 1667-1673
Dai, Lan Hong; Bai, Yi Long; Lee, Shi Wei Ricky
Article

Material response and failure mechanism of unidirectional metal matrix composites under impulsive shear loading

Key Engineering Materials, v. 141-143, (Part 1-2), 1998, p. 651-669
Dai, Lan Hong; Bai, Yi Long; Lee, Shi Wei Ricky
Article

Sensitivity study on material properties for the fatigue life prediction of solder joints under cyclic thermal loading

Circuit World, v. 24, (3), 1998, p. 26-31
Lee, Shi-Wei Ricky; Zhang, Xiaowu
Article

Solder joint reliability of cavity-down plastic ball grid array assemblies

Soldering & Surface Mount Technology, v. 10, (1), February 1998, p. 26-31
Lee, Shi Wei Ricky; Lau, John H.
Article

Special Issue on Piezoelectric Motors/Actuators and Their Applications - Preface

Smart Materials and Structures, v. 7, (3), June 1998
Lee, Ricky S W
Article

Thermal stress analysis of a PQFP moulding process: Comparison of viscoelastic and elastic models

Key Engineering Materials, v. 145-149, (Part 1&2), 1998, p. 1127-1132
Park, Joo Hyuk; Kim, Jang Kyo; Yuen, Matthew Ming Fai; Lee, Shi Wei Ricky; Tong, Penger; Chan, Philip Ching Ho
Article

Computational modeling and parametric study of a rotary actuator driven by piezoelectric composites

Proceedings of SPIE - The International Society for Optical Engineering, v. 3323, 1998, p. 414-421
Li, Hing Leung; Lee, Shi-Wei Ricky
Conference paper

Thermal fatigue life prediction for solder joints with the consideration of damage evolution

2ND ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS, 1998, p. 279-285
Zhang, Xiao Wu; Lee, Shi Wei Ricky
Conference paper
1997 7

Design for plastic ball grid array solder joint reliability

Circuit World, v. 23, (2), 1997, p. 11
Lee, Shi-Wei Ricky; Lau, John H.
Article

Effect of chip dimension and substrate thickness on the solder joint reliability of plastic ball grid array packages

Circuit World, v. 23, (1), March 1997
Lee, Shi-Wei; Lau, John H.
Article

Sensitivity study on material properties for the fatigue life prediction of solder joints under cyclic thermal loading

American Society of Mechanical Engineers, EEP, v. 19, (2), 1997, p. 1559-1561
Lee, Shi-Wei Ricky; Zhang, Xiao Wu
Article

Warpage analysis of plastic ball grid array packages

American Society of Mechanical Engineers, EEP, v. 19, (2), 1997, p. 1789-1791
Lee, Shi-Wei Ricky
Article

An experimental investigation on the correlation between testing cycles and delamination of plastic ball grid array packages under thermal cycling with high humidity

Proceedings of the Electronic Technology Conference, EPTC, v. 1997, October 1007, p. 82-85
Lee, Shi Wei Ricky; Yan, Chien Chun; Chow, LW; Papageorge, Marc
Conference paper

Design for plastic ball grid array solder joint reliability

Proceedings of the NEPCON WEST'97. Part 3 (of 3), Anaheim, CA, USA, v. 2, 1997, Feb, p. 1023-1032
Lee, Shi Wei Ricky; Lau, John H.
Conference paper

Solder joint reliability of plastic ball grid array with solder bumped flip chip


Lee, Shi Wei Ricky; Lau, John H.
Conference paper
1996 5

Impact performance of a woven fabric CFRP laminate

Polymers & polymer composites, v. 4, (8), 1996, p. 549-561
Kim, Jang Kyo; Leung, LM; Lee, Ricky Shi Wei; Hirai, Yasunobu
Article

Anisotropic piezoelectric laminates for rotary actuators

Proceedings of SPIE - The International Society for Optical Engineering, v. 3321, 1996, p. 484-491
Lee, Shi-Wei Ricky; Li, Hing Leung
Conference paper

Design of linear and rotary actuators using piezoelectric composite laminates

Progress in Advanced Materials and Mechanics, Vol. 1; Beijing; China; 12-15 Aug. 1996. pp. 304-309. 1996
Lee, SW R.
Conference paper

Impact response of woven fabrics and cross-plies carbon fibre composites

Proc. 5th Symp. of Interfacial Materials Science on Composite Materials, Fukuoka, Japan, May 1996, p. 310-313
Kim, Jang-Kyo; Leung, L.M.; Lee, R.S.W.; Hirai, Y.
Conference paper

Mechanical property study of composite grid reinforced concrete

Proceedings of the 2nd International Symposium on Civil Infrastructure Systems, Hong Kong/China, 1996, p. 205-210
Chen, M.; Li, Zongjin; Lee, R.; Tong, Ping
Conference paper
1995 4

On the Apparent Bending Isotropy in Clamped Elliptic Composite Laminates

Journal of Composite Materials, v. 29, (12), August 1995, p. 1601-1620
Lee, Shi Wei Ricky; Sun, Chin Teh
Article

Actuation of Torsional Motion for Piezoelectric Laminated Beams

Dynamic Response & Behavior of Composites, v. 46, 1995, p. 139-146
Lee, Shi-Wei Ricky; Chan, Kwok Ho W.
Conference paper

Bending/Twisting/Shearing Actuation and Sensing of Laminated Composite Beams with Piezopolymer Film

Intelligent Materials and Systems, 1995, p. 137-148
Lee, Shi-Wei Ricky; Sun, C.T.
Conference paper

Evaluation of Residual Strength for Cracked Pressure Vessel Repaired by Composite Patch

Proc. ICCE/2 International Conference, New Orleans, LA, August 21-24 1995, p. 449-450
Lee, Shi-Wei Ricky
Conference paper
1994 2

On the Sensing and Actuation of Clamped Elliptic Piezoelectric Laminates

Adaptive Structures and Composite Materials, Chicago, IL, USA, v. 45,November 6-11 1994, p. 275-279
Lee, Shi-Wei Ricky
Conference paper

The Use of Clamped Circular Piezoelectric Laminates as Pressure Sensors

Proc. 9th ASC Conference, Newark, DE, September 20-22 1994, p. 331-339
Lee, Shi-Wei Ricky
Conference paper
1993 3

A Quasi-Static Penetration Model for Composite Laminates

Journal of Composite Materials, v. 27, (3), March 1993, p. 251-271
Lee, Shi-Wei Ricky; Sun, Chin Teh
Article

Dynamic Penetration of Graphite/Epoxy Laminates Impacted by a Blunt-Ended Projectile

Composites Science & Technology, v. 49, (4), 1993, p. 369-380
Lee, Shi-Wei Ricky; Sun, Chin Teh
Article

Bending Characteristics of Clamped Elliptic Symmetric Composite Laminates

Proc. 8th ASC Conference, Cleveland, OH, 20-22 October 1993, p. 1087-1096
Lee, Shi-Wei Ricky; Sun, Chin Teh
Conference paper
1992 1

Ballistic Limit Prediction of Composite Laminates by a Quasi-Static Penetration Model

Proc. 24th SAMPE Technical Conference, Toronto, Canada, October 20-22 1992, p. 497-511
Lee, Shi-Wei Ricky; Sun, Chin Teh
Conference paper
1991 1

Modeling Penetration Process of Composite Laminates Subjected to a Blunt-Ended Punch

Proc. 23rd SAMPE Technical Conference, Kiamesha Lake, NY, October 21-24 1991, p. 624-638
Lee, Shi-Wei Ricky; Sun, Chin Teh
Conference paper
1988 3

Damage in Composite Laminates: Effects of Transverse Cracks

Mechanics of Materials, v. 7, (2), November 1988, p. 91-107
Herakovich, C.T.; Aboudi, J.; Lee, Shi-Wei Ricky; Strauss, E.A.
Article

Three-Dimensional Analysis of Laminates with Cross Cracks

Journal of Applied Mechanics, ASME Transactions, v. 55, June 1988, p. 389-397
Aboudi, J.; Lee, Shi-Wei Ricky; Herakovich, C.T.
Article

2-D and 3-D Damage Effects in Cross-Ply Laminates

Mechanics of Composite Materials, Berkeley, CA, USA, v. 92, June 20-22 1988, p. 143-147
Herakovich, C.T.; Aboudi, J.; Lee, Shi-Wei Ricky; Strauss, E.A.
Conference paper
Article 2

A Flexible Thin-Film Inductor for High-Efficiency Wireless Power Transfer

IEEE Electron Device Letters, v. 44, (3), March 2023, article number 10032542, p. 504-507
Yao, Yuan; Qiu, Xing; Cheng, Yuanjie; Lo, Chi Chuen; Lee, Ricky Shi-wei; Ki, Wing Hung; Tsui, Chi Ying

Development of Uniform Polydimethylsiloxane Arrays through Inkjet Printing

Polymers, v. 15, (2), January 2023, article number 462
Tu, Ning; Lo, Jeffery C. C.; Lee, Shi-wei
Conference paper 2

Quantum Dot Color Conversion Film with Enhanced Color Rendering Performance

2023 International Conference on Electronics Packaging (ICEP) / IEEE. Piscataway, NJ : IEEE, 2023, p. 135-136, article number 10129754
Cheng, Yuanjie; Lo, Chi Chuen; Qiu, Xing; Xu, Hua; Tao, Mian; Lee, Shi-wei

Reliability and Lifetime of a Novel 222-nm KrCl Excilamp

Proceedings - 2022 19th China International Forum on Solid State Lighting and 2022 8th International Forum on Wide Bandgap Semiconductors, SSLCHINA: IFWS 2022 / IEEE. Piscataway, NJ : IEEE, 2023, p. 228-230, article number 10070975
Zhao, Fanny; Zeng, Yapei; Wu, Hao; Chen, Junquan; Yang, Guoming; Zhen, Li; Shieh, Brian; Lee, Ricky Shi-wei
Article 1

Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing

Journal of Electronic Packaging, v. 144, (4), December 2022, article number 041010
Zhang, Qiming; Lee, Shi-wei
Book 1

From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, Applications


Lee, Shi-wei; Lo, Chi Chuen; Tao, Mian; Ye, Huaiyu
Conference paper 5

A UVC LED Disinfection Closet for Reuse of Protective Coats

2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022, 2022, article number 9873115
Qiu, Xing; Lo, Chi Chuen; Cheng, Yuanjie; Xu, Hua; Xu, Qianwen; Lee, Shi-wei

Improved Inkjet Printing of Polydimethylsiloxane Droplets

2022 International Conference on Electronics Packaging, ICEP 2022, 17 June 2022, article number 9795441, p. 241-242
Tu, Ning; Lo, Chi Chuen; Lee, Shi-wei

Inkjet Printing High Resolution Polydimethylsiloxane Dots Array

2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022, 2022, article number 9873331
Tu, Ning; Lo, Chi Chuen; Lee, Shi-wei

Solderability Analysis of Inkjet-printed Silver Pads with SAC Solder Joints

2022 International Conference on Electronics Packaging, ICEP 2022 / IEEE. IEEE, 2022, p. 65-66, Article number: 9795503
Jiang, Qian; Tu, Ning; Lo, Chi Chuen; Lee, Shi-wei

Thermal-mechanical Reliability of Sintered Nano-Ag Bond Pads Printed by Aerosol Jet

2022 23rd International Conference on Electronic Packaging Technology, ICEPT 2022, 2022, article number 9873290
Lo, Chi Chuen; Jiang, Qian; Qiu, Xing; Tu, Ning; Lee, Shi-wei
Article 5

Characterization And Evaluation Of 3D-printed Connectors For Microfluidics

Micromachines, v. 12, (8), August 2021, article number 874
Xu, Qianwen; Lo, Jeffery C. C.; Lee, Shi-wei

Fabrication and Reliability Assessment of Cu Pillar Microbumps with Printed Polymer Cores

Journal of Electronic Packaging, Transactions of the ASME, v. 143, (3), September 2021, article number 031101
Qiu, Xing; Lo, Jeffery Chi Chuen; Cheng, Yuanjie; Lee, Shi-wei; Tseng, Yong Jhe; Chiu, Peter

Implementation and characterisation of a sterilisation module consisting of novel 265 nm UVC LED packages

HKIE Transactions, v. 28, (4), 31 December 2021, p. 213-220
Qiu, Xing; Lo, Chi Chuen; Cheng, Yuanjie; Xu, Hua; Xu, Qianwen; Lee, Shi-wei

Mechanical System and Dynamic Control in Photolithography for Nanoscale Fabrication: A Critical Review

International Journal of Mechanical System Dynamics, v. 1, (1), September 2021, p. 35-51
Song, Yi; Gui, Chengqun; Huo, Zongliang; Lee, Shi-wei; Liu, Sheng

Phosphor-free microLEDs with ultrafast and broadband features for visible light communications

Photonics Research, v. 9, (4), April 2021, p. 452-459
Tian, Zhenhuan; Li, Qiang; Wang, Xuzheng; Zhang, Mingyin; Su, Xilin; Zhang, Ye; Li, Yufeng; Yun, Feng; Lee, Shi-wei
Conference paper 6

Evaluation and Reduction of Optical Crosstalk in Quantum Dot Color-Converted Mini/Micro-LED Displays

2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021, 14 September 2021
Cheng, Yuanjie; Lo, Chi Chuen; Qiu, Xing; Lee, Shi-wei

Life Projection of Far-UVC KrCl Excilamp with 222nm Peak Wavelength

2021 18th China International Forum on Solid State Lighting and 2021 7th International Forum on Wide Bandgap Semiconductors, SSLChina: IFWS 2021, December 2021, article number 9675209, p. 239-242
Dong, Guoshuai; Zhao, Fanny; Wu, Hao; Yang, Guoming; Deng, Ronghua; Shieh, Brian; Lee, Ricky Shi-wei

Realizing Low Optical Crosstalk, Wide Color Gamut Mini-LED Displays via Laser-Patterned Quantum Dots Color Conversion Layer

2021 International Conference on Electronics Packaging, ICEP 2021, May 2021, article number 9451947, p. 153-154
Cheng, Yuanjie; Lo, Chi Chuen; Qiu, Xing; Lee, Shi-wei

Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer (RDL)

Proceedings of ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2021, October 2021, article number v001t07a025
Lee, Shi-wei; Lo, Chi Chuen; Qiu, Xing; Tu, Ning

Synthesis of Face to Face Partially Fused Carbon Nanotubes for the Improvement of Thermal Management in 3D Die Stacking

2021 IEEE 16th Nanotechnology Materials and Devices Conference, NMDC 2021, December 2021, article number 9677535
Xu, Hua; Lo, Chi Chuen; Lee, Shi-wei

The Study of Far-UVC 222-nm Excilamp and Germicidal-UVC 254-nm Low-pressure Hg Lamp: Optical Characteristics and Service Life

2021 22nd International Conference on Electronic Packaging Technology, ICEPT 2021, 14 September 2021, article number 9567948
Zhao, Fanny; Dong, Guoshuai; Wu, Hao; Yang, Guoming; Shieh, Brian; Lee, Ricky Shi-wei; Deng, Ronghua
Article 3

Assessment of Fatigue Induced Pad Cratering With a Universal Expression of Printed Circuit Board Fatigue Resistance

Journal of Electronic Packaging, v. 142, (2), June 2020, article number 021008
Zhang, Qiming; Lee, Shi-wei

Directly Printed Hollow Connectors for Microfluidic Interconnection with UV-Assisted Coaxial 3D Printing

Applied Sciences, v. 10, (10), May 2020, article number 3384
Xu, Qianwen; Lo, Jeffery Chi Chuen; Lee, Shi-wei

UV LED Assisted Printing Platform for Fabrication of Micro-Scale Polymer Pillars

Journal of Microelectromechanical Systems, v. 29, (6), December 2020, article number 9214960, p. 1523-1530
Qiu, Xing; Lo, Chi Chuen; Cheng, Yuanjie; Lee, Shi-wei; Tseng, Yong Jhe; Yi, Hung Kuan; Chiu, Peter
Conference paper 4

Cross-sectioning Technique for Bonded Silicon Substrates with Face-to-Face Interlaced Carbon Nanotubes in Microchannels

Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA, v. 2020, July 2020, article number 9261020
Xu, Hua; Lo, Jeffrey Chi Chuen; Lee, Shi-wei

Dimensionless Correlation between Empirical Modeling and T3ster Measurements for the Dynamic Thermal Characterization of the PWM-mode Current Driving UVLED

2020 17th China International Forum on Solid State Lighting and 2020 International Forum on Wide Bandgap Semiconductors China, SSLChina: IFWS 2020, November 2020, article number 9308826, p. 260-265
Zhao, Fanny; Zeng, Yapei; Dong, Guoshuai; Yang, Guoming; Shieh, Brian; Lee, Shi-wei

Printing Unifrom QDs Polymer Thin Film for QLED Applications

Proceedings - Electronic Components and Technology Conference, v. 2020-June, June 2020, article number 9159247, p. 1992-1998
Tu, Ning; Lo, Jeffery Chi Chuen; Lee, Shi-wei

Quantum Dot Film Patterning on a Trenched Glass Substrate for Defining Pixel Arrays of a Full-color Mini/Micro-LED Display

2020 21st International Conference on Electronic Packaging Technology, ICEPT 2020, August 2020, article number 9201924
Cheng, Yuanjie; Lo, Chi Chuen; Qiu, Xing; Shieh, Brian; Lee, Shi-wei
Article 2

Filler Particle-Induced Light Absorption in Underfill-Encapsulated Flip-Chip Light-Emitting Diodes

IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 9, (3), March 2019, article number 8463575, p. 562-566
Shang, Andrew Weber; Lo, Chi Chuen; Lee, Shi-wei

The Effect of Metallic Interconnect Spacing on the Thermal Resistance of Flip-Chip Light-Emitting Diodes With Underfill Encapsulation

IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 9, (5), May 2019, article number 8533406, p. 871-876
Shang, Andrew Weber; Lo, Jeffery C. C.; Lee, Shi-wei
Conference paper 9

Coaxial Nozzle-assisted 3D Printing with in-situ UV LED Curing for Microfluidic Connectors

2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019 / IEEE. New York, NY, USA : IEEE, 2019, Article no.: 9080964
Xu, Qianwen; Lee, Shi-wei; Lo, Jeffery C. C.

Empirical Modeling and measurement of the Pulsed Junction Temperature of VCSEL

2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019 / IEEE. New York, NY, USA : IEEE, 2019, Article no.: 9081173
Shieh, Brian; Zeng, Fangyun; Yang, Guoming; Zhao, Fanny; Sher, Chin-Wei; Lee, Shi-wei

Evaluation and Benchmarking of Cu Pillar Micro-bumps with Printed Polymer Core

2019 International Conference on Electronics Packaging, ICEP 2019, April 2019, article number 8733457, p. 24-27
Qiu, Xing; Lo, Chi Chuen; Lee, Shi-wei; Liou, Ying-Hong; Chiu, Peter

Feasibility study of fan-out panel-level packaging for heterogeneous integrations

Proceedings - Electronic Components and Technology Conference, v. 2019-May, May 2019, article number 8811162, p. 14-20
Ko, Cheng-Ta; Yang, Henry; Lau, John H.; Li, Ming; Lin, Curry; Chang, Chieh Lin; Pan, Jhih Yuan; Wu, Hsing Hui; Xu, Iris; Chen, Tony; Li, Zhang; Tan, Kim Hwee; Lo, Penny; So, R.; Chen, Y. H.; Fan, Nelson; Kuah, Eric; Lin, Marc; Cheung, Y. M.; Ng, Eric; Xi, Cao; Beica, Rozalia; Lim, Sze Pei; Lee, N.C.; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei

Feasibility study of fan-out wafer-level packaging for heterogeneous integrations

Proceedings - Electronic Components and Technology Conference, v. 2019-May, May 2019, article number 8811333, p. 903-909
Lau, John; Li, Ming; Xu, Iris; Chen, Tony; Tan, Kim Hwee; Li, Zhang; Fan, Nelson; Kuah, Eric; So, Raymond; Lo, Penny; Cheung, Y. M.; Xi, Cao; Beica, Rozalia; Lim, Sze Pei; Lee, N.C.; Ko, Cheng Ta; Yang, Henry; Chen, Y. H.; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei

Inkjet Printing PEDOT:PSS without Coffee Ring Effect for QLED Applicaitons

2019 20th International Conference on Electronic Packaging Technology, ICEPT 2019 / IEEE. New York, NY, USA : IEEE, 2019, Article no.: 9081009
Tu, Ning; Lee, Shi-wei

Investigation of Processing Parameters for the Fabrication of Microfluidic Connectors Using a UV-assisted Coaxial 3D Printing System

2019 IEEE 21st Electronics Packaging Technology Conference, EPTC 2019, v. 2019, December 2019, article number 9026686, p. 640-644
Xu, Qianwen; Lo, Jeffery Chi Chuen; Lee, Shi-wei

Junction Temperature Prediction of the Multi-LED Module with the Modified Thermal Resistance Matrix

2019 16th China International Forum on Solid State Lighting and 2019 International Forum on Wide Bandgap Semiconductors China, SSLChina: IFWS 2019, November 2019, article number 9019796, p. 252-255
Zhao, Fanny; Shieh, Brian; Zeng, Fangyun; Yang, Guoming; Lee, Shi-wei

Long-term Stability Evaluation of Thermal Interface Materials (TIMs)

2019 20th International Conference on Electronic Packaging Technology, ICEPT / IEEE. New York, NY, USA : IEEE, 2019, Article no.: 9081271
Lo, Chi Chuen; Tao, Mian; Cheng, Yuanjie; Xu, Qianwen; Xiao, Kunhui; Lee, Shi-wei
Article 8

A Novel Approach to Characterize Phosphor Particles for the Color Tuning of WLEDs

IEEE Photonics Technology Letters, v. 30, (6), March 2018, p. 513-516
Wang, Jiaqi; Lo, Chi Chuen; Lee, Shi-wei; Tao, Mian; Zou, Huayong; Yun, Feng

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration

IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 8, (9), September 2018, article number 8410452, p. 1561-1572
Ko, Cheng-Ta; Yang, Henry; Lau, John H.; Li, Ming; Li, Margie; Lin, Curry; Lin, J.W.; Chen, Tony; Xu, Iris; Chang, Chieh-Lin; Pan, Jhih-Yuan; Wu, Hsing-Hui; Yong, Qing Xiang; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee; Cheung, Yiu-Ming; Ng, Eric; Kai, Wu; Hao, Ji; Beica, Rozalia; Lin, Marc; Chen, Yu-Hua; Cheng, Zhong; Wee, Koh Sau; Ran, Jiang; Xi, Cao; Lim, Sze Pei; Lee, N.C.; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei

Correlation of warpage distribution with the material property scattering for warpage range prediction of PBGA components

Journal of Electronic Packaging, Transactions of the ASME, v. 140, (4), December 2018, article number 041005
Zhang, Qiming; Lo, Chi Chuen; Lee, Shi-wei; Xu, Wei

Design, materials, process, and fabrication of fan-out panel-level heterogeneous integration

Journal of Microelectronics and Electronic Packaging, v. 15, (4), October 2018, p. 141-147
Ko, Cheng Ta; Yang, Henry; Lau, John; Li, Ming; Li, Margie; Lin, Curry; Lin, J.W.; Chang, Chieh Lin; Pan, Jhih Yuan; Wu, Hsing Hui; Chen, Y. H.; Chen, Tony; Xu, Iris; Lo, Penny; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee; Lin, Chia Hung; Beica, Rozalia; Lin, Marc; Xi, Cao; Lim, Sze Pei; Lee, N.C.; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei

Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging

IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 8, (6), June 2018, p. 991-1002
Lau, John H.; Li, Ming; Li, Qingqian Margie; Xu, Iris; Chen, Tony; Li, Zhang; Tan, Kim Hwee; Yong, Qing Xiang; Cheng, Zhong; Wee, Koh Sau; Beica, Rozalia; Ko, C. T.; Lim, Sze Pei; Fan, Nelson; Kuah, Eric; Kai, Wu; Cheung, Yiu-Ming; Ng, Eric; Xi, Cao; Ran, Jiang; Yang, Henry; Chen, Y. H.; Lee, N. C.; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei

Fan-Out Wafer-Level Packaging for Heterogeneous Integration

IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 8, (9), September 2018, article number 8410488, p. 1544-1560
Lau, John Hon Shing; Li, Ming; Li, Margie Qingqian; Chen, Tony; Xu, Iris; Yong, Qing Xiang; Cheng, Zhong; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee Raymond; Cheung, Yiu Ming; Ng, Eric; Lo, Penny; Kai, Wu; Hao, Ji; Wee, Koh Sau; Ran, Jiang; Xi, Cao; Beica, Rozalia; Lim, Sze Pei; Lee, N. C.; Ko, Cheng Ta; Yang, Henry; Chen, Yu Hua; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei

Reliability of Fan-Out Wafer-Level Heterogeneous Integration

Journal of Microelectronics and Electronic Packaging, v. 15, (4), 2018, p. 148-162
Lau, John; Li, Ming; Lei, Yang; Li, Margie; Xu, Iris; Chen, Tony; Yong, Qing X; Cheng, Zhong; Kai, Wu; Lo, Penny; Li, Zhang; Tan, KIm H; Cheung, Yiu Ming; Fan, Nelson; Kuah, Eric; Xi, Cao; Ran, Jiang; Beica, Rozalia; Lim, Sze P; Lee, Ning Cheng; Ko, Cheng-Ta; Yang, Henry; Chen, Yu-Hua; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei

Super flexible GaN light emitting diodes using microscale pyramid arrays through laser lift-off and dual transfer

Optics Express, v. 26, (2), January 2018, p. 1817-1824
Tian, Zhenhuan; Li, Yufeng; Su, Xilin; Feng, Lungang; Wang, Shuai; Ding, Wen; Li, Qiang; Zhang, Ye; Guo, Maofeng; Yun, Feng; Lee, Shi-wei
Conference paper 17

A Power Inductor Integration Technology Using a Silicon Interposer for DC-DC Converter Applications

Proceedings of the International Symposium on Power Semiconductor Devices and ICs, v. 2018-May, June 2018, p. 347-350
Ding, Yixiao; Fang, Xiangming; Gao, Yuan; Cai, Yuefei; Qiu, Xing; Mok, Kwok Tai Philip; Lee, Shi-wei; Lau, Kei May; Sin, Johnny Kin On

Additive Manufacturing of Micro-channels on a Silicon Substrate based on Coaxial Printing Dispenser with in-situ UV LED Curing

EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging / IEEE. New York, NY, USA : IEEE, 2018, Article no.: 8660886
Xu, Qianwen; Lee, Shi-wei; Lo, Chi Chuen

Additive Manufacturing of Micro-scale Tunnels on a Silicon Substrate with in-situ UV LED Curing for MEMS Applications

2018 7th Electronic System-Integration Technology Conference, ESTC 2018 - Proceedings, 26 November 2018, article number 8546382
Lee, Shi-wei; Xu, Qianwen; Lo, Chi Chuen

Analysis of pulse-driven LED junction temperature and its reliability

2018 15th China International Forum on Solid State Lighting: International Forum on Wide Bandgap Semiconductors China, SSLChina: IFWS 2018 / IEEE. New York, NY, USA : IEEE, 2018, p. 23-26, Article no.: 8587392
Yang, Nick G. M.; Shieh, Brian Y. R.; Zeng, Trio F. Y.; Lee, Shi-wei

Broadband Emission of Asymmetric Pyramids obtained by Laser Drilling and SAG for Application of Phosphor Free White LEDs

EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging, March 2019, article number 8660821
Tian, Zhenhuan; Li, Qiang; Su, Xilin; Zhang, Ye; Guo, Maofeng; Zhang, Minyan; Ding, Wen; Li, Yufeng; Yun, Feng; Lee, Shi-wei

Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration

Proceedings - Electronic Components and Technology Conference, v.2018-May, August 2018, article number 8429574, p. 355-363
Ko, Cheng-Ta; Yang, Henry; Lau, John H.; Li, Ming; Li, Margie; Lin, Curry; Lin, J.W.; Chen, Tony; Xu, Iris; Chang, Chieh-Lin; Pan, Jhih-Yuan; Wu, Hsing-Hui; Yong, Qing Xiang; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee; Cheung, Yiu Ming; Ng, Eric; Kai, Wu; Hao, Ji; Beica, Rozalia; Lin, Marc; Chen, Yu-Hua; Cheng, Zhong; Wee, Koh Sau; Ran, Jiang; Xi, Cao; Lim, Sze Pei; Lee, N.C.; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei

Determination of a Meaningful Warpage Acceptance Criterion for Large PBGA Components Through the Correlation with Scattering in Material Properties

Proceedings - Electronic Components and Technology Conference, v. 2018-May, August 2018, article number 8429625, p. 718-723
Zhang, Qiming; Lo, Jeffery.C.C.; Lee, Shi-wei; Xu, Wei

Effect of Material Properties and Bump Parameters on Capillary Filling in Through-Silicon-Via Underfill Dispensing

2018 20th International Conference on Electronic Materials and Packaging (EMAP), March 2019, article number 8660884
Le, Fuliang; Lee, Shi-wei; Tao, Mian; Lo, Chi Chuen

Fan-out wafer-level packaging for heterogeneous integration

Proceedings - Electronic Components and Technology Conference, v.2018-May, August 2018, article number 8429869, p. 2360-2366
Lau, John H.; Li, Ming; Li, Margie; Chen, Tony; Xu, Iris; Yong, Qing Xiang; Cheng, Zhong; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee; Cheung, Yiu Ming; Ng, Eric; Lo, Penny; Kai, Wu; Hao, Ji; Wee, Koh Sau; Ran, Jiang; Xi, Cao; Beica, Rozalia; Lim, Sze Pei; Lee, N. C.; Ko, Cheng-Ta; Yang, Henry; Chen, Yu-Hua; Tao, Mian; Lo, Jeffery; Lee, Shi-wei

Investigation of Light Scattering Effect Impact on Optical Performance of Phosphor Converted White Light Emitting Diodes

EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging, March 2019, article number 8660928
Wang, Jiaqi; Lee, Shi-wei; Shieh, Brian

Investigation of the Influence of Packaging Material Degradation on the Optical Performance of Phosphor Converted White Light Emitting Diodes

EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging, March 2019, article number 8660758
Wang, Jiaqi; Lee, Shi-wei; Shieh, Brian

Measurement of Dynamic Junction Temperature for LED Flash Units of Camera

Proceedings - 2018 19th International Conference on Electronic Packaging Technology, ICEPT 2018 / IEEE. New York, NY, USA : IEEE, 2018, Article no.: 8480831
Shieh, Brian; Zeng, Fangyun; Lee, Shi-wei; Yang, Guoming

Quantum Dot Light Emitting Diodes Based on ZnO Nanoparticles

EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging, March 2019, article number 8660807
Tu, Ning; Kwok, Z. H. Eric; Lee, Shi-wei

Reliability of Fan-out Wafer-level Packaging With Large Chips And Multiple Re-distributed Layers

Proceedings - Electronic Components and Technology Conference, v. 2018-May, August 2018, article number 8429752, p. 1574-1582
Lau, John Hon Shing; Li, Ming; Yang, Lei; Yong, Qing Xiang; Cheng, Zhong; Chen, Tony; Xu, Iris; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee Raymond; Cheung, Yiu Ming; Ng, Eric; Lo, Penny; Kai, Wu; Hao, Ji; Beica, Rozalia; Wee, Koh Sau; Ran, Jiang; Xi, Cao; Lim, Sze Pei; Lee, NC; Ko, Cheng Ta; Yang, Henry; Chen, YH; Tao, Mian; Lo, Jeffery C.C.; Lee, Shi-wei

Solderability Evaluation of Printed Silver Solder Pad for Wafer-level Packaging

2018 International Conference on Electronics Packaging and iMAPS All Asia Conference, ICEP-IAAC 2018, 1 January 2018, article number 8374321, p. 350-354
Tao, Mian; Lo, Chi Chuen; Liou, Ying Hong; Chiu, Peter; Lee, Shi-wei

Thermal Characterization of Multi-chip Light Emitting Diodes With Thermal Resistance Matrix

2017 14th China International Forum on Solid State Lighting: International Forum on Wide Bandgap Semiconductors China, SSLChina: IFWS 2017, v. 2018-January, January 2018, p. 32-37
Zou, Huayong; Lu, Lingyan; Wang, Jiaqi; Shieh, Brian; Lee, Shi-wei

Thermal Simulation for High Power LED Systems with Remote Phosphor Layer

EMAP 2018 - 2018 20th International Conference on Electronic Materials and Packaging, March 2019, article number 8660903
Zhang, Minshu; Xie, An; Lo, Chi Chuen; Lee, Shi-wei; Ahmatjan, Madina; Hong, Feichi; Yin, Haotian
Article 3

3D Chip Stacking with through Silicon-vias (TSVs) for Vertical Interconnect and Underfill Dispensing

Journal of Micromechanics and Microengineering, v. 27, (4), March 2017, article number 045012
Le, Fuliang; Lee, Shi-wei; Zhang, Qiming

Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs)

Journal of Microelectronics and Electronic Packaging, v. 14, (4), October 2017, p. 123-131
Lau, John H.; Li, Ming; Fan, Nelson; Kuah, Eric; Li, Zhang; Tan, Kim Hwee; Chen, Tony; Xu, Iris; Li, Margie; Cheung, Y.M.; Kai, Wu; Hao, Ji; Beica, Rozalia; Taylor, Tom; Ko, C. T.; Yang, Henry; Chen, Y. H.; Lim, Sze Pei; Lee, N. C.; Ran, Jiang; Wee, Koh Sau; Yong, Qingxiang; Xi, Cao; Tao, Mian; Lo, Chi Chuen; Lee, Shi-wei

Growth, Characterization, and Application of Well-defined Separated Gan-based Pyramid Array on Micropatterned Sapphire Substrate

Applied Physics Express, v. 10, (9), September 2017, article number 092101
Tian, Zhenhuan; Li, Yufeng; Su, Xilin; Feng, Lungang; Wang, Shuai; Zhang, Minyan; Ding, Wen; Li, Qiang; Zhang, Ye; Guo, Maofeng; Yun, Feng; Lee, Shi-wei
Conference paper 9

A Novel Chip-on-Board White Light-emitting Diode Design for Light Extraction Enhancement

Conference Proceedings - 2016 13th China International Forum on Solid State Lighting, SSLCHINA 2016 / IEEE. New York, NY, USA : IEEE, 2017, p. 24-27, Article no.: 7804342
Zou, Huayong; Wang, Jiaqi; Feng, Mingxin; Shieh, Brian; Lee, Shi-wei

Effect of the Surface Curvature of the Phosphor Layer on the Optical Performance of a WLED

Conference Proceedings - 2016 13th China International Forum on Solid State Lighting, SSLCHINA 2016 / IEEE. New York, NY, USA : IEEE, 2016, p. 20-23, Article no.: 7804341
Wang, Jiaqi; Lee, Shi-wei; Zou, Huayong

Effects of Interconnect Layout and Underfill Thermal Conductivity on the Thermal Resistance of Flip-Chip LEDs


Shang, Andrew Weber; Cai, Yuefei; Lo, Chi Chuen; Lee, Shi-wei

Investigation on the Influence of Phosphor Particle Size Gradient on the Optical Performance of White Light-Emitting Diodes

Proceedings of the 2016 IEEE 18th Electronics Packaging Technology Conference, EPTC 2016 / IEEE. New York, NY, USA : IEEE, 2017, p. 259-263, Article no.: 7861483
Wang, Jiaqi; Lee, Shi-wei; Zou, Huayong

Investigation the Effect of Silane onto Fabricating Polymer Insulation Layer by Spin-coating for through Silicon Vias

18th International Conference on Electronic Packaging Technology, ICEPT 2017, September 2017, article number 8046728, p. 1537-1541
Liu, Qiang; Zhang, Guoping; Sun, Rong; Lee, Shi-wei; Wong, C.P.

Modeling of Residual Strain in BGA-PCB Assemblies for Pad Cratering Control

Proceedings of the 16th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2017 / IEEE. New York, NY, USA : IEEE, 2017, p. 1153-1160, Article no.: 7992619
Zhang, Qiming; Lo, Chi Chuen; Lee, Shi-wei

Packaging of UV LED with a Stacked Silicon Reflector for Converged UV Emission

2017 International Conference on Electronics Packaging, ICEP 2017 / IEEE. New York, NY, USA : IEEE, 2017, p. 259-263, Article no.: 7939371
Qiu, Xing; Lo, Chi Chuen; Lee, Shi-wei

Pad Cratering Based Failure Criterion for the Life Prediction of Board Level Cyclic Bending Test

Proceedings - IEEE 67th Electronic Components and Technology Conference, 1 August 2017, article number 7999729, p. 448-455
Zhang, Qiming; Lo, Chi Chuen; Lee, Shi-wei

Transient Light Emission Microscopy for Detecting the Non-Uniform Junction Temperature in Flip-Chip Light Emitting Diodes

Proceedings IEEE Semiconductor Thermal Measurement and Management Symposium, v. 2017, April 2017, article number 7896944, p. 297-301, 2017 Thirty-Third Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Semi-Therm)
Tao, Mian; Lee, Shi-wei
Article 2

An Implantable Medical Device for Transcorneal Electrical Stimulation: Packaging Structure, Process Flow, and Toxicology Test

IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 6, (8), Aug 2016, article number 7509610, p. 1174-1180
Le, Fuliang; Lo, Chi Chuen; Qiu, Xing; Lee, Shi-wei; Li, Xing; Tsui, Chi Ying; Ki, Wing Hung

Experimental investigation of the failure mechanism of Cu-Sn intermetallic compounds in SAC solder joints

Microelectronics Reliability, v. 62, July 2016, p. 130-140
Yang, Chaoran; Le, Fuliang; Lee, Shi-wei
Book chapter 1

Characterisation of Copper Diffusion in Through Silicon Vias

Materials for Advanced Packaging / Edited by Daniel Lu, C. P. Wong. Cham, Switzerland : Springer, 2016, p. 923-951, Ch. 22
Zhang, Xiaodong; Lee, Shi-wei; Le, Fuliang
Conference paper 15

A Method for Measuring Thermal Conductivity of Paste Materials

2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, 4 October 2016, article number 7583185, p. 510-513
Feng, Wilson; Zhao, Fanny; Shieh, Brian; Lee, Shi-wei

Application of Nano Silver sintering Technique on the Chip Bonding for Flip-chip and Vertical Light Emitting Diodes

2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, October 2016, article number 7583297, p. 1004-1009
Tao, Mian; Mei, Yunhui; Lee, Shi-wei; Yun, Feng; Lu, Guoquan

Characterization of Orthotropic CTE of BT Substrate for PBGA Warpage Evaluation

Proceedings of the 15th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2016 / IEEE. New York, NY, USA : IEEE, 2016, p. 1312-1319, Article no.: 7517700
Zhang, Qiming; Lo, Chi Chuen; Lee, Shi-wei; Xu, Wei; Yang, Weihua

Correlation of Board and Joint Level Test Methods with Strain Dominant Failure Criteria for Improving the Resistance to Pad Cratering

2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, October 2016, article number 7583078, p. 1-6
Zhang, Qiming; Lo, Chi Chuen; Lee, Shi-wei

Effect of Substrate Dimensions and Boundary Conditions on the Heat Spreading of LED Package

2016 International Conference on Electronics Packaging (ICEP), June 2016, article number 7486781, p. 52-56
Lee, Shi-wei; Tian, Zhenhuan; Zhang, Minshu; Xie, An

Electroplating Fabrication and Characterization of Sn-Ag-Cu Eutectic Solder Films

2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, October 2016, article number 7583144, p. 318-321
Xie, Jinqi; Zhong, Zhe; Zhang, Kai; Yuen, Matthew Ming Fai; Lee, Shi-wei; Fu, Xianzhu; Sun, Rong; Wong, Chingping

Experimental Parametric Study on the Bumping and Coining of Gold Studs for Flip Chip Bonding

China Semiconductor Technology International Conference 2016, CSTIC 2016 / IEEE. New York, NY, USA : IEEE, 2016, Article no.: 7463955
Ren, Rongbin; Qiu, Xing; Lo, Chi Chuen; Lee, Shi-wei

Fabricating Photosensitive Polymer Insulation Layer by Spin-coating for Through Silicon Vias

2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, October 2016, article number 7583171, p. 439-442
Liu, Qiang; Zhang, Guoping; Sun, Rong; Lee, Shi-wei; Wong, Chingping

Investigation of Reliability of EMC and SMC on Reflectance for UV LED Applications

2016 17th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016 / IEEE. New York, NY, USA : IEEE, 2016, p. 658-664, Article no.: 7463398
Qiu, Xing; Lo, Chi Chuen; Shang, Andrew W.; Lee, Shi-wei

Low Melting Alloy Composites as Thermal Interface Materials with Low Thermal Resistance

2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, October 2016, article number 7583147, p. 331-333
Wen, Haoran; Ji, Yaqiang; Zhang, Kai; Yuen, Matthew Ming Fai; Lee, Shi-wei; Fu, Xianzhu; Sun, Rong; Wong, Chingping

Low-dielectric-constant Novel Periodic Mesoporous Organosilica Thin Film for Interlayer Dielectric

2016 17th International Conference on Electronic Packaging Technology, ICEPT 2016, October 2016, article number 7583109, p. 153-156
Zhang, Jiawei; Zhang, Guoping; Sun, Rong; Lee, Shi-wei; Wong, Chingping

Novel Periodic Mesoporous Organosilica Thin Film with Low Dielectric Constant and High Mechanical Property

China Semiconductor Technology International Conference 2016, CSTIC 2016 / IEEE. New York, NY, USA : IEEE, 2016, Article no.: 7463952
Zhang, Jiawei; Zhang, Guoping; Sun, Rong; Lee, Shi-wei; Wong, Chingping

Numerical Prediction and Experimental Validation of Multiple Phosphor White LED Spectrum

2016 International Conference on Electronics Packaging, ICEP 2016, June 2016, article number 7486782, p. 57-61
Lo, Chi Chuen; Lee, Shi-wei; Guo, Xungao; Zhao, Huishan

Sensitivity Study on the Precision of Data Acquisition for LED Life Prediction Based on the Degradation of Luminous Output

2016 6th Electronic System-Integration Technology Conference, ESTC 2016 / IEEE. New York, NY, USA : IEEE, 2016, Article no.:7764509
Lo, Jeffrey Chi Chuen; Yang, Guoming; Tao, Mian; Lee, Shi-wei

Void-Free Underfill Encapsulation for Flip Chip High Voltage LED Packaging

China Semiconductor Technology International Conference 2016, CSTIC 2016 / IEEE. New York, NY, USA : IEEE, 2016, Article no.: 7463954
Shang, Andrew Weber; Qiu, Xing; Lo, Chi Chuen; Lee, Shi-wei; Le, Fuliang
Article 3

Failure Analysis and Experimental Verification for Through-Silicon-via Underfill Dispensing on 3-D Chip Stack Package

IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 5, (10), October 2015, p. 1525-1532
Le, Fuliang; Lee, Shi-wei; Lo, Chi Chuen; Yang, Chaoran

Lens Forming by Stack Dispensing for LED Wafer Level Packaging

IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 5, (1), January 2015, article number 6965571, p. 15-20
Zhang, Rong; Lee, Shi-wei; Lo, Chi Chuen

Parameter Correlation and Computational Modeling for the Flow of Encapsulant in Through-Silicon-Via Underfill Dispensing

IEEE Transactions on Components, Packaging and Manufacturing Technology, v. 5, (8), August 2015, article number 7163313, p. 1178-1185
Le, Fuliang; Lee, Shi-wei; Yang, Chaoran; Lo, Chi Chuen
Conference paper 10

Detection of the Non-uniformity of Junction Temperature in Large Light-emitting Diode Using an Improved Forward Voltage Method

2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2015 / IEEE. New York, NY, USA : IEEE, 2015, Article no.: 7103108
Tao, Mian; Lee, Shi-wei

Fabricating Polymer Insulation Layer by Spin-coating for Through Silicon Vias

Proceedings - Electronic Components and Technology Conference, v. 2015-July, July 2015, article number 7159872, p. 1973-1979
Zhang, Guoping; Jiang, Kun; Liu, Qiang; Li, Jinhui; Sun, Rong; Lee, Shi-wei; Wong, C. P.

Fluxless Packaging of an Implantable Medical Device for Transcorneal Electrical Stimulation

Proceedings of the Electronic Packaging Technology Conference, EPTC, v. 2016-February, February 2016, article number 7412282
Le, Fuliang; Lo, Chi Chuen; Qiu, Xing; Lee, Shi-wei; Li, Xing; Tsui, Chi Ying; Ki, Wing Hung

Influence of Rubber Nanoparticles on the Properties of Novolac-diazonaphthoquinone Based Photoresist

16th International Conference on Electronic Packaging Technology, ICEPT 2015 / He, H., Bi, K., & Zhu, W. eds.. New York, NY, USA : IEEE, 2015, p. 1039-1042, Article no.: 7236757
Liu, Qiang; Zhang, Guoping; Sun, Rong; Lee, Shi-wei; Wong, Chingping

Investigation of the Influence of Ag Reflective Layer on the Correlated Color Temperature and the Angular Color Uniformity of LED with Conformal Phosphor Coating

16th International Conference on Electronic Packaging Technology, ICEPT 2015 / He, H., Bi, K., & Zhu., W eds. New York, NY, USA : IEEE, 2015, p. 830-834, Article no.: 7236709
Tian, Zhenhuan; Lo, Chi Chuen; Lee, Shi-wei; Yun, Feng; Sun, Rong

Investigation on the Thermal Degradation Mechanism of Cu-Sn Intermetallic Compound in SAC Solder Joints with Cohesive Zone Modeling

Proceedings - Electronic Components and Technology Conference, v. 2015-July, July 2015, article number 7159722, p. 1029-1037
Yang, Chaoran; Lee, Shi-wei

Modeling and Parametric Study of Light Scattering, Absorption and Emission of Phosphor in a White Light-Emitting Diode

International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, 2015, v. 2, 2015, article number V002T02A046
Wang, Jiaqi; Lo, Chi Chuen; Lee, Shi-wei; Yun, Feng; Tao, Mian

Simulation and Optimization on Thermal Performance of LED Filament Light Bulb

2015 12th China International Forum on Solid State Lighting, SSLCHINA 2015 / IEEE. New York, NY, USA : IEEE, 2015, p. 88-92, Article no.: 7360696
Feng, Wilson; Feng, Bruce; Zhao, Fanny; Shieh, Brian; Lee, Shi-wei

Thermally Conductive Adhesives Based on Silver Coated Copper Flake Fillers

16th International Conference on Electronic Packaging Technology, ICEPT 2015 / He, H., Bi, K., & Zhu, W. eds. New York, NY, USA : IEEE, 2015, p. 294-296, Article no.: 7236595
Xie, Jinqi; Ren, Huming; Zhang, Kai; Yuen, Matthew Ming Fai; Lee, Shi-wei; Fu, Xianzhu; Sun, Rong; Wong, Chingping

Wafer Level Bumping Technology for High Voltage LED Packaging

2015 10th International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT 2015 - Proceedings / IEEE. New York, NY, USA : IEEE, 2015, p. 54-57, Article no. 7365183
Wei, Tiwei; Qiu, Xing; Lo, Chi Chuen; Lee, Shi-wei
Article 4

Comparison of ball pull strength among various Sn-Cu-Ni solder joints with different pad surface finishes

Journal of Electronic Packaging, Transactions of the ASME, v. 136, (1), March 2014, article number 011003
Yang, Chaoran; Song, Fubin; Lee, Shi-wei

Electrical-thermal-luminous-chromatic model of phosphor-converted white light-emitting diodes

Applied Thermal Engineering, v. 63, (2), February 2014, p. 588-597
Ye, Huaiyu; Koh, Sau Wee; Yuan, Cadmus; van Zeijl, Henk; Gielen, Alexander W.J.; Lee, Shi-wei; Zhang, Guoqi

Impact of Ni Concentration on the Intermetallic Compound Formation and Brittle Fracture Strength of Sn-Cu-Ni (SCN) Lead-free Solder Joints

Microelectronics Reliability, v.`54, (2), February 2014, p. 435-446
Yang, Chaoran; Song, Fubin; Lee, Shi-wei

废旧BGA器件二次利用的焊接强度研究

电子元件与材料=Electronic Components & Materials, v. 33, (12), December 2014, p. 94-97
张旻澍; 谢安; 卢智铨; 李世玮
Conference paper 5

Development of a real-time monitoring system with uni-photodetector for LED long term reliability tests

Proceedings: 2014 15th International Conference on Electronic Packaging Technology (ICEPT 2014), August 2014, article number 6922933, p. 1477-1481
Zhang, Grace G.; Lu, Sophie L.Y.; Yang, Nick G.M.; Zou, Sam H.Y.; Zhong, Steven D.L.; Lo, Chi Chuen; Lee, Ricky Shi Wei

Lens forming by stack dispensing for LED wafer level packaging

2014 International Conference on Electronics Packaging, ICEP 2014 / IEEE. Piscataway, NJ : IEEE, 2014, p. 670-675, Article number 6826763
Zhang, Rong; Lee, Ricky Shi Wei; Lo, Chi Chuen

Multilayer Dispensing of Remote Phosphor for LED Wafer Level Packaging with Pre-formed Silicone Lens

Proceedings of the 5th Electronics System-Integration Technology Conference, ESTC 2014, 2014, article number 6962713
Lo, Chi Chuen Jeffrey; Lee, Ricky Shi Wei; Guo, Xungao; Zhao, Huishan

O2 plasma treatment in polymer insulation process for through silicon vias

Proceedings of the Electronic Packaging Technology Conference, EPTC, October 2014, article number 6922644, p. 235-238
Zhuang, Lulu; Jiang, Kun; Zhang, Guoping; Tang, Jiaoning; Sun, Rong; Lee, Ricky Shi Wei

Through Silicon Underfill Dispensing for 3D Die/Interposer Stacking

Proceedings - Electronic Components and Technology Conference, September 2014, article number 6897397, p. 919-924
Le, Fuliang; Lee, Ricky Shi-wei; Lau, Kei May; Yue, Chik Patrick; Sin, Johnny Kin On; Mok, Philip Kwok Tai; Ki, Wing Hung; Choi, Hoi Wai
Article 1

電子材料界面裂紋的新型濕氣壓力模型

電子元件與材料=Electronic Components & Materials, (2), 2013, p. 62-65
張旻澍; 李世瑋; 盧智銓
Conference paper 12

Assessment of solder pad cratering strength using cold pin pull test method with pre-fabricated pin arrays

Proceedings - 2013 IEEE 63rd Electronic Components Conference, May 2013, article number 6575818, p. 1788-1793
Zhang, Qiming; Yang, Chaoran; Tao, Mian; Song, Fubin; Lee, Shi Wei Ricky

Brittle Fracture of Intermetallic Compounds in SAC Solder Joints under High Speed Ball Pull/Pin Pull and Charpy Impact Tests

2013 IEEE 63rd Electronic Components and Technology Conference (ECTC 2013), Institute of Electrical and Electronics Engineers (IEEE), 2013, p. 1294-1299
Yang, Chaoran; Xu, Guangsui; Lee, Ricky Shi-wei; Zhang, Xinping

Design and Implementation of Fine Pitch COB LED Display

2013 10th China International Forum on Solid State Lighting, ChinaSSL 2013, 2013, article number 7177325, p. 108-111
Yang, Nick G.M.; Jin, Gavin S.G.; Niu, Mike D.Y.; Gao, Andy G.X.; Lee, S. W. Ricky

Experimental Characterization of Adhesion Strength between the Silicone Encapsulant and the Bottom of a SMD LED Leadframe Cup

Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, 2013, article number 6756676, p. 1212-1216
Zou, Sam H.Y.; Tao, Mian; Lo, Chi Chuen; Lee, Shi-Wei Ricky

Investigation on the Properties and Processability of Polymeric Insulation Layers for Through Silicon Via

Proceedings - Electronic Components and Technology Conference, 2013, article number 6575554, p. 81-85
Zhao, Songfang; Zhang, Guoping; Peng, Chongnan; Sun, Rong; Lee, Ricky S W; Zhu, Wenhui; Lai, Fangqi

LED Wafer Level Packaging with a Heimisphrical Waffle Pack Remote Phosphor Layer


Liu, Huihua; Lo, Chi Chuen; Lee, Shi-Wei Ricky; Zhao, Huishan

Measurement and Analysis of Interfacial Adhesion Strength between the Silicone Encapsulant and the Side Wall of a SMD LED Leadframe Cup

Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, 2013, article number 6756544, p. 612-616
Zhong, Steven D.L.; Zou, Sam H.Y.; Lo, Chi Chuen; Lee, Shi-Wei Ricky

Optical Characterization of a Light Bulb with the Waffle Pack LED WLP Module

2013 10th China International Forum on Solid State Lighting, ChinaSSL 2013, 2013, article number 7177334, p. 142-146
Liu, Huihua; Lo, Jeffery C.C.; Lee, Shi Wei Ricky

Quasi-conformal Phosphor Dispensing on LED for White Light Illumination

2013 IEEE 63rd Electronic Components and Technology Conference (ECTC 2013), Institute of Electrical and Electronics Engineers (IEEE), 2013, p. 563-567
Lee, Shi Wei Ricky; Guo, Xungao; Niu, Daoyuan; Lo, Chi Chuen

Remote Phosphor Deposition on LED Arrays with Pre-encapsulated Silicone Lens

2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2013), Institute of Electrical and Electronics Engineers (IEEE), 2013
Lo, Chi Chuen; Liu, Huihua; Lee, Shi Wei Ricky; Gu, Xungao; Zhao, Huishan

Thermal Characterization of a Printed Circuit Board with Thermal Vias for The Application of High Brightness Light-emitting Diodes

China International Forum on Solid State Lighting, ChinaSSL, v. 2013, 2013, article number 7177331, p. 128-131
Tao, Mian; Feng, Zicheng; Swanson, John; Ganjei, John; Lo, Chi Chuen; Lee, Shi Wei Ricky

Wetting Behavior of Polymer Liquid in Insulation Process for through Silicon via

2013 14th International Conference on Electronic Packaging Technology (ICEPT 2013), Institute of Electrical and Electronics Engineers (IEEE), 2013, p. 360-363
Zhao, S.; Zhang, G.; Sun, R.; Lee, S.W.R.
Article 5

Design and Fabrication of a Silicon Interposer With TSVs in Cavities for Three-Dimensional IC Packaging

IEEE Transactions on Device and Materials Reliability, v. 12, (2), June 2012, article number 6168823, p. 189-193
Zhang, Rong; Lo, Chi Chuen; Lee, Shi-wei

Emerging trend for LED wafer level packaging

Frontiers of Optoelectronics, v. 5, (2), June 2012, p. 119-126
Lee, Shi-wei; Zhang, Rong; Chen, Kewei; Lo, Chi Chuen

Moldless encapsulation for LED wafer level packaging using integrated DRIE trenches

Microelectronics Reliability, v. 52, (5), May 2012, p. 922-932
Zhang, Rong; Lee, Shi-wei

Reliability of high-power LED packaging and assembly

Microelectronics Reliability, 52, (5), May 2012, p. 761-761
Liu, Cheng-Yi; Lee, Shi-wei; Shin, Moo Whan; Lai, Yi-Shao

電子塑封材料的高溫界面強度研究

电子元件与材料=Electronic Components & Materials, v. 31, (7), 2012, p. 67-69
張旻澍; 謝安; 李世瑋; 盧智銓
Book chapter 1

绿色电子封装技术与材料

绿色微纳电子学 /王阳元 编. 北京: 科学出版社, 2010, p. 223-306
李世玮; 程玉华; 宋复斌; Lo, Chi Chuen
Conference paper 16

Assessment of Non-uniform Temperature Effect on BGA De-component Process

2012 IEEE 62ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2012, p. 977-980
Tang, Kun; Song, Fubin; Lee, Ricky Shi Wei; Lo, Chi Chuen

Comparative Study on Dendrite Formation on Solder Pads with ImAg and OSP Surface Finishes Using Water Drop Test Method

12th International Conference on Electronics Packaging (ICEP), Tokyo, Japan, April 17-20 2012, p. 274-279
Tang, Kun; Song, Fubin; Lee, Shi-Wei Ricky

COMPARISON OF FATIGUE CRACK INITIATION/PROPAGATION AND DAISY-CHAIN RESISTANCE IN LEAD-FREE SOLDER JOINTS UNDER TEMPERATURE CYCLING TEST

PROCEEDINGS OF THE ASME PACIFIC RIM TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC SYSTEMS, MEMS AND NEMS 2011, VOL 1, 2012, p. 579-583
Chan, Yuen Sing; Song, Fubin; Lee, Shi Wei Ricky; Yang, Chaoran; Lo, Chi Chuen

Determination of Driving Current of RGB LEDs for White Light Illumination

2012 13TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2012), 2012, p. 1540-1545
Zhao, Huishan; Lee, Ricky Shi Wei

Development of innovative cold pin pull test method for solder pad crater evaluation


Zhang, Qiming; Yang, Chaoran; Tao, Mian; Song, Fubin; Lee, Ricky Shi Wei

Different Morphologies of Nano-ZnO Affection on Properties of Transparent Epoxy Resin Encapsulants

14th International Conference on Electronic Materials and Packaging, EMAP 2012, 2012, sesion P048, article number 6507893
Peng, Chongnan; Zhang, Guoping; Sun, Rong; Lee, Ricky

Effect of Die Attach Adhesive Defects on the Junction Temperature Uniformity of LED Chips

35th International Electronics Manufacturing Technology (IEMT) Conference, Ipoh, Malaysia, 6-8 November 2012, session number P141
Tao, Mian; Lee, Shi-Wei Ricky; Yuen, Mathew M.F.; Zhang, Guoqi; Driel, W. van

Effects of GaN Blue LED Chip and Phosphor on Optical Performance of White Light LED

2012 2nd IEEE CPMT Symposium Japan, ICSJ 2012, Kyoto, Japan, 10-12 Dec 2012, session P11-3, article number 6523414
Zhao, Huishan; Chen, Changying; Lee, Shi-Wei Ricky

Fast Copper Plating Process for Through Silicon Via (TSV) Filling

ASME 2011 International Mechanical Engineering Congress and Exposition, IMECE 2011, v. 11, 2011, p. 855-863
Wang, Su; Lee, Shi-wei Ricky

Investigation of fracture behaviors of Cu-Sn intermetallics using impact test

2012 2nd IEEE CPMT Symposium Japan, ICSJ, Kyoto, Japan, 10-12 Dec 2012, session P11-4, article number 6523420
Yang, Chaoran; Lee, Ricky Shi-wei

Investigation on Mechanical Properties and Bonding Parameters of Copper Wire Bonding

12th International Conference on Electronics Packaging (ICEP), Tokyo, Japan, 17-20 April 2012, p. 654-660
Cao, Jun; Ding, Yutian; Lee, Shi-Wei Ricky

LED wafer level packaging with a remote phosphor cap

14th International Conference on Electronic Materials and Packaging, EMAP 2012, 2012, session P068, article number 6507885
Liu, Huihua; Zhang, Rong; Lo, Chi Chuen; Lee, Shi-Wei Ricky

Reverse wire bonding and phosphor printing for LED wafer level packaging

Proceedings - Electronic Components Conference, 2012, p. 1814-1818
Lo, Chi Chuen; Lee, Shi-Wei Ricky; Zhang, Rong; Li, Mei

TSV Plating Using Copper Methanesulfonate Electrolyte with Single Component Suppressor

4th IEEE Electronics System-integration Technology Conference (ESTC), Amsterdam, Netherlands, 17-20 September, p. 1-5
Wu, Hailong; Lee, Shi-Wei Ricky

Ultrasonic Inspection of Package Internal Defects Considering Multiple Interface Effects

14th International Conference on Electronic Materials and Packaging, EMAP 2012, 2012, session P061, article number 6507881
Zhang, Minshu; Lo, Chi Chuen; Lee, Shi-Wei Ricky

Underfill dispensing for 3D die stacking with through silicon vias

Proceedings - 2012 45th International Symposium on Microelectronics, IMAPS 2012, San Diego, California, USA, 2012, p. 548-553
Le, Fuliang; Lee, Ricky Shi-wei; Wu, Jingshen; Yuen, Matthew Ming Fai
Article 3

Embedded Three-Dimensional Hybrid Integrated Circuit Integration System-in-Package With Through-Silicon Vias for Opto-Electronic Interconnects in Organic Substrates/Printed Circuit Boards

Journal of Electronic Packaging, Transactions of ASME, v. 133, (3), September 2011, article number 031010
Lau, John H.; Zhang, M. S.; Lee, Shi-wei

Investigation on Copper Diffusion Depth in Copper Wire Bonding

Microelectronics Reliability, v. 51, (1), January 2011, p. 166-170
Chen, Catherine H.; Zhang, Shawn X.; Lee, Shi-wei; Mohamed, Lebbai

Spacing optimization of high power LED arrays for solid state lighting

Journal of Semiconductors, v. 32, (1), January 2011, article number 014005
Chan, Yuen Sing; Lee, Shi-wei
Book chapter 2

Shock test methods and test standards for portable electronic devices

Structural Dynamics of Electronic and Photonic Systems / Edited by Ephraim Suhir, David S. Steinberg, T. X. Yu. Hoboken, New Jersey : John Wiley & Sons, Inc., 2011, p. 159-173, Ch. 7
Zhou, C.Y.; Yu, Tongxi; Lee, Shi-wei; Suhir, Ephraim

Technologies and Materials for Green IC Packaging

Green Micro/Nano Electronics / Wang, Yangyuan, Cheng, Yuhua, Chi, Minhwa. Berlin: Springer, p. 248-359
Lee, Ricky Shi Wei; Cheng, Y.; Song, F.; Lo, Irene M C
Conference paper 13

A comparison of copper sulfate and methanesulfonate electrolytes in the copper plating process for through silicon via metallization

Advanced Packaging Materials, International Symposium on, 2011, p. 291-296
Wu, H.L.H.; Lee, Ricky Shi Wei

Advanced LED wafer level packaging technologies

Proceedings of technical papers, 2011, p. 71-74
Lee, Shi-Wei Ricky

Characterization and Comparison between the SnCuNi IMC in SnCu Solder with ENIG Pad Finish and in SnCuNi Solder with OSP Pad Finish

2011 International Conference on Electronic Materials and Packaging (EMAP), Kyoto, Japan, 2011
Yang, Chaoran; Song, Fubin; Lee, Ricky Shi-wei

Computational parametric study on the strain hardening effect of lead-free solder joints in board level mechanical drop tests

EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings, 2011
Jiang, Tong; Xu, Zhengjian; Lee, Shi Wei Ricky; Song, Fubin; Lo, Chi Chuen; Yang, Chaoran

Considerations in solution stabilization for thermal fatigue modeling of lead-free solder joints

Proceedings - Electronic Components Conference, 2011, p. 1070-1078
Chan, Y.S.; Lee, Ricky Shi Wei

Effect of interfacial strength between Cu6Sn5 and Cu3Sn intermetallics on the brittle fracture failure of lead-free solder joints with OSP pad finish

Proceedings - Electronic Components Conference, 2011, p. 971-978
Yang, C.; Song, F.; Lee, Ricky Shi Wei

Enhancement of thermal conductivity of die attach adhesives (DAAs) using nanomaterials for high brightness light-emitting diode (HBLED)

Proceedings - Electronic Components Conference, 2011, p. 667-672
Lu, D.; Liu, C.; Lang, X.; Wang, B.; Li, Z.; Lee, W.M.P.; Lee, Ricky Shi Wei

Evaluation of polymer wafer bonding with silicone adhesive and patterned trenches

2011 12th Int. Conf. on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2011, 2011
Lo, Chi Chuen; Zhang, R.; Lee, Ricky Shi Wei; Wang, Z.

Investigation on lead-free solder joint reliability of edge-bonded CBGA under temperature cycling

ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging, 2011, p. 500-505, Article number6066885
Chan, Y.S.; Song, F.; Lee, Ricky Shi Wei

LED packaging using silicon substrate with cavities for phosphor printing and copper-filled TSVs for 3D interconnection

Proceedings - 2011 IEEE 61st Electronic Components and Technology Conference (ECTC), June 2011, article number 5898727, p. 1616-1621
Zhang, Rong; Lee, Shi-wei; Xiao, David Guowei; Chen, Haiying

Mechanical shock test performance of SAC105 (Sn-1.0Ag-0.5Cu) and Sn-3.5Ag, BGA components with SAC305 solder paste on NiAu and OSP board surface finishes

IPC APEX EXPO Technical Conference 2011, v. 4, 2011, p. 3014-3077
Bath, Jasbir; Eagar, Wade; Bigcraft, Chad; Newman, Keith; Hu, Livia; Henshall, Gregory; Nguyen, Jennefier; Lee, M.J.; Syed, Ahmer; Xie, Weidong; Song, Fubin; Lee, Ricky

Nondestructive inspection of through silicon via depth using scanning acoustic microscopy

International Microsystems Packaging Assembly and Circuits Technology Conference, IMPACT 2010 and International 3D IC Conference, Proceedings, January 2011, article number 5699482
Zhang, Minshu; Lee, Shi-wei; Wu, Hailong; Zhang, Rong

Study on copper plating solutions for fast filling of through silicon via (TSV) in 3D electronic packaging

Proceedings of technical papers, 2011, p. 343-346
Wu, H. L. Henry; Lee, Ricky Shi Wei
Article 2

3D IC Integration with TSV Interposers for High Performance Applications

Chip scale review, v. 14, (5), September 2010, p. 26-29
Lau, John H.; Chan, Y. S.; Lee, Shi-wei

3D LED and IC wafer level packaging

Microelectronics International, v. 27, (2), May 2010, p. 98-105
Lau, John; Lee, Shi-wei; Yuen, Ming Fai; Chan, Philip Ching Ho
Book chapter 3

Fundamental Characteristics of Moisture Transport, Diffusion, and the Moisture-induced Damages in Polymeric Materials in Electronic Packaging

Moisture Sensitivity of Plastic Packages of IC Devices / Edited by X.J. Fan, E. Suhir. New York: Springer, c2010, chapter 1, p. 1-28
Fan, X.J.; Lee, S.W.R.

Hygrothermal Delamination Analysis of Quad Flat No-Lead (QFN) Packages

Moisture Sensitivity of Plastic Packages of IC Devices / Edited by X.J. Fan, E. Suhir. New York: Springer, c2010, chapter 15, p. 389-409
Zhang, M.S.; Lee, S.W.R.; Fan, X.J.

Nano-scale and Atomistic-scale Modeling of Advanced Materials

Nano-bio-electronic, Photonic and MEMS Packaging / Edited by C.P. Wong, Kyoung-Sik (Jack) Moon, Yi Li. New York: Springer, c2010, p. 719-758
Dai, Ruo Li; Liao, Wei-Hsin; Lin, Chun-Te; Chiang, Kuo-Ning; Lee, Shi-Wei Ricky
Conference paper 15

A novel vapor pressure transfusion model for the popcorning analysis of Quad Flat No-lead (QFN) packages

Electronics System Integration Technology Conference, ESTC 2010 - Proceedings, 2010
Zhang, Minshu; Lee, Ricky Shi Wei

ASSESSMENT OF RELATIVE THERMAL FATIGUE LIFE OF SAC LEAD-FREE AND TIN-LEAD SOLDERS WITH CUSTOM-MADE BGA ASSEMBLIES CREATING VARIOUS STRESS RANGES

IPACK 2009: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2009, VOL 1, 2010, p. 803-807
Chan, Y.S.; Yang, C.; Lee, S. W. Ricky

Comparative study of PWB pad cratering subject to reflow soldering and thermal impact

Proceedings - Electronic Components and Technology Conference, 2010, p. 464-470
Yang, Chaoran; Song, Fubin; Lee, Ricky Shi Wei; Newman, K.

Detailed investigation on the creep damage accumulation of lead-free solder joints under accelerated temperature cycling

2010 11th International Conference on Thermal, Mechanical and Multi-Physics Simulation, and Experiments in Microelectronics and Microsystems, EuroSimE 2010, 2010
Chan, Y.S.; Lee, Ricky Shi Wei

Effects of corner and edgebond epoxy adhesives on board level solder joint reliability of BGA mezzanine connectors

Proceedings - Electronic Components and Technology Conference, 2010, p. 926-934
Song, F.; Yang, C.; Henry Wu, H.L.; Lo, Chi Chuen; Ricky Lee, S.W.; Newman, K.

Embedded 3D hybrid IC integration System-in-Package (SiP) for opto-electronic interconnects in organic substrates

PROCEEDINGS OF THE ASME INTERNATIONAL MECHANICAL ENGINEERING CONGRESS AND EXPOSITION 2010, v. 4, 2010, p. 129-136
Lau, John H.; Zhang, Minshu; Lee, Shi-wei

Integration of phosphor printing and encapsulant dispensing processes for wafer level LED array packaging

Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010 / IEEE. Piscataway, NJ : IEEE, 2010, p. 1386-1392, Article number 5582822
Chen, Kewei; Zhang, Rong; Lee, Ricky Shi-wei

Modeling of board level solder joint reliability under mechanical drop test with the consideration of plastic strain hardening of lead-free solder

2010 IEEE CPMT Symposium Japan, ICSJ10, 2010
Xu, Z.J.; Jiang, Tong; Song, Fubin; Lo, Jeffery; Lee, Ricky Shi Wei

Nanoindentation characterization of lead-free solders and intermetallic compounds under thermal aging

43rd International Symposium on Microelectronics 2010, IMAPS 2010, 2010, p. 314-318
Jiang, T.; Song, Fubin; Yang, Cheng; Ricky Lee, S.W.

Novel sequential electro-chemical and thermo-mechanical simulation methodology for annular through-silicon-via (TSV) design

Proceedings - Electronic Components and Technology Conference, 2010, p. 1166-1172
Xie, B.; Shi, X.Q.; Chung, C.H.; Lee, Ricky Shi Wei

Predictive Modeling and Experimental Validation of Lead-Free Solder Joint Reliability under Temperature Cycling

2010 PROGNOSTICS AND SYSTEM HEALTH MANAGEMENT CONFERENCE, 2010, p. 585-592
Chan, Y.S.; Song, F.; Lo, C. C. Jeffery; Lee, Eddie; Lee, S. W. Ricky

Silicon Interposer with Cavities and Copper-filled TSVs for 3D Packaging


Zhang, Rong; Lee, Ricky Shi-wei

Solid State Backlight Unit with Lateral-Emitting LEDs and a Light Distributing Plate


Lee, Ricky Shi-wei; Lo, Chi Chuen; Zhang, Rong

Solid state light tube with periodic units of lateral-emitting LEDs

2010 Proceedings 60th Electronic Components and Technology Conference (ECTC), June 2010, article number 5490788, p. 673-678
Lee, Ricky Shi-wei; Zhang, Rong; Leung, Wai Lok Wesley

Thermal-enhanced and cost-effective 3D IC integration with TSV (Through-Silicon Via) interposers for high-performance applications

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE), v. 4, 2010, p. 137-144
Lau, John Hon Shing; Chan, Yuen Sing; Lee, Shi-wei
Article 4

Critical Review of the Engelmaier Model for Solder Joint Creep Fatigue Reliability

IEEE Transactions on Components and Packaging Technologies, v. 32, (3), September 2009, p. 693-700
Chauhan, Preeti; Osterman, Michael; Lee, S. W. Ricky; Pecht, Michael

Experimental investigations and model study of moisture behaviors in polymeric materials

Microelectronics Reliability, v. 49, (8), August 2009, p. 861-871
Fan, X.J.; Lee, Ricky Shi Wei; Han, Q.

Micro thermoelectric cooler: Planar multistage

International Journal of Heat and Mass Transfer, v. 52, (7-8), March 2009, p. 1843-1852
Hwang, Gisuk; Gross, Andrew J.; Kim, Hanseup; Lee, S. W.; Ghafouri, Niloufar; Huang, Baoling; Lawrence, Christin; Uher, Ctirad; Najafi, Khalil; Kaviany, Massound

Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages

IEEE Transactions on Components and Packaging Technologies, v. 32, (4), December 2009, p. 901-908
Nie, Lei; Osterman, Michael; Song, Fubin; Lo, Jeffery; Lee, S. W. Ricky; Pecht, Michael
Conference paper 13

Comparison of thermal fatigue reliability of SnPb and SAC solders under various stress range conditions

2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009, 2009, p. 1119-1123
Yang, C.; Chan, Yuen Sing; Lee, Ricky Shi Wei; Ye, Y.; Liu, S.

Comparison of Thermal Fatigue Reliability of SnPb and SAC Solders under Various Stress Range Conditions

2009 INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP 2009), 2009, p. 1038-1042
Yang, Chaoran; Chan, Yuen Sing; Lee, S. W. Ricky; Ye, Yuming; Liu, Sang

Correlation between Material Selection and Moisture Sensitivity Levels of Quad Flat No-lead (QFN) Packages

2009 EUROPEAN MICROELECTRONICS AND PACKAGING CONFERENCE (EMPC 2009), VOLS 1 AND 2, 2009, p. 563-568
Zhang, Minshu; Lee, S. W. Ricky; Zhang, Jack; Yun, Howard; Starkey, Dale; Chau, Hung

Determination of Optimal Component Spacing in a High Power Light Emitting Diode Array Assembly for Solid State Lighting

42nd International Symposium on Microelectronics (IMAPS), San Jose, CA,USA, 1-5 November, pp. 937-944
Chan, Yuan Sing; Lee, Shi-Wei Ricky

Development of surface mount compatible reel-to-reel assembly process of LED arrays for wide area general lighting

2008 International Conference on Electronic Materials and Packaging (EMAP 2008) / IEEE. Piscataway, NJ : IEEE, 2009, p. 255-258, Article number 4784277
Lee, Ricky Shi-wei; Tong, Yiu Wai; Chan, Yuen Sing; Lo, Chi Chuen; Zhang, Rong

Effect of UBM and BCB layers on the thermo-mechanical reliability of Wafer Level Chip Scale Package (WLCSP)

Procceedings of 2009 4th International Microsystems, Packaging, Assembly and Circuits Technology Conference / IEEE. Taiwan : IEEE, 2009, p. 407-410
Chan, Yuen Sing; Lee, Shi-wei; Song, Fubin; Lo, Chi Chuen; Jiang, T.

Investigation of lead-free BGA solder joint reliability under 4-point bending using PWB strain-rate analysis

Proceedings of the Electronic Packaging Technology Conference, EPTC, 2009, p. 863-868
Song, Fubin; Newman, K.; Yang, C.; Lee, Ricky Shi Wei

Investigation of Mixed SAC and SnPb Solder Balls under High Speed Ball Shear and Pull Tests

EUROSIME 2009: THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS, 2009, p. 245-252
Song, Fubin; Jiang, Tong; Lo, Chi Chuen; Lee, Ricky Shi Wei; Newman, Keith

Investigation of the Relationship between Material Selections and Moisture Sensitivity Levels of Quad Flat No-lead (QFN) Packages

17th European Microelectronics and Packaging Conference and Exhibition (EMPC 2009), Palacongressi, Rimini (Italy), 14-17 Jun 2009
Zhang, Minshu; Lee, Ricky S W

Material characterization of corner and edgebond epoxy adhesives for the improvement of board-level solder joint reliability

Proceedings - Electronic Components and Technology Conference, 2009, p. 125-133
Wu, H.L.H.; Song, F.; Lo, Chi Chuen; Jiang, T.; Newman, K.; Lee, S.W.R.

Process development and prototyping for the assembly of LED arrays on flexible printed circuit tape for general solid state lighting

2009 Proceedings of 59th Electronic Components and Technology Conference, June 2009, article number 5074321, p. 2137-2142
Lee, Ricky Shi-wei; Tong, Yiu Wai; Chan, Yuen Sing; Lo, Chi Chuen; Zhang, Rong

Stress analysis of hygrothermal delamination of Quad Flat No-lead (QFN) packages

ASME International Mechanical Engineering Congress and Exposition, Proceedings, v. 12, 2009, p. 339-347
Zhang, Minshu; Lee, Ricky Shi Wei; Fan, Xuejun

Surface analysis of outgassing contamination from edgebond epoxy adhesives on imag pads

Proceedings - Electronic Components and Technology Conference, 2009, p. 155-160
Wu, H.L.H.; Song, F.; Newman, K.; Lee, S.W.R.
Article 5

Correlation between measurement and simulation of thermal warpage in PBGA with consideration of molding compound residual strain

IEEE Transactions on Components and Packaging Technologies, v. 31, (3), September 2008, p. 683-690
Tsai, Ming-Yi; Chen, YuC; Lee, Shi Wei Ricky

Drop/impact tests and analysis of typical portable electronic devices

International Journal of Mechanical Sciences, v. 50, (5), May 2008, p. 905-917
Zhou, C.Y.; Yu, T.X.; Lee, Ricky S.W.

Eddy current induced heating for the solder reflow of area array packages

IEEE Transactions on Advanced Packaging, v. 31, (2), May 2008, p. 399-403
Li, Mingyu; Xu, Hongbo; Lee, Shi-Wei Ricky; Kim, Jongmyung; Kim, Daewon

Gold Embrittlement of Solder Joints in Wafer-Level Chip-Scale Package on Printed Circuit Board With Ni/Au Surface Finish

IEEE Transactions on Electronics Packaging Manufacturing, v. 31, (3), July 2008, p. 185-191
Huang, Xingjia; Lee, Shi Wei Ricky; Li, Ming; Chen, William T.

Reliability Study of Surface Mount Printed Circuit Board Assemblies with Lead-free Solder Joints

Soldering & Surface Mount Technology, v. 20, (2), April 2008, p. 30-38
Lo, Chi Chuen; Jia, B.F.; Liu, Zhe; Zhu, Jungao; Lee, Shi Wei Ricky
Conference paper 10

A comprehensive parallel study on the board level reliability of SAC, SACX and SCN solders

Proceedings - Electronic Components and Technology Conference, 2008, p. 146-154
Song, Fubin; Lo, Chi Chuen; Lam, Jimmy K.S.; Jiang, Tong; Lee, Shi Wei Ricky

Design and fabrication of an epoxy flow stopper with convex corner compensation of V-grooves on a silicon optical bench for the passive alignment of optical fibers

Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC, 2008, p. 321-326
Lam, Jimmy K.S.; Lee, Shi Wei Ricky

Design and fabrication of MEMS based microphone module by using 3D chip-on-chip package

ASME International Mechanical Engineering Congress and Exposition, Proceedings, v. 5, 2008, p. 47-53
Lo, Chi Chuen; Lee, Shi Wei Ricky

Determination of solder bump stand-off height in a flip-chip sub-mount for Micro-Opto-Electro-Mechanical System (MOEMS) packaging applications

Proceedings - Electronic Components and Technology Conference, 2008, p. 1887-1892
Lo, Chi Chuen; Lee, Shi Wei Ricky; Wu, Henry Hailong; Lam, Jimmy K.S.

Development of novel dicing process by anisotropic wet etching with convex corner compensation

10th Electronics Packaging Technology Conference, EPTC 2008, 2008, p. 161-166
Lam, Jimmy K.S.; Lee, Ricky Shi Wei

Fabrication of Nanoscale Vias by Offset Patterning

MicroNano2008-2nd International Conference on Integration and Commercialization of Micro and Nanosystems, Proceedings, 2008, p. 615-618
Lau, Chi Ho; Lee, Ricky Shi Wei

Investigation of Moisture Sensitivity Related Failure Mechanism of Quad Flat No-lead (QFN) Packages

Proc. ASME International Mechanical Engineering Congress & Exposition, Boston, MA, 31 October-6 November, IMECE2008/68120 (on CD-ROM)
Zhang, M.; Lee, Ricky Shi Wei

Numerical analysis and experimental validation for the prediction of flip chip solder joint standoff height in MEMS microphone application

IEEE 9th VLSI Packaging Workshop in Japan, VPWJ 2008, 2008, p. 45-48
Lo, Chi Chuen; Lee, Ricky Shi Wei

Wafer level encapsulation process for LED array packaging

2007 International Conference on Electronic Materials and Packaging / IEEE. Piscataway, NJ : IEEE, 2008, Article number 4510307
Zhang, Rong; Lee, Ricky Shi-wei

Wafer Level LED Packaging with Integrated DRIE Trenches for Encapsulation

Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008 / IEEE. Piscataway, NJ : IEEE, 2008, Article number 4607038
Zhang, Rong; Lee, Ricky Shi-wei
Article 1

Electro-elastic analysis of piezoelectric laminated plates

Advanced Composite Materials, v. 16, (1), January 2007, p. 63-81
Zhao, Ming-Hao; Qian, Caifu; Lee, Shi Wei Ricky; Tong, Pin; Suemasu, H.; Zhang, Tongyi
Book chapter 1

Passive Alignment of Optical Fibers in V-grooves with Low Viscosity Epoxy Flow

Micro- and Opto-electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging / Vol. 2, Physical Design--Reliability and Packaging/ Edited by E. Suhir, Y.C. Lee, C.P. Wong. New York: Springer, c2007, chapter 6, p. 151-173
Lee, Shi-Wei Ricky; Lo, Chi Chuen
Conference paper 20

Brittle failure mechanism of SnAgCu and SnPb solder balls during high speed ball shear and cold ball pull tests

Proceedings - Electronic Components Conference, 2007, p. 364-372
Song, Fubin; Lee, S. W. Ricky; Newman, Keith; Sykes, Bob; Clark, Stephen

Characteristics of copper-to-silicon diffusion in copper wire bonding

Proceedings of Technical Papers - 2007 International Microsystems, Packaging, Assembly and Circuits Technology Conference, IMPACT, 2007, p. 2-9
Zhang, Shawn X.; Lee, Shi Wei Ricky; Lau, A.K.M.; Tsang, Paul P.H.; Mohamed, Lebbai; Chan, C.Y.; Dirkzwager, Maarten

Characterization and comparison of five SAC-based solder pastes for pb-free reflow soldering

HDP'07: Proceedings of the 2007 International Symposium on High Density Packaging and Microsystem Integration, 2007, p. 10-17
Chen, Catherine H.; Wong, Wallace; Lo, Chi Chuen; Song, Fubin; Lee, Shi Wei Ricky

Characterization of Failure Modes and Analysis of Joint Strength Using Various Conditions for High Speed Solder Ball Shear and Cold Ball Pull Tests

Proc. 16th European Microelectronics & Packaging Conference (EMPC), Oulu, Finland, 17-20 June, pp. 213-218
Song, Fubin; Lee, Shi-Wei Ricky; Clark, Stephen; Sykes, Bob; Newman, Keith

Comparison of joint strength and fracture energy of lead-free solder balls in high speed ball shear/pull tests and their correlation with board level drop test

Proceedings of the Electronic Packaging Technology Conference, EPTC, 2007, p. 450-458
Song, F.; Ricky Lee, S.W.; Newman, K.; Clark, S.; Sykes, B.

Design and fabrication of MEMS based microphone module by using 3D chip-on-chip package

ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE), v. 5, 2007, p. 47-54
Lo, Chi Chuen; Lee, Shi Wei Ricky

Design of experiment (DoE) study on effects of various geometric parameters on copper diffusion in through silicon vias (TSVs)

ICEPT: 2007 8TH INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING TECHNOLOGY, PROCEEDINGS, 2007, p. 32-37
Zhang, Shawn X.; Lee, S. W. Ricky

Development of 2D modeling techniques for the thermal fatigue analysis of solder joints of a module mounted in a 3D cavity on a printed circuit board

EUROSIME 2007: Thermal, Mechanical and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systems, Proceedings, 2007, p. 713-718
Chan, Yuen Sing; Lee, Shi Wei Ricky; Ye, Yuming; Liu, Sang

Drop impact of a typical portable electronic device - experiments and modeling

Proceedings of the 7th International Conference on Shock and Impact Loads on Structures, 2007, p. 61-70
Yu, Tongxi; Zhou, C.Y.; Lee, Ricky S.W.

Effect of thermal aging on high speed ball shear and pull tests of SnAgCu lead-free solder balls

Proceedings of the Electronic Packaging Technology Conference, EPTC, 2007, p. 463-470
Song, F.; Ricky Lee, S.W.; Newman, K.; Reynolds, H.; Clark, S.; Sykes, B.

Effect of V-groove side wall feature on epoxy flow in passive alignment of optical fiber

6th International IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Proceedings 2007, 2007, p. 202-208
Lam, K. S. Jimmy; Lee, S. W. Ricky

Effects of aging and underfills on mechanical-drop tests of SnAgCu PBGA (plastic ball grid array) packages on ImAg PCB (printed circuit board)

Proc. 9th International Conference on Electronic Materials and Packaging (EMAP), Daejon, Korea, 19-22 November, EMAP2007-P013
Lau, John H.; Lo, Chi Chuen; Lam, Jimmy K.S.; Soon, E.L.; Chow, W.S.; Lee, Shi-Wei Ricky

Effects of barrier layer on copper-to-silicon diffusion and intermetallic compound formation in copper wire bonding

Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, v. 2007, 2007, p. 39
Zhang, Shawn; Chen, Catherine; Lee, Ricky; Lau, A.K.M.; Tsang, P.P.H.; Mohamed, L.; Chan, C.Y.; Dirkzwager, M.

Effects of tooling tip wear and fixture rigidity on solder ball shear and ball pull tests

IPACK 2007: PROCEEDINGS OF THE ASME INTERPACK CONFERENCE 2007, VOL 2, 2007, p. 889-894
Song, Fubin; Lee, S. W. Ricky

Effects of underfills on the thermal-cycling tests of SnAgCu PBGA (Plastic Ball Grid Array) packages on ImAg PCB (Printed Circuit Board)

Proceedings of the Electronic Packaging Technology Conference, EPTC, 2007, p. 785-790
Lau, J.; Lo, Chi Chuen; Lam, J.; Soon, E.L.; Chow, W.S.; Lee, R.

High-speed solder ball shear and pull tests vs. board level mechanical drop tests: Correlation of failure mode and loading speed

Proceedings - Electronic Components and Technology Conference, 2007, p. 1504-1513
Song, Fubin; Lee, Shi Wei Ricky; Newman, Keith; Sykes, Bob; Clark, Stephen

Multi-stacked flip chips with copper plated through silicon vias and re-distribution for 3D system-in-package integration

Materials Research Society Symposium Proceedings, v. 970, 2007, p. 179-190
Lee, Shi-Wei Ricky; Hon, Ronald

Reliability assessment on the re-balling of PBGA from SnPb to Pb-free solder spheres

ESTC 2006 - 1st Electronics Systemintegration Technology Conference, v. 1, 2007, p. 474-480
Song, F.; Ricky Lee, S.W.

Screen-printing of yellow phosphor powder on blue Light Emitting Diode (LED) arrays for white light illumination

2007 Proceedings of the ASME InterPack Conference, IPACK 2007, v. 1, 2007, p. 19-24
Lee, Ka Ho; Lee, Shi Wei Ricky

Wetting characteristics of solder reflow on copper traces without solder mask

ESTC 2006 - 1st Electronics Systemintegration Technology Conference, v. 1, 2007, p. 438-443
Lo, Chi Chuen; Lee, Shi Wei Ricky; Lam, Jimmy K.S.; Wong, Wallace K.H.
Article 2

A reliability comparison of electroplated and stencil printed flip-chip solder bumps based on UBM related intermetallic compound growth properties

IEEE Transactions on Components and Packaging Technologies, v. 29, (1), March 2006, p. 164-172
Gong, JF; Chan, PCH; Xiao, GW; Lee, RSW; Yuen, MMF

便携式电子产品的跌落冲击响应试验,仿真和理论

力学进展=Advances in Mechanics, v. 36, (2), May 2006, p. 239-246
周春燕; 余同希; 李世瑋
Conference paper 24

Characterization of intermetallic compound formation and copper diffusion of copper wire bonding

Proceedings - Electronic Components and Technology Conference, v. 2006, 2006, p. 1821-1826
Zhang, S.; Chen, C.; Lee, R.; Lau, A.K.M.; Tsang, P.P.H.; Mohamed, L.; Chan, C.Y.; Dirkzwager, M.

Comparison between experimental measurement and numerical analysis of warpage in PBGA package and assembly with the consideration of residual strain in the molding compound

2006 International Conference on Electronic Materials and Packaging, EMAP, 2006
Tsai, Ming Yi; Chen, Yung Cheng; Lee, Shi Wei Ricky

Corrosion of Sn-Ag-Cu lead-free solders and the corresponding effects on board level solder joint reliability

Proceedings - Electronic Components and Technology Conference, v. 2006, 2006, p. 891-898
Song, Fubin; Lee, Shi Wei Ricky

Design of shock table tests to mimic real-life drop conditions for portable electronic device

2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, (EMAP2006) Hong Kong, 11-14 December, 2006., v. 1-3, p. 674-678
Zhou, C.Y.; Yu, T.X.; Lee, Ricky S.W.

Design, process development and prototyping of 3D packaging with multi-stacked flip chips and peripheral through silicon via interconnection

Proceedings of the IEEE/CPMT International Electronics Manufacturing Technology (IEMT) Symposium, 2006, p. 80-85
Hon, Ronald; Lee, Shi Wei Ricky

Development and prototyping of a HB-LED array module for indoor solid state lighting

2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis (HDP '06), Proceedings, 2006, p. 192-196
Lee, S. W. Ricky; Lau, C.H.; Chan, S.P.; Ma, K.Y.; Ng, M.H.; Ng, Y.W.; Lee, K.H.; Lo, Jeffery C.C.

Development and prototyping of a HB-LED array module for indoor solid state lighting

2006 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'06, 2006, p. 141-145
Lee, Shi Wei Ricky; Lau, C.H.; Chan, Siu Ping; Ma, K.Y.; Ng, M.H.; Ng, Y.W.; Lee, K.H.; Lo, Chi Chuen

Drop impact of a typical portable electronic device

WIT Transactions on the Built Environment, v. 87, 2006, p. 505-514
Zhou, C.Y.; Yu, T.X.; Lee, R.S.W.

Drop impact of typical portable electronic product device

The 9th Int. Conf. on Structures Under Shock & Impact (SUSI 2006), New Forest, UK,, 3-5 July, 2006.
Zhou, C.Y.; Yu, Tongxi; Lee, R.S.W.

Effect of high temperature storage on reliability of Sn-Ag-Cu flip chip solder bumps

International Conference on Electronic Materials and Packaging, EMAP, v. 2006, December 2006, article number 4430604
Huang, Xingjia; Lee, Shi Wei Ricky; Li, Ming; Chen, William T.

Effect of Microstructure on Thermal and Mechanical Properties of PBGA Substrates

Proc. 8th International Conference on Electronic Materials and Packaging (EMAP), Kowloon, Hong Kong, 11-14 December, pp. 533-539
Tang, G.C.W.; Shing, J.W.K.; Chen, Haibin; Lee, Shi-Wei Ricky; Wu, Jingshen; McLellan, Neli

Effect of solder mask thickness on shear and pull tests of lead-free solder balls

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, 2006
Song, Fubin; Lee, Shi Wei Ricky

Effects of Al pad deformation and TiW barrier layer on copper-to-silicon diffusion and intermetallic compound formation in copper wire bonding

IEEE CPMT: International Symposium and Exhibition on Advanced Packaging Materials: Processes, Properties and Interfaces, 2006, p. 189-195
Zhang, Shawn; Chen, Catherine; Lee, Ricky; Lau, Angie K.M.; Tsang, Paul P.H.; Mohamed, Lebbai; Chan, C.Y.; Dirkzwager, M.

Effects of microstructure on thermal and mechanical properties of PBGA substrates

2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3, 2006, p. 830-836
Tang, George Cw; Shing, Jacqueline Wk; Chen, Haibin; Lee, Ricky; Wu, Jingshen

Experimental testing and failure prediction of PBGA package assemblies under 3-point bending condition through computational stress analysis

ICEPT: 2006 7th International Conference on Electronics Packaging Technology, Proceedings, 2006, p. 866-872
Lau, Dennis; Chan, Y.S.; Lee, Shi Wei Ricky; Fu, Lifeng; Ye, Yuming; Liu, Sang

Experimental testing and failure prediction of PBGA package assemblies under 3-point bending condition through computational stress analysis

ICEPT: 2006 7th International Conference on Electronics Packaging Technology, Proceedings, 2006, p. 687-693
Lau, Dennis; Chan, Y.S.; Lee, S. W. Ricky; Fu, Lifeng; Ye, Yuming; Liu, Sang

Fracture analysis on popcorning of plastic packages during solder reflow

Fracture of Nano and Engineering Materials and Structures: Proceedings of the 16th European Conference of Fracture, Alexandroupolis, Greece, July 3-7, 2006 / Edited by E. E. Gdoutos. The Netherlands : Springer, 2006, p. 749-750
Lee, Shi-Wei Ricky; Lau, Dennis Chung Yin

Impact of IMC thickness on lead-free solder joint reliability under thermal aging: Ball shear tests vs. cold bump pull tests

2006 International Microsystems, Packaging, Assembly Conference Taiwan (IMPACT), Proceedings, 2006, p. 109-112
Lee, Shi Wei Ricky; Song, Fubin

Investigation of IMC thickness effect on the lead-free solder ball attachment strength: Comparison between ball shear test and cold bump pull test results

Proceedings - Electronic Components and Technology Conference, v. 2006, 2006, p. 1196-1203
Song, Fubin; Lee, Shi Wei Ricky

Investigation of the effect of PCB base materials and pad surface finish on the thermal fatigue life of lead-free solder joints of PBGA and passive resistors

2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3, 2006, p. 166-172
Song, Fubin; Lee, Shi Wei Ricky; Osterman, Michael; Pecht, Michael

Isothermal fatigue tests of plastic ball grid array (PBGA) SnAgCu lead-free solder joints at 60°C

Electronic Components and Technology Conference, v. 2006, May 2006, article number 1645851, p. 1476-1483
Lau, John; Lee, Shi-wei; Song, Fubin; Lau, Chung Yin; Shangguan, Dongkai

Multi-Stacked Flip Chips with Copper Plated Through Silicon Vias and Re-Distribution for 3D System-in-Package Integration

Proc. MRS Symposium on Enabling Technologies for 3D Integration, Vol. 970, Boston, MA, 27-29 November pp. 179-190
Lee, Shi-Wei Ricky; Hon, R.

Process development for yellow phosphor coating on blue light emitting diodes (LEDs) for white light illumination

Proceedings of the Electronic Packaging Technology Conference, EPTC, 2006, p. 379-384
Lee, Ka Ho; Lee, Shi Wei Ricky

Thermal resistance analysis of a multi-stack flip chip 3-d package

2006 INTERNATIONAL CONFERENCE ON ELECTRONIC MATERIALS AND PACKAGING, VOLS 1-3, 2006, p. 145-149
Chan, Yuen Sing; Lee, Shi Wei Ricky
Article 2

Design and fabrication of a flip-chip-on-chip 3-D packaging structure with a through-silicon via for underfill dispensing

IEEE Transactions on Advanced Packaging, v. 28, (3), August 2005, p. 413-420
Tsui, Yat Kit; Lee, Shi Wei Ricky

Foreword: Three-dimensional packaging

IEEE Transactions on Advanced Packaging, v. 28, (3), August 2005, p. 354-355
Bauer, Charles E.; Lee, Shi Wei Ricky
Book 1

電子製造技術:利用無鉛、無鹵素和導電膠材料


劉, 漢誠; 汪, 正平; 李, 寧成; 李, 世瑋
Conference paper 13

3D stacked flip chip packaging with through silicon vias and copper plating or conductive adhesive filling

Proceedings - Electronic Components and Technology Conference, v. 1, 2005, p. 795-801
Lee, Shi Wei Ricky; Hon, Ronald; Zhang, Shawn Xiaodong; Wong, Chun Keung

A systematic approach for determining the thermal fatigue-life of plastic ball array (PBGA) lead-free solder joints

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, v. 0, 2005, p. 1021-1029
Lau, J.; Lee, R.; Dauksher, W.; Shangguan, D.; Song, F.; Lau, D.

Assessment of long-term reliability in lead-free assemblies

Proceeding of 2005 International Conference on Asian Green Electronics- Design for Manufacturability and Reliability, 2005AGEC, v. 2005, 2005, p. 140-155
Ganesan, S.; Wu, J.; Pecht, M.; Lee, R.; Lo, Chi Chuen; Fu, Y.; Li, Y.; Xu, M.

Characterization of copper-to-silicon diffusion for the application of 3D packaging with through silicon vias

2005 6th International Conference on Electronic Packaging Technology, v. 2005, 2005, article number 1564666, p. 51-56
Zhang, Xiaodong; Lee, Shi-Wei Ricky; Weng, Lutao; So, Sylvia

Correlation between the strain on the printed circuit board and the stress in chips for the failure prediction of passive components

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 5, 2005, p. 115-121
Lau, Dennis Chung Yin; Lee, Shi Wei Ricky

Effects of testing conditions and multiple reflows on cold bump pull test of Pb-free solder balls

2005 6th International Conference on Electronics Packaging Technology, v. 2005, 2005
Song, Fubin; Lee, Shi Wei Ricky

Evaluation of bondability and reliability of single crystal copper wire bonding

Proceedings of the Seventh IEEE CPMT Conference on High Density Microsystem Design, Packaging and Failure Analysis (HDP'05), 2005, p. 238-244
Chen, Hua; Lee, Shi Wei Ricky; Ding, Yutian

Experimental investigation of the effect of reflow cooling rate on the IMC growth of SAC lead-free solder alloy

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 5, 2005, p. 123-129
Song, Fubin; Lee, Shi Wei Ricky

Experimental testing and computational stress analysis of printed circuit board for the failure prediction of passive components under the depaneling load condition

Proceedings - Electronic Components Conference, 2005, p. 1783-1791
Lau, D.; Tsang, M.; Lee, SWR; Lo, Chi Chuen; Fu, LF; Jin, JW; Liu, S.

Fabrication of Sub-micron Silicon Vias by Deep Reactive Ion Etching

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging, San Francisco, California, USA, 17-22 July 2005, p. 947-953 (IPACK2005/73299 on CD-ROM)
Zhang, Xiaodong; Hon, Ronald; Lee, Shi-Wei Ricky

Multi-stack flip chip 3D packaging with copper plated through-silicon vertical interconnection

PROCEEDINGS OF THE 7TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS. 1 AND 2, 2005, p. 384-389
Hon, R.; Lee, SWR; Zhang, SX; Wong, CK

Optimization of epoxy flow for passive alignment of optical fiber arrays

Proceedings - EMAP 2005: 2005 International Symposium on Electronics Materials and Packaging, v. 2005, 2005, p. 132-136
Lo, Chi Chuen; Li, Chung Yeung; Tai, Chung Leung; Lee, Shi Wei Ricky

Thermal-fatigue life prediction equation for Plastic Ball Grid Array (PBGA) SnAgCu lead-free solder joints

Proceedings of the ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, v. 0, 2005, p. 1013-1019
Lau, John; Lee, Shi Wei Ricky; Song, Fubin; Shangguan, Dongkai; Lau, Dennis C.; Dauksher, Walter
Article 1

Comparison of solder ball shear strengths for various nickel platings on the bond pads of a PBGA substrate

Soldering & Surface Mount Technology, v. 16, (2), 2004, p. 21-26
Yan, Eric C.C.; Lee, Shi Wei Ricky; Huang, Xingjia
Book chapter 1

Electronic Manufacturing Service Industries in China

China's Electronics Industries / Edited by M.G. Pecht, Y.C. Chan, College Park, Maryland: CALCE EPSC Press, 2004, p.109-136
Donahoe, Daniel; Lee, Shi-Wei Ricky
Conference paper 14

A new method for the solder ball pull test using a shape memory alloy tube

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 4, 2004, p. 237-242
Lo, Chi Chuen; Lau, Dennis Chung Yin; Lee, Shi Wei Ricky; Chan, Simon; Chan, Franky; Chau, K.C.

Characteristics of Resistance of Daisy-Chained PBGA Solder Joints under Thermal Fatigue Load, Three-Point Bending Load and Mechanical Drop Load

6th International Symposium on Electronic Materials and Packaging (EMAP2004), Penang, Malaysia, December 5-7, pp. 204-209
Lui, Ben Hoi Wai; Lee, Shi-Wei Ricky; Zhang, Shawn Xiao Dong

Chip-on-chip 3D optical interconnect with passive alignment

Proceedings - Electronic Components and Technology Conference, v. 2, 2004, p. 2015-2019
Lo, Chi Chuen; Lee, Ricky Shi Wei; Wu, Jingshen; Kim, Jang Kyo; Yuen, Matthew Ming Fai

Computational analyses on the effects of irregular conditions during accelerated thermal cycling tests on board level solder joint reliability

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004, 2004, p. 516-521
Lau, Dennis Chung Yin; Lee, Shi Wei Ricky

Computational model validation with experimental data from temperature cycling tests of PBGA assemblies for the analysis of board level solder joint reliability

Proceedings of the 5th International Conference on Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2004, 2004, p. 115-120
Lee, Shi Wei Ricky; Lau, Dennis Chung Yin

Effects of underfill adhesion on flip chip package reliability

Proceedings of 2004 International IEEE Conference on the Asian Green Electronics (AGEC), 2004, p. 96-101
Sham, Man Lung; Kim, Jang Kyo; Lee, R.S.W.; Wu, Jingshen; Yuen, Matthew Ming Fai

Experimental assessment of passive alignment of optical fibers With V-grooves on silicon optical bench

Proceedings of 6th Electronics Packaging Technology Conference, EPTC 2004, 2004, p. 375-380
Lo, Chi Chuen; Lee, Shi Wei Ricky

Finite element analysis for thermal fatigue life estimation of PBGA solder joints with model validation by experimental data

ITHERM 2004, VOL 2, 2004, p. 724
Lee, SWR

Formation and Plugging of Through-Silicon-Vias for 3D Packaging

7th VLSI Packaging Workshop of Japan (VLSI2004), Kyoto, Japan, 29 November-2 December, pp. 105-108,
Lee, Shi-Wei Ricky; Hon, Ronald; Zhang, Shawn Xiao Dong; So, Sylvia

Formation of through-silicon-vias by laser drilling and deep reactive ion etching

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 4, 2004, p. 243-248
Hon, Ronald; Zhang, Shawn Xiaodong; Lee, Shi Wei Ricky

Gold embrittlement of solder joints in wafer level chip scale package on printed circuit board with Ni/Au surface finish

Proceedings - Electronic Components and Technology Conference, v. 1, 2004, p. 400-406
Huang, Xingjia; Lee, Shi Wei Ricky; Li, Ming; Chen, William T.

Modified passive alignment of optical fibers with low viscosity epoxy flow running in V-grooves

Proceedings - Electronic Components and Technology Conference, v. 1, 2004, p. 830-834
Lo, Chi Chuen; Lee, Shi Wei Ricky; Lee, Steve Han Keung; Wu, Jingshen; Yuen, Matthew Ming Fai

Thermal fatigue-life prediction of lead-free solder joints

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 4, November 2004, article number IMECE2004-62493, p. 265-270
Lau, John H.; Lee, Shi-Wei Ricky; Shangguan, Dongkai

Thermal-fatigue life prediction equation for wafer-level chip scale package (WLCSP) lead-free solder joints on lead-free printed circuit board (PCB)

Proceedings - Electronic Components and Technology Conference, v. 2, 2004, p. 1563-1569
Lau, John H.; Shangguan, Dongkai; Lau, Dennis Chung Yin; Kung, Terry T.W.; Lee, Shi Wei Ricky
Book 2

Electronics Manufacturing with Lead-free, Halogen-free, and Conductive Adhesive Materials


Lau, John; Wong, C.P.; Lee, N.C.; Lee, S. W. Ricky

芯片尺寸封裝: 設計, 材料, 工藝, 可靠性及應用


劉, 漢誠; 李, 世瑋; 賈, 松良; 王, 水弟; 蔡, 堅
Conference paper 9

A Reliability Comparison of Electroplated and Stencil Printed Flip-Chip Solder Bumps Based on UBM Related Intermetallic Compound Growth Properties

53rd Electronic Components and Technology Conference, ECTC, New Orleans, USA, 27-30 May, pp. 685-691
Gong, Jing-Feng; Xiao, Guo-Wei; Chan, Philip C.H.; Lee, Ricky S.W.; Yuen, Matthew M.F.

Effects of thermal aging and Au addition on the electrical resistance of solder balls in flip chip and ultra-CSP packages

ADVANCES IN ELECTRONIC PACKAGING 2003, VOL 1, 2003, p. 831-836
Huang, XJ; Lee, SWR; Li, M.; Chen, W.

Effects of Thermal Aging and Au Addition on the Electrical Resistance of Solder Balls in Flip Chip and Ultra-CSP Packages

Proceedings of InterPACK’03, Maui, Hawaii, U.S.A., July 6-11, IPACK2003-35246 on CD-ROM
Huang, Xingjia; Lee, Shi-Wei Ricky; Li, Ming; Chen, William

Multi-chip memory module with a flip-chip-on-chip structure and an optional center via hole for underfill dispensing

Proceedings - Electronic Components and Technology Conference, 2003, p. 864-869
Lee, Shi Wei Ricky; Tsui, Yat Kit; So, Raymond; Luo, Le

Optimization of electroplating, stencil printing, ball placement solder-bumping flip-chip process technologies

Proceedings - Electronic Components and Technology Conference, 2003, p. 1850-1855
Xiao, G.W.; Gong, J.F.; Yau, E.W.C.; Chan, P.C.H.; Lee, R.S.W.; Yuen, M.M.F.

Optimization of stencil printing wafer bumping for fine pitch flip chip applications

Proceedings - Electronic Components and Technology Conference, 2003, p. 1724-1730
Gong, J.F.; Yau, E.W.C.; Chan, P.C.H.; Lee, R.S.W.; Yuen, M.M.F.

Passive alignment of optical fiber in a V-groove with low viscosity epoxy flow

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 3, November 2003, article number IMECE2003-43902, p. 403-406
Lo, Chi Chuen; Yung, C.S.; Lee, Shi-wei; Lee, Steve Han Keung; Wu, Jingshen; Yuen, Matthew Ming Fai

The impact of the AC current crowding effect on BJT RF noise modeling

2003 IEEE CONFERENCE ON ELECTRON DEVICES AND SOLID-STATE CIRCUITS, 2003, p. 327-330
Lee, Wai Kit; Man, Tsz Yin; Mok, Philip K.T.; Ko, Ping Keung; Chan, Man Sun

Three-dimensional packaging for multi-chip module with through-the-silicon via hole

PROCEEDINGS OF 5TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2003, p. 1-7
Tsui, Yat Kit; Lee, Ricky S W; Wu, Jingshen; Kim, Jang Kyo; Yuen,Matthew Ming Fai
Article 8

Analysis on solder ball shear testing conditions with a simple computational model

Soldering & Surface Mount Technology, v. 14, (1), April 2002, p. 45-48
Lee, SWR; Huang, XJ

Assessment of board level solder joint reliability for PBGA assemblies with lead-free solders

Soldering & Surface Mount Technology, v. 14, (3), 2002, p. 46-50
Lee, Shi Wei Ricky; Lui, Ben Hoi Wai; Kong, YH; Baylon, Bernard; Leung, Timothy; Umali, Pompeo; Agtarap, Hector

Computational parametric analyzes on the solder joint reliability of bottom leaded plastic (BLP) package

IEEE Transactions on Advanced Packaging, v. 25, (4), November 2002, p. 514-521
Zhang, Xiao Wu; Lee, Shi Wei Ricky; Choi, Kwang Seong; Kim, Young Gon

Effects of build-up printed circuit board thickness on the solder joint reliability of a wafer level chip scale package (WLCSP)

IEEE Transactions on Components and Packaging Technologies, v. 25, (1), March 2002, p. 3-14
Lau, John H.; Lee, Shi Wei Ricky

Micro-machined Conformal silicon Molds for wafer bumping and probing

International Journal of Nonlinear Sciences and Numerical Simulation, v. 3, (3-4, Sp. Iss. SI), 2002, p. 399-404
Lee, Shi Wei Ricky; Lo, Chi Chuen; Law, K.H.

Modeling and analysis of 96.5Sn-3.5Ag lead-free solder joints of wafer level chip scale package on buildup microvia printed circuit board

IEEE Transactions on Electronics Packaging Manufacturing, v. 25, (1), January 2002, p. 51-58
Lau, John H.; Lee, Shi Wei Ricky

Modeling of torsional vibration induced by extension-twisting coupling of anisotropic composite laminates with piezoelectric actuators

Smart Materials and Structures, v. 11, (1), February 2002, p. 55-62
Zhu, Mei-Ling; Lee, Shi-wei; Li, Hing Leung; Zhang, Tongyi; Tong, Pin

Nonlinear-Time-Dependent Analysis of Micro Via-in-Pad Substrates for Solder Bumped Flip Chip Applications

Journal of Electronic Packaging, v. 124, (3), July 2002, p. 205-211
Lau, John; Lee, Ricky Shi Wei; Pan, S.H.; Chang, Chris
Conference paper 9

Effects of room temperature storage time on the shear strength of PBGA solder balls

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 2, 2002, p. 259-262
Lee, Shi Wei Ricky; Tsui, Yat-Kit; Hunag, Xingjia; Yan, Eric C.C.

Effects of Room Temperature Storage Time on the Shear Strength of PBGA Solder Balls

14th Symposium on Mechanics of SMT & Photonic Structures, ASME International Mechanical Engineering Congress & Exposition, November 17-22, New Orleans, Louisiana, USA, pp. 1-4 (IMECE2002/39514 on CD-ROM)
Lee, S. W. Ricky; Tsui, Y.K.; Huang, X.; Yan, C.C.

Evaluation of board level reliability of Pb-free PBGA solder joints

International Advanced Packaging Materials Symposium, v. 2002, March 2002, article number 990368, p. 82-89
Lee, Shi-wei; Lui, Hon Wai Ben; Kong, Y.K.; Baylon, Bernard; Leung, Timothy; Umali, Pompeo; Agtarap, Hector

Experimental Evaluation on Solder Joint Reliability of PBGA Assembly under Mechanical Drop Test

14th Symposium on Mechanics of SMT & Photonic Structures, ASME International Mechanical Engineering Congress & Exposition, November 17-22, New Orleans, Louisiana, USA, pp. 1-5 (IMECE2002/39493 on CD-ROM)
Lee, Shi Wei Ricky; Li, Tracy Yin Lai; Lui, Ben Hoi Wai

Experimental investigation on the degradation of BGA solder ball shear strength due to room temperature aging

PROCEEDINGS OF THE 4TH INTERNATIONAL SYMPOSIUM ON ELECTRONIC MATERIALS AND PACKAGING, 2002, p. 478-481
Tsui, YK; Lee, SWR; Huang, XJ

Experimental investigation on the progressive failure mechanism of solder balls during ball shear test

Proceedings - Electronic Components and Technology Conference, 2002, p. 968-973
Huang, Xingjia; Lee, Shi Wei Ricky; Yan, Chien Chun

Reliability study and failure analysis of fine pitch solder-bumped flip chip on low-cost flexible substrate without using stiffener

Proceedings - Electronic Components and Technology Conference, 2002, p. 112-118
Xiao, G.W.; Chan, P.C.H.; Lee, R.S.W.; Yuen, M.M.F.

Stress Relaxation in Plastic Molding Compounds

International Symposium on Electronic Materials & Packaging (EMAP2002), December 4-6, Kaohsiung, Taiwan, pp. 37-42
Lee, M.; Pecht, M.G.; Huang, X.; Lee, S. W. Ricky

Thermal Analysis of Vertical-Cavity Surface-Emitting LED/VCSEL Assembly with Lead-Free Flip Chip Interconnects

PhoPack2002, July 14-16, Stanford, California, U.S.A., pp. 26-30
Lau, John; Lee, S. W. Ricky
Article 5

Analysis and comparison of WLCSP-on-build-up PCB assemblies with various solders and microvia configurations

Circuit World, v. 28, (2), 2001, p. 32-38
Lee, Shi-Wei Ricky; Lau, John H.

Computational Analysis on the Effects of Double-Layer Build-Up Printed Circuit Board on the Wafer Level Chip Scale Package (WLCSP) Assembly with Pb-Free Solder Joints

International Journal of Microcircuits & Electronic Packaging, 24(2), 89-104
Lau, John; Lee, S. W. Ricky

Reliability of Eutectic Sn-Pb Solder Bumps and Flip Chip Assemblies

International Journal of Microcircuits & Electronic Packaging, v. 24, (2), 2001, p. 246-262
Huang, Xingjia; Kallmayer, Christine; Aschenbrenner, Rolf; Lee, S. W. Ricky

Solder joint crack propagation analysis of wafer-level chip scale package on printed circuit board assemblies

IEEE Transactions on Components and Packaging Technologies, v. 24, (2), June 2001, p. 285-292
Lau, John H.; Chang, Chris; Lee, Shi Wei Ricky

以PZT薄膜为驱动和传感的微型陀螺研制

壓電與聲光, v. 23, (1), February 2001, p. 18-22
马薇; 李世玮; 虞吉林
Book 1

Microvias for Low-Cost High-Density Interconnects


Lau, John; Lee, S. W. Ricky
Conference paper 9

Bending analysis of piezoelectric laminates

Solid Mechanics and Its Applications, v. 89, 2000, p. 275-282
Zhao, Ming-Hao; Qian, C.F.; Lee, Shi-wei; Tong, P.; Zhang, Tongyi

Characterization and analysis on the solder ball sheer testing conditions

Proceedings - Electronic Components Conference, 2001, p. 1065-1071
Huang, XJ; Lee, SWR; Yan, CC; Hui, S.

Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Alloy

Advances in Electronic Packaging, v. 1, 2001, p. 307-313
Dai, Lanhong; Lee, Shi-Wei Ricky

Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Using Split Hopkinson Torsional Bars (SHTB)

American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, v. 1, 2001, p. 237-242
Lee, Shi-Wei Ricky; Dai, Lanhong

Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Using Split Hopkinson Torsional Bars (SHTB)

ASME International Mechanical Engineering Congress and Exposition, Proceedings, v. 2, 2001, p. 2301-2306
Lee, Shi-Wei Ricky; Dai, Lanhong

Dynamic structural coupling behaviours of an anti-symmetric piezoelectric laminate

Proceedings of SPIE - The International Society for Optical Engineering, v. 4326, 2001, p. 331-339
Wong, Kelvin H.L.; Lee, Shi-Wei Ricky

Effects of plasma cleaning on the reliability of wire bonding

Advances in Electronic Materials and Packaging, v. 2001, November 2001, article number 983955, p. 39-43
Nowful, J.M.; Lok, S.C.; Lee, Shi-wei

Reliability of 96.5Sn-3.5Ag lead-free solder-bumped wafer level chip scale package (WLCSP) on build-up microvia printed circuit board

2001 HD Interntional Conference on Hig-Density Interconnect and Systems Packaging, Santa Clara, CA, United States, 17-20 April 2001; Proceedings of SPIE - The International Society for Optical Engineering, v. 4428, 2001, p. 314-322
Lau, John H.; Lee, Shi Wei Ricky

Reliability study and failure analysis of fine pitch solder bumped flip chip on low-cost printed circuit board substrate

Proceedings - Electronic Components and Technology Conference, 2001, p. 598-605
Xiao, G.; Chan, P.C.H.; Teng, A.; Lee, R.S.W.; Yuen, M.M.F.
Article 12

A damage evolution model for thermal fatigue analysis of solder joints

Journal of electronic packaging, v. 122, (3), September 2000, p. 200-206
Zhang, Xiao Wu; Lee, Shi Wei Ricky; Pao, Yihsin

Characterization of strain rate-dependent shear response of 63Sn/37Pb solder under uniaxial torsion

Key Engineering Materials, v. 177, (Part 1&2), 2000, p. 267-272
Dai, Lan Hong; Lee, Shi Wei Ricky; Huang, Xing Jia

Design and manufacturing of micro via-in-pad substrates for solder bumped flip chip applications

Journal of Electronics Manufacturing, v. 10, (1), March 2000, p. 79-87
Lau, J.; Chang, C.; Lee, R.; Chen, T.Y.; Cheng, D.; Tseng, T.J.; Lin, D.

Effects of electric fields on the bending behavior of PZT-5H piezoelectric laminates

Smart Materials and Structures, v. 9, (6), December 2000, p. 824-831
Cheng, Jinquan; Qian, Caifu; Zhao, Ming-Hao; Lee, Shi Wei Ricky; Tong, Pin; Zhang, Tongyi

Failure analysis of solder bumped flip chip on low-cost substrates

IEEE Transactions on Electronics Packaging Manufacturing, v. 23, (1), January 2000, p. 19-27
Lau, John H.; Chang, Chris C.P.; Lee, Shi Wei Ricky

Fracture mechanics analysis of low cost solder bumped flip chip assemblies with imperfect underfills

Journal of Electronic Packaging, Transactions of the ASME, v. 112, (4), 2000, Dec, p. 306-310
Lau, John H.; Lee, Shi Wei Ricky

Modeling of a rotary motor driven by an anisotropic piezoelectric composite laminate

IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency Control, v. 47, (6), November 2000, p. 1561-1574
Zhu, Mei Ling; Lee, Shi-wei; Zhang, Tongyi; Tong, Pin

Solder joint reliability of plastic ball grid array with solder bumped flip chip

Soldering & Surface Mount Technology, v. 12, (2), 2000, p. 16-23
Lee, Shi Wei Ricky; Lau, John H.

Temperature-dependent popcorning analysis of plastic ball grid array package during solder reflow with fracture mechanics method

Journal of Electronic Packaging, Transactions of the ASME, v. 122, (1), March 2000, p. 34-41
Lau, John H.; Lee, Shi Wei Ricky

一种新颖的四梁式压电薄膜微型陀螺

中國科學技術大學學報=Journal of china university of science and technology, v. 30, (4), August 2000
马薇; 李世玮; 虞吉林

引线框架用铜合金与Sn-Pb共晶焊料界面组织研究

功能材料, v. 31, (5), 2000, p. 494-495
王谦; Lee, Shi Wei Ricky; 曹育文; 唐祥云; 马莒生

电子封装中的焊点及其可靠性

電子元件與材料=Electronic Components & Materials, v. 19, (2), 2000, p. 24-26
王谦; LEE, Shi-Wei Ricky; 汪刚强; 耿志挺; 黄乐; 唐祥云; 马莒生
Conference paper 10

An analytical method of extension-twisting coupling vibration of piezoelectric composite laminates

Structural Dynamics : Recent Advances : Proceedings of the 7th International Conference / edited by N. S. Ferguson. Southampton : Institute of Sound and Vibration Research, University of Southampton, 2000, p. 121-134
Zhu, M.L.; Lee, Ricky Shi-wei; Zhang, Tongyi; Tong, Pin

Assessment on the effects of electroless nickel plating on the reliability of solder ball attachment to the bond pads of PBGA substrate

50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, p. 868-873
Lee, Shi Wei Ricky; Yan, Chien Chun; Karim, Zaheed; Huang, Xing Jia

Effects of Build-Up Printed Circuit Board Thickness on the Solder Joint Reliability of a Wafer Level Chip Scale Package (WLCSP)

International Symposium on Electronic Materials and Packaging, EMAP 2000, 2000, Article number 904141, p. 115-126
Lau, John H.; Lee, Ricky S W

Effects of electric fields on the bending behavior of piezoelectric composite laminates

Materials Research Society Symposium - Proceedings, v. 604, 2000, p. 59-64
Cheng, Jin Quan; Zhang, Tongyi; Zhao, Ming Hao; Qian, Cai Fu; Lee, Shi-wei; Tong, Pin

Experimental Characterization for the Shear Strength of Pb-Free Solder Balls on a PZT Substrate with Pd/Ag Pads

Proceedings of the Electronic Packaging Technology Conference, EPTC, v. 2000, 2000, Article number 906354, p. 86-90
Huang, Xingjia; Lee, Ricky S W; Tse, Wansze

Modeling for prototyping of rotary piezoelectric motors

Structures and Materials, v. 7, 2000, p. 21-30
Lee, Shi-Wei Ricky; Zhu, Mei-Lirig; Wong, H.L.

Reliability of Wafer Level Chip Scale Package (WLCSP) with 96.5Sn-3.5Ag Lead-Free Solder Joints on Build-Up Microvia Printed Circuit Board

International Symposium on Electronic Materials and Packaging, EMAP 2000, 2000, Article number 904133, p. 55-63
Lau, John H.; Lee, Ricky S W

Solder joint crack propagation analysis of wafer-level chip scale package on printed circuit board assemblies

50th Electronic Components and Technology Conference, Las Vegas, NV, USA, 2000, p. 1360-1368
Lau, John; Chang, Chris; Lee, Shi Wei Ricky

Study on the Interfaces Between Copper Alloys for Lead Frame and Sn-Pb Solder Alloys

International Symposium on Electronic Materials and Packaging, EMAP 2000, 2000, Article number 904185, p. 388-390
Qian, Wang; Lee, Ricky S W; Yuwen, Cao; Jusheng, Ma A.

The Mechanical Properties Degradation of Solder Joints Under Thermal Cycling


Wang, Qian; Lee, Ricky S W; Wang, Gangqiang; Chen, Guohai; Hung, Le; Ma, Jusheng
Article 4

Assembly of large PBGAs on printed circuit board with large PQFPs directly on the opposite side

Journal of Electronics Manufacturing, v. 9, (4), 1999, p. 293-298
Lau, John H.; Lee, Shi-Wei Ricky; Chao, Henry

Computational analysis for the torsional vibration control of an anti-symmetric piezoelectric composite laminate

Journal of Intelligent Material Systems and Structures, v. 10, (7), July 1999, p. 530-533
Lee, Shi Wei Ricky; Li, Hing Leung

Design and analysis of a microgyroscope with sol-gel piezoelectric plate

Smart Materials and Structures, v. 8, (2), April 1999, p. 212-217
He, Guohong; Nguyen, Christopher C.T.; Hui, JCM; Lee, Shi Wei Ricky; Luong, Howard Cam

Effect of Heat-Spreader Sizes on the Thermal Performance of Large Cavity-Down Plastic Ball Grid Array Packages

Journal of Electronic Packaging, Transactions of the ASME, v. 121, (4), December 1999, p. 242-248
Lau, John; Chen, Tony; Lee, Shi Wei Ricky
Book 1

Chip Scale Package (CSP): Design, Materials, Process, Reliability & Applications


Lau, J.H.; Lee, S.W.R.
Conference paper 4

Design and Performance of a Piezoelectric Microgyroscope

10th International Conference on Solid-State Sensors and Actuators (Transducers' 99), June 1999
Cheung, V.S.L.; Ma, W.; Luong, H.C.; Lee, R.

Effects of underfill delamination and chip size on the reliability of solder bumped flip chip on board

Proceedings of the 1999 International Symposium on Microelectronics, Chicago, IL, USA, v.3906, 26-28 October 1999, p. 592-598
Lau, John H.; Lee, Shi Wei Ricky; Ouyang, Chien

Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants

Proceedings of the 1999 49th Electronic Components and Technology Conference (ECTC), San Diego, CA, USA, 1-4 June 1999, p. 571-582
Lau, John H.; Lee, Shi Wei Ricky; Chang, Chris; Ouyang, Chien

Global Collaborative Electronic Packaging Education

49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, p. 907-911
Tong, Pin; Lam, David C C; Yuen, Matthew Ming Fai; Kim, Jang Kyo; Lee, Ricky S W; Lee, Steve Han Keung; Chan, Philip Ching Ho
Article 10

Computational modeling and analysis of a center-cracked panel repaired by bonded composite patch

Key Engineering Materials, v. 145-149, 1998, p. 601-606
Chau, RWT; Lee, Shi Wei Ricky

Critical issues in computational modeling and fatigue life analysis for PBGA solder joints

International Journal of Microcircuits and Electronic Packaging, v. 21, (3), April 1998, p. 253-261
Zhang, Xiaowu; Lee, Shi Wei Ricky

Development and characterization of a rotary motor driven by anisotropic piezoelectric composite laminate

Smart Materials and Structures, v. 7, (3), June 1998, p. 327-336
Lee, SWR; Li, HL

Effects of temperature profile on the life prediction of PBGA solder joints under thermal cycling

Key Engineering Materials, v. 145-149, (Part 1&2), 1998, p. 1133-1138
Zhang, Xiao Wu; Lee, Shi Wei Ricky

Experimental investigation of the shear strength of a unidirectional carbon/aluminum composite under dynamic torsional loading

Composites Science and Technology, v. 58, (10), October 1998, p. 1667-1673
Dai, Lan Hong; Bai, Yi Long; Lee, Shi Wei Ricky

Material response and failure mechanism of unidirectional metal matrix composites under impulsive shear loading

Key Engineering Materials, v. 141-143, (Part 1-2), 1998, p. 651-669
Dai, Lan Hong; Bai, Yi Long; Lee, Shi Wei Ricky

Sensitivity study on material properties for the fatigue life prediction of solder joints under cyclic thermal loading

Circuit World, v. 24, (3), 1998, p. 26-31
Lee, Shi-Wei Ricky; Zhang, Xiaowu

Solder joint reliability of cavity-down plastic ball grid array assemblies

Soldering & Surface Mount Technology, v. 10, (1), February 1998, p. 26-31
Lee, Shi Wei Ricky; Lau, John H.

Special Issue on Piezoelectric Motors/Actuators and Their Applications - Preface

Smart Materials and Structures, v. 7, (3), June 1998
Lee, Ricky S W

Thermal stress analysis of a PQFP moulding process: Comparison of viscoelastic and elastic models

Key Engineering Materials, v. 145-149, (Part 1&2), 1998, p. 1127-1132
Park, Joo Hyuk; Kim, Jang Kyo; Yuen, Matthew Ming Fai; Lee, Shi Wei Ricky; Tong, Penger; Chan, Philip Ching Ho
Conference paper 2

Computational modeling and parametric study of a rotary actuator driven by piezoelectric composites

Proceedings of SPIE - The International Society for Optical Engineering, v. 3323, 1998, p. 414-421
Li, Hing Leung; Lee, Shi-Wei Ricky

Thermal fatigue life prediction for solder joints with the consideration of damage evolution

2ND ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, PROCEEDINGS, 1998, p. 279-285
Zhang, Xiao Wu; Lee, Shi Wei Ricky
Article 4

Design for plastic ball grid array solder joint reliability

Circuit World, v. 23, (2), 1997, p. 11
Lee, Shi-Wei Ricky; Lau, John H.

Effect of chip dimension and substrate thickness on the solder joint reliability of plastic ball grid array packages

Circuit World, v. 23, (1), March 1997
Lee, Shi-Wei; Lau, John H.

Sensitivity study on material properties for the fatigue life prediction of solder joints under cyclic thermal loading

American Society of Mechanical Engineers, EEP, v. 19, (2), 1997, p. 1559-1561
Lee, Shi-Wei Ricky; Zhang, Xiao Wu

Warpage analysis of plastic ball grid array packages

American Society of Mechanical Engineers, EEP, v. 19, (2), 1997, p. 1789-1791
Lee, Shi-Wei Ricky
Conference paper 3

An experimental investigation on the correlation between testing cycles and delamination of plastic ball grid array packages under thermal cycling with high humidity

Proceedings of the Electronic Technology Conference, EPTC, v. 1997, October 1007, p. 82-85
Lee, Shi Wei Ricky; Yan, Chien Chun; Chow, LW; Papageorge, Marc

Design for plastic ball grid array solder joint reliability

Proceedings of the NEPCON WEST'97. Part 3 (of 3), Anaheim, CA, USA, v. 2, 1997, Feb, p. 1023-1032
Lee, Shi Wei Ricky; Lau, John H.

Solder joint reliability of plastic ball grid array with solder bumped flip chip


Lee, Shi Wei Ricky; Lau, John H.
Article 1

Impact performance of a woven fabric CFRP laminate

Polymers & polymer composites, v. 4, (8), 1996, p. 549-561
Kim, Jang Kyo; Leung, LM; Lee, Ricky Shi Wei; Hirai, Yasunobu