PhD in Aeronautical and Astronautical Engineering
Purdue University, 1992
Article
3D Co-packaging of GaN/SiC Cascode Device for High-Frequency Power Switching Operation
Conference paper
Stability Study of Quantum Dot Color Converted Mini/Micro-LED Displays
Conference paper
A Flexible Thin-Film Inductor for High-Efficiency Wireless Power Transfer
Article
Development of Uniform Polydimethylsiloxane Arrays through Inkjet Printing
Article
Large-Emitting-Area Quantum Dot Light-Emitting Diodes Fabricated by an All-Solution Process
Article
Assembly of Printed Interconnects for Immobilized Protein Microfluidic Assays
Conference paper
Assembly of Printed Interconnects for Immobilized Protein Microfluidic Assays
Conference paper
Effect of Sintering Conditions on Electrical Resistivity of Printed Silver Inks
Conference paper
Optimizing Train Car Passenger Loading via Platform Escalator Directions
Conference paper
Pillar-Cavity Copper-Copper Bonding for Face-to-Face Carbon Nanotube Synthesis
Conference paper
Quantum Dot Color Conversion Film with Enhanced Color Rendering Performance
Conference paper
Reliability and Lifetime of a Novel 222-nm KrCl Excilamp
Conference paper
Article
From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, Applications
Book
A UVC LED Disinfection Closet for Reuse of Protective Coats
Conference paper
Improved Inkjet Printing of Polydimethylsiloxane Droplets
Conference paper
Inkjet Printing High Resolution Polydimethylsiloxane Dots Array
Conference paper
Conference paper
Solderability Analysis of Inkjet-printed Silver Pads with SAC Solder Joints
Conference paper
Thermal-mechanical Reliability of Sintered Nano-Ag Bond Pads Printed by Aerosol Jet
Conference paper
Characterization And Evaluation Of 3D-printed Connectors For Microfluidics
Article
Fabrication and Reliability Assessment of Cu Pillar Microbumps with Printed Polymer Cores
Article
Article
Article
Phosphor-free microLEDs with ultrafast and broadband features for visible light communications
Article
Evaluation and Reduction of Optical Crosstalk in Quantum Dot Color-Converted Mini/Micro-LED Displays
Conference paper
Life Projection of Far-UVC KrCl Excilamp with 222nm Peak Wavelength
Conference paper
Conference paper
Solderability and Reliability of Sintered Nano-Ag Bond Pads of Printed Re-Distribution Layer (RDL)
Conference paper
Conference paper
Conference paper
Article
Article
UV LED Assisted Printing Platform for Fabrication of Micro-Scale Polymer Pillars
Article
Conference paper
Conference paper
Printing Unifrom QDs Polymer Thin Film for QLED Applications
Conference paper
Conference paper
Filler Particle-Induced Light Absorption in Underfill-Encapsulated Flip-Chip Light-Emitting Diodes
Article
Article
Coaxial Nozzle-assisted 3D Printing with in-situ UV LED Curing for Microfluidic Connectors
Conference paper
Empirical Modeling and measurement of the Pulsed Junction Temperature of VCSEL
Conference paper
Evaluation and Benchmarking of Cu Pillar Micro-bumps with Printed Polymer Core
Conference paper
Feasibility study of fan-out panel-level packaging for heterogeneous integrations
Conference paper
Feasibility study of fan-out wafer-level packaging for heterogeneous integrations
Conference paper
Inkjet Printing PEDOT:PSS without Coffee Ring Effect for QLED Applicaitons
Conference paper
Conference paper
Junction Temperature Prediction of the Multi-LED Module with the Modified Thermal Resistance Matrix
Conference paper
Long-term Stability Evaluation of Thermal Interface Materials (TIMs)
Conference paper
A Novel Approach to Characterize Phosphor Particles for the Color Tuning of WLEDs
Article
Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration
Article
Article
Design, materials, process, and fabrication of fan-out panel-level heterogeneous integration
Article
Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging
Article
Fan-Out Wafer-Level Packaging for Heterogeneous Integration
Article
Reliability of Fan-Out Wafer-Level Heterogeneous Integration
Article
Article
A Power Inductor Integration Technology Using a Silicon Interposer for DC-DC Converter Applications
Conference paper
Conference paper
Conference paper
Analysis of pulse-driven LED junction temperature and its reliability
Conference paper
Conference paper
Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration
Conference paper
Conference paper
Conference paper
Fan-out wafer-level packaging for heterogeneous integration
Conference paper
Conference paper
Conference paper
Measurement of Dynamic Junction Temperature for LED Flash Units of Camera
Conference paper
Quantum Dot Light Emitting Diodes Based on ZnO Nanoparticles
Conference paper
Reliability of Fan-out Wafer-level Packaging With Large Chips And Multiple Re-distributed Layers
Conference paper
Solderability Evaluation of Printed Silver Solder Pad for Wafer-level Packaging
Conference paper
Thermal Characterization of Multi-chip Light Emitting Diodes With Thermal Resistance Matrix
Conference paper
Thermal Simulation for High Power LED Systems with Remote Phosphor Layer
Conference paper
3D Chip Stacking with through Silicon-vias (TSVs) for Vertical Interconnect and Underfill Dispensing
Article
Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs)
Article
Article
A Novel Chip-on-Board White Light-emitting Diode Design for Light Extraction Enhancement
Conference paper
Effect of the Surface Curvature of the Phosphor Layer on the Optical Performance of a WLED
Conference paper
Conference paper
Conference paper
Conference paper
Modeling of Residual Strain in BGA-PCB Assemblies for Pad Cratering Control
Conference paper
Packaging of UV LED with a Stacked Silicon Reflector for Converged UV Emission
Conference paper
Pad Cratering Based Failure Criterion for the Life Prediction of Board Level Cyclic Bending Test
Conference paper
Conference paper
Article
Article
Characterisation of Copper Diffusion in Through Silicon Vias
Book chapter
A Method for Measuring Thermal Conductivity of Paste Materials
Conference paper
Conference paper
Characterization of Orthotropic CTE of BT Substrate for PBGA Warpage Evaluation
Conference paper
Conference paper
Effect of Substrate Dimensions and Boundary Conditions on the Heat Spreading of LED Package
Conference paper
Electroplating Fabrication and Characterization of Sn-Ag-Cu Eutectic Solder Films
Conference paper
Experimental Parametric Study on the Bumping and Coining of Gold Studs for Flip Chip Bonding
Conference paper
Fabricating Photosensitive Polymer Insulation Layer by Spin-coating for Through Silicon Vias
Conference paper
Investigation of Reliability of EMC and SMC on Reflectance for UV LED Applications
Conference paper
Low Melting Alloy Composites as Thermal Interface Materials with Low Thermal Resistance
Conference paper
Low-dielectric-constant Novel Periodic Mesoporous Organosilica Thin Film for Interlayer Dielectric
Conference paper
Conference paper
Numerical Prediction and Experimental Validation of Multiple Phosphor White LED Spectrum
Conference paper
Conference paper
Void-Free Underfill Encapsulation for Flip Chip High Voltage LED Packaging
Conference paper
Article
Lens Forming by Stack Dispensing for LED Wafer Level Packaging
Article
Article
Conference paper
Fabricating Polymer Insulation Layer by Spin-coating for Through Silicon Vias
Conference paper
Fluxless Packaging of an Implantable Medical Device for Transcorneal Electrical Stimulation
Conference paper
Influence of Rubber Nanoparticles on the Properties of Novolac-diazonaphthoquinone Based Photoresist
Conference paper
Conference paper
Conference paper
Conference paper
Simulation and Optimization on Thermal Performance of LED Filament Light Bulb
Conference paper
Thermally Conductive Adhesives Based on Silver Coated Copper Flake Fillers
Conference paper
Wafer Level Bumping Technology for High Voltage LED Packaging
Conference paper
Article
Electrical-thermal-luminous-chromatic model of phosphor-converted white light-emitting diodes
Article
Article
Article
Conference paper
Lens forming by stack dispensing for LED wafer level packaging
Conference paper
Multilayer Dispensing of Remote Phosphor for LED Wafer Level Packaging with Pre-formed Silicone Lens
Conference paper
O2 plasma treatment in polymer insulation process for through silicon vias
Conference paper
Through Silicon Underfill Dispensing for 3D Die/Interposer Stacking
Conference paper
Article
Conference paper
Conference paper
Design and Implementation of Fine Pitch COB LED Display
Conference paper
Conference paper
Conference paper
LED Wafer Level Packaging with a Heimisphrical Waffle Pack Remote Phosphor Layer
Conference paper
Conference paper
Optical Characterization of a Light Bulb with the Waffle Pack LED WLP Module
Conference paper
Quasi-conformal Phosphor Dispensing on LED for White Light Illumination
Conference paper
Remote Phosphor Deposition on LED Arrays with Pre-encapsulated Silicone Lens
Conference paper
Conference paper
Wetting Behavior of Polymer Liquid in Insulation Process for through Silicon via
Conference paper
Article
Emerging trend for LED wafer level packaging
Article
Moldless encapsulation for LED wafer level packaging using integrated DRIE trenches
Article
Reliability of high-power LED packaging and assembly
Article
Article
Book chapter
Assessment of Non-uniform Temperature Effect on BGA De-component Process
Conference paper
Conference paper
Conference paper
Determination of Driving Current of RGB LEDs for White Light Illumination
Conference paper
Development of innovative cold pin pull test method for solder pad crater evaluation
Conference paper
Different Morphologies of Nano-ZnO Affection on Properties of Transparent Epoxy Resin Encapsulants
Conference paper
Effect of Die Attach Adhesive Defects on the Junction Temperature Uniformity of LED Chips
Conference paper
Effects of GaN Blue LED Chip and Phosphor on Optical Performance of White Light LED
Conference paper
Fast Copper Plating Process for Through Silicon Via (TSV) Filling
Conference paper
Investigation of fracture behaviors of Cu-Sn intermetallics using impact test
Conference paper
Investigation on Mechanical Properties and Bonding Parameters of Copper Wire Bonding
Conference paper
LED wafer level packaging with a remote phosphor cap
Conference paper
Reverse wire bonding and phosphor printing for LED wafer level packaging
Conference paper
TSV Plating Using Copper Methanesulfonate Electrolyte with Single Component Suppressor
Conference paper
Ultrasonic Inspection of Package Internal Defects Considering Multiple Interface Effects
Conference paper
Underfill dispensing for 3D die stacking with through silicon vias
Conference paper
Article
Investigation on Copper Diffusion Depth in Copper Wire Bonding
Article
Spacing optimization of high power LED arrays for solid state lighting
Article
Shock test methods and test standards for portable electronic devices
Book chapter
Technologies and Materials for Green IC Packaging
Book chapter
Conference paper
Advanced LED wafer level packaging technologies
Conference paper
Conference paper
Conference paper
Considerations in solution stabilization for thermal fatigue modeling of lead-free solder joints
Conference paper
Conference paper
Conference paper
Evaluation of polymer wafer bonding with silicone adhesive and patterned trenches
Conference paper
Investigation on lead-free solder joint reliability of edge-bonded CBGA under temperature cycling
Conference paper
Conference paper
Conference paper
Nondestructive inspection of through silicon via depth using scanning acoustic microscopy
Conference paper
Conference paper
3D IC Integration with TSV Interposers for High Performance Applications
Article
3D LED and IC wafer level packaging
Article
Book chapter
Hygrothermal Delamination Analysis of Quad Flat No-Lead (QFN) Packages
Book chapter
Nano-scale and Atomistic-scale Modeling of Advanced Materials
Book chapter
Conference paper
Conference paper
Comparative study of PWB pad cratering subject to reflow soldering and thermal impact
Conference paper
Conference paper
Conference paper
Conference paper
Conference paper
Conference paper
Conference paper
Conference paper
Conference paper
Silicon Interposer with Cavities and Copper-filled TSVs for 3D Packaging
Conference paper
Solid State Backlight Unit with Lateral-Emitting LEDs and a Light Distributing Plate
Conference paper
Solid state light tube with periodic units of lateral-emitting LEDs
Conference paper
Conference paper
Critical Review of the Engelmaier Model for Solder Joint Creep Fatigue Reliability
Article
Experimental investigations and model study of moisture behaviors in polymeric materials
Article
Micro thermoelectric cooler: Planar multistage
Article
Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages
Article
Conference paper
Conference paper
Conference paper
Conference paper
Conference paper
Conference paper
Conference paper
Investigation of Mixed SAC and SnPb Solder Balls under High Speed Ball Shear and Pull Tests
Conference paper
Conference paper
Conference paper
Conference paper
Stress analysis of hygrothermal delamination of Quad Flat No-lead (QFN) packages
Conference paper
Surface analysis of outgassing contamination from edgebond epoxy adhesives on imag pads
Conference paper
Article
Drop/impact tests and analysis of typical portable electronic devices
Article
Eddy current induced heating for the solder reflow of area array packages
Article
Article
Reliability Study of Surface Mount Printed Circuit Board Assemblies with Lead-free Solder Joints
Article
A comprehensive parallel study on the board level reliability of SAC, SACX and SCN solders
Conference paper
Conference paper
Design and fabrication of MEMS based microphone module by using 3D chip-on-chip package
Conference paper
Conference paper
Development of novel dicing process by anisotropic wet etching with convex corner compensation
Conference paper
Fabrication of Nanoscale Vias by Offset Patterning
Conference paper
Investigation of Moisture Sensitivity Related Failure Mechanism of Quad Flat No-lead (QFN) Packages
Conference paper
Conference paper
Wafer level encapsulation process for LED array packaging
Conference paper
Wafer Level LED Packaging with Integrated DRIE Trenches for Encapsulation
Conference paper
Electro-elastic analysis of piezoelectric laminated plates
Article
Passive Alignment of Optical Fibers in V-grooves with Low Viscosity Epoxy Flow
Book chapter
Conference paper
Characteristics of copper-to-silicon diffusion in copper wire bonding
Conference paper
Characterization and comparison of five SAC-based solder pastes for pb-free reflow soldering
Conference paper
Conference paper
Conference paper
Design and fabrication of MEMS based microphone module by using 3D chip-on-chip package
Conference paper
Conference paper
Conference paper
Drop impact of a typical portable electronic device - experiments and modeling
Conference paper
Effect of thermal aging on high speed ball shear and pull tests of SnAgCu lead-free solder balls
Conference paper
Effect of V-groove side wall feature on epoxy flow in passive alignment of optical fiber
Conference paper
Conference paper
Conference paper
Effects of tooling tip wear and fixture rigidity on solder ball shear and ball pull tests
Conference paper
Conference paper
Conference paper
Conference paper
Reliability assessment on the re-balling of PBGA from SnPb to Pb-free solder spheres
Conference paper
Conference paper
Wetting characteristics of solder reflow on copper traces without solder mask
Conference paper
Article
Article
Characterization of intermetallic compound formation and copper diffusion of copper wire bonding
Conference paper
Conference paper
Conference paper
Design of shock table tests to mimic real-life drop conditions for portable electronic device
Conference paper
Conference paper
Development and prototyping of a HB-LED array module for indoor solid state lighting
Conference paper
Development and prototyping of a HB-LED array module for indoor solid state lighting
Conference paper
Drop impact of a typical portable electronic device
Conference paper
Drop impact of typical portable electronic product device
Conference paper
Effect of high temperature storage on reliability of Sn-Ag-Cu flip chip solder bumps
Conference paper
Effect of Microstructure on Thermal and Mechanical Properties of PBGA Substrates
Conference paper
Effect of solder mask thickness on shear and pull tests of lead-free solder balls
Conference paper
Conference paper
Effects of microstructure on thermal and mechanical properties of PBGA substrates
Conference paper
Conference paper
Conference paper
Fracture analysis on popcorning of plastic packages during solder reflow
Conference paper
Conference paper
Conference paper
Conference paper
Isothermal fatigue tests of plastic ball grid array (PBGA) SnAgCu lead-free solder joints at 60°C
Conference paper
Conference paper
Conference paper
Thermal resistance analysis of a multi-stack flip chip 3-d package
Conference paper
Article
Foreword: Three-dimensional packaging
Article
Book
Conference paper
Conference paper
Assessment of long-term reliability in lead-free assemblies
Conference paper
Conference paper
Conference paper
Effects of testing conditions and multiple reflows on cold bump pull test of Pb-free solder balls
Conference paper
Evaluation of bondability and reliability of single crystal copper wire bonding
Conference paper
Conference paper
Conference paper
Fabrication of Sub-micron Silicon Vias by Deep Reactive Ion Etching
Conference paper
Multi-stack flip chip 3D packaging with copper plated through-silicon vertical interconnection
Conference paper
Optimization of epoxy flow for passive alignment of optical fiber arrays
Conference paper
Conference paper
Article
Electronic Manufacturing Service Industries in China
Book chapter
A new method for the solder ball pull test using a shape memory alloy tube
Conference paper
Conference paper
Chip-on-chip 3D optical interconnect with passive alignment
Conference paper
Conference paper
Conference paper
Effects of underfill adhesion on flip chip package reliability
Conference paper
Conference paper
Conference paper
Formation and Plugging of Through-Silicon-Vias for 3D Packaging
Conference paper
Formation of through-silicon-vias by laser drilling and deep reactive ion etching
Conference paper
Conference paper
Modified passive alignment of optical fibers with low viscosity epoxy flow running in V-grooves
Conference paper
Thermal fatigue-life prediction of lead-free solder joints
Conference paper
Conference paper
Electronics Manufacturing with Lead-free, Halogen-free, and Conductive Adhesive Materials
Book
Book
Conference paper
Conference paper
Conference paper
Conference paper
Conference paper
Optimization of stencil printing wafer bumping for fine pitch flip chip applications
Conference paper
Passive alignment of optical fiber in a V-groove with low viscosity epoxy flow
Conference paper
The impact of the AC current crowding effect on BJT RF noise modeling
Conference paper
Three-dimensional packaging for multi-chip module with through-the-silicon via hole
Conference paper
Analysis on solder ball shear testing conditions with a simple computational model
Article
Assessment of board level solder joint reliability for PBGA assemblies with lead-free solders
Article
Article
Article
Micro-machined Conformal silicon Molds for wafer bumping and probing
Article
Article
Article
Article
Effects of room temperature storage time on the shear strength of PBGA solder balls
Conference paper
Effects of Room Temperature Storage Time on the Shear Strength of PBGA Solder Balls
Conference paper
Evaluation of board level reliability of Pb-free PBGA solder joints
Conference paper
Experimental Evaluation on Solder Joint Reliability of PBGA Assembly under Mechanical Drop Test
Conference paper
Conference paper
Conference paper
Conference paper
Stress Relaxation in Plastic Molding Compounds
Conference paper
Conference paper
Article
Article
Reliability of Eutectic Sn-Pb Solder Bumps and Flip Chip Assemblies
Article
Article
Article
Microvias for Low-Cost High-Density Interconnects
Book
Bending analysis of piezoelectric laminates
Conference paper
Characterization and analysis on the solder ball sheer testing conditions
Conference paper
Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Alloy
Conference paper
Conference paper
Conference paper
Dynamic structural coupling behaviours of an anti-symmetric piezoelectric laminate
Conference paper
Effects of plasma cleaning on the reliability of wire bonding
Conference paper
Conference paper
Conference paper
A damage evolution model for thermal fatigue analysis of solder joints
Article
Characterization of strain rate-dependent shear response of 63Sn/37Pb solder under uniaxial torsion
Article
Design and manufacturing of micro via-in-pad substrates for solder bumped flip chip applications
Article
Effects of electric fields on the bending behavior of PZT-5H piezoelectric laminates
Article
Failure analysis of solder bumped flip chip on low-cost substrates
Article
Fracture mechanics analysis of low cost solder bumped flip chip assemblies with imperfect underfills
Article
Modeling of a rotary motor driven by an anisotropic piezoelectric composite laminate
Article
Solder joint reliability of plastic ball grid array with solder bumped flip chip
Article
Article
Article
Article
Article
An analytical method of extension-twisting coupling vibration of piezoelectric composite laminates
Conference paper
Conference paper
Conference paper
Effects of electric fields on the bending behavior of piezoelectric composite laminates
Conference paper
Conference paper
Modeling for prototyping of rotary piezoelectric motors
Conference paper
Conference paper
Conference paper
Study on the Interfaces Between Copper Alloys for Lead Frame and Sn-Pb Solder Alloys
Conference paper
The Mechanical Properties Degradation of Solder Joints Under Thermal Cycling
Conference paper
Assembly of large PBGAs on printed circuit board with large PQFPs directly on the opposite side
Article
Article
Design and analysis of a microgyroscope with sol-gel piezoelectric plate
Article
Article
Chip Scale Package (CSP): Design, Materials, Process, Reliability & Applications
Book
Design and Performance of a Piezoelectric Microgyroscope
Conference paper
Conference paper
Conference paper
Global Collaborative Electronic Packaging Education
Conference paper
Computational modeling and analysis of a center-cracked panel repaired by bonded composite patch
Article
Critical issues in computational modeling and fatigue life analysis for PBGA solder joints
Article
Article
Effects of temperature profile on the life prediction of PBGA solder joints under thermal cycling
Article
Article
Article
Article
Solder joint reliability of cavity-down plastic ball grid array assemblies
Article
Special Issue on Piezoelectric Motors/Actuators and Their Applications - Preface
Article
Thermal stress analysis of a PQFP moulding process: Comparison of viscoelastic and elastic models
Article
Computational modeling and parametric study of a rotary actuator driven by piezoelectric composites
Conference paper
Thermal fatigue life prediction for solder joints with the consideration of damage evolution
Conference paper
Design for plastic ball grid array solder joint reliability
Article
Article
Article
Warpage analysis of plastic ball grid array packages
Article
Conference paper
Design for plastic ball grid array solder joint reliability
Conference paper
Solder joint reliability of plastic ball grid array with solder bumped flip chip
Conference paper
Impact performance of a woven fabric CFRP laminate
Article
Anisotropic piezoelectric laminates for rotary actuators
Conference paper
Design of linear and rotary actuators using piezoelectric composite laminates
Conference paper
Impact response of woven fabrics and cross-plies carbon fibre composites
Conference paper
Mechanical property study of composite grid reinforced concrete
Conference paper
On the Apparent Bending Isotropy in Clamped Elliptic Composite Laminates
Article
Actuation of Torsional Motion for Piezoelectric Laminated Beams
Conference paper
Bending/Twisting/Shearing Actuation and Sensing of Laminated Composite Beams with Piezopolymer Film
Conference paper
Evaluation of Residual Strength for Cracked Pressure Vessel Repaired by Composite Patch
Conference paper
On the Sensing and Actuation of Clamped Elliptic Piezoelectric Laminates
Conference paper
The Use of Clamped Circular Piezoelectric Laminates as Pressure Sensors
Conference paper
A Quasi-Static Penetration Model for Composite Laminates
Article
Dynamic Penetration of Graphite/Epoxy Laminates Impacted by a Blunt-Ended Projectile
Article
Bending Characteristics of Clamped Elliptic Symmetric Composite Laminates
Conference paper
Ballistic Limit Prediction of Composite Laminates by a Quasi-Static Penetration Model
Conference paper
Modeling Penetration Process of Composite Laminates Subjected to a Blunt-Ended Punch
Conference paper
Damage in Composite Laminates: Effects of Transverse Cracks
Article
Three-Dimensional Analysis of Laminates with Cross Cracks
Article
2-D and 3-D Damage Effects in Cross-Ply Laminates
Conference paper
A Flexible Thin-Film Inductor for High-Efficiency Wireless Power Transfer
Development of Uniform Polydimethylsiloxane Arrays through Inkjet Printing
Large-Emitting-Area Quantum Dot Light-Emitting Diodes Fabricated by an All-Solution Process
Assembly of Printed Interconnects for Immobilized Protein Microfluidic Assays
Assembly of Printed Interconnects for Immobilized Protein Microfluidic Assays
Effect of Sintering Conditions on Electrical Resistivity of Printed Silver Inks
Optimizing Train Car Passenger Loading via Platform Escalator Directions
Pillar-Cavity Copper-Copper Bonding for Face-to-Face Carbon Nanotube Synthesis
Quantum Dot Color Conversion Film with Enhanced Color Rendering Performance
From LED to Solid State Lighting: Principles, Materials, Packaging, Characterization, Applications
Characterization And Evaluation Of 3D-printed Connectors For Microfluidics
Fabrication and Reliability Assessment of Cu Pillar Microbumps with Printed Polymer Cores
Phosphor-free microLEDs with ultrafast and broadband features for visible light communications
Filler Particle-Induced Light Absorption in Underfill-Encapsulated Flip-Chip Light-Emitting Diodes
Coaxial Nozzle-assisted 3D Printing with in-situ UV LED Curing for Microfluidic Connectors
Empirical Modeling and measurement of the Pulsed Junction Temperature of VCSEL
Evaluation and Benchmarking of Cu Pillar Micro-bumps with Printed Polymer Core
Feasibility study of fan-out panel-level packaging for heterogeneous integrations
Feasibility study of fan-out wafer-level packaging for heterogeneous integrations
Inkjet Printing PEDOT:PSS without Coffee Ring Effect for QLED Applicaitons
Junction Temperature Prediction of the Multi-LED Module with the Modified Thermal Resistance Matrix
Long-term Stability Evaluation of Thermal Interface Materials (TIMs)
A Novel Approach to Characterize Phosphor Particles for the Color Tuning of WLEDs
Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration
Design, materials, process, and fabrication of fan-out panel-level heterogeneous integration
Design, Materials, Process, Fabrication, and Reliability of Fan-Out Wafer-Level Packaging
Reliability of Fan-Out Wafer-Level Heterogeneous Integration
A Power Inductor Integration Technology Using a Silicon Interposer for DC-DC Converter Applications
Analysis of pulse-driven LED junction temperature and its reliability
Chip-First Fan-Out Panel-Level Packaging for Heterogeneous Integration
Measurement of Dynamic Junction Temperature for LED Flash Units of Camera
Quantum Dot Light Emitting Diodes Based on ZnO Nanoparticles
Reliability of Fan-out Wafer-level Packaging With Large Chips And Multiple Re-distributed Layers
Solderability Evaluation of Printed Silver Solder Pad for Wafer-level Packaging
Thermal Characterization of Multi-chip Light Emitting Diodes With Thermal Resistance Matrix
Thermal Simulation for High Power LED Systems with Remote Phosphor Layer
3D Chip Stacking with through Silicon-vias (TSVs) for Vertical Interconnect and Underfill Dispensing
Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs)
A Novel Chip-on-Board White Light-emitting Diode Design for Light Extraction Enhancement
Effect of the Surface Curvature of the Phosphor Layer on the Optical Performance of a WLED
Modeling of Residual Strain in BGA-PCB Assemblies for Pad Cratering Control
Packaging of UV LED with a Stacked Silicon Reflector for Converged UV Emission
Pad Cratering Based Failure Criterion for the Life Prediction of Board Level Cyclic Bending Test
Characterisation of Copper Diffusion in Through Silicon Vias
A Method for Measuring Thermal Conductivity of Paste Materials
Characterization of Orthotropic CTE of BT Substrate for PBGA Warpage Evaluation
Effect of Substrate Dimensions and Boundary Conditions on the Heat Spreading of LED Package
Electroplating Fabrication and Characterization of Sn-Ag-Cu Eutectic Solder Films
Experimental Parametric Study on the Bumping and Coining of Gold Studs for Flip Chip Bonding
Fabricating Photosensitive Polymer Insulation Layer by Spin-coating for Through Silicon Vias
Investigation of Reliability of EMC and SMC on Reflectance for UV LED Applications
Low Melting Alloy Composites as Thermal Interface Materials with Low Thermal Resistance
Low-dielectric-constant Novel Periodic Mesoporous Organosilica Thin Film for Interlayer Dielectric
Numerical Prediction and Experimental Validation of Multiple Phosphor White LED Spectrum
Void-Free Underfill Encapsulation for Flip Chip High Voltage LED Packaging
Fabricating Polymer Insulation Layer by Spin-coating for Through Silicon Vias
Fluxless Packaging of an Implantable Medical Device for Transcorneal Electrical Stimulation
Influence of Rubber Nanoparticles on the Properties of Novolac-diazonaphthoquinone Based Photoresist
Simulation and Optimization on Thermal Performance of LED Filament Light Bulb
Thermally Conductive Adhesives Based on Silver Coated Copper Flake Fillers
Wafer Level Bumping Technology for High Voltage LED Packaging
Electrical-thermal-luminous-chromatic model of phosphor-converted white light-emitting diodes
Lens forming by stack dispensing for LED wafer level packaging
Multilayer Dispensing of Remote Phosphor for LED Wafer Level Packaging with Pre-formed Silicone Lens
O2 plasma treatment in polymer insulation process for through silicon vias
Through Silicon Underfill Dispensing for 3D Die/Interposer Stacking
LED Wafer Level Packaging with a Heimisphrical Waffle Pack Remote Phosphor Layer
Optical Characterization of a Light Bulb with the Waffle Pack LED WLP Module
Quasi-conformal Phosphor Dispensing on LED for White Light Illumination
Remote Phosphor Deposition on LED Arrays with Pre-encapsulated Silicone Lens
Wetting Behavior of Polymer Liquid in Insulation Process for through Silicon via
Assessment of Non-uniform Temperature Effect on BGA De-component Process
Determination of Driving Current of RGB LEDs for White Light Illumination
Development of innovative cold pin pull test method for solder pad crater evaluation
Different Morphologies of Nano-ZnO Affection on Properties of Transparent Epoxy Resin Encapsulants
Effect of Die Attach Adhesive Defects on the Junction Temperature Uniformity of LED Chips
Effects of GaN Blue LED Chip and Phosphor on Optical Performance of White Light LED
Fast Copper Plating Process for Through Silicon Via (TSV) Filling
Investigation of fracture behaviors of Cu-Sn intermetallics using impact test
Investigation on Mechanical Properties and Bonding Parameters of Copper Wire Bonding
Reverse wire bonding and phosphor printing for LED wafer level packaging
TSV Plating Using Copper Methanesulfonate Electrolyte with Single Component Suppressor
Ultrasonic Inspection of Package Internal Defects Considering Multiple Interface Effects
Underfill dispensing for 3D die stacking with through silicon vias
Investigation on Copper Diffusion Depth in Copper Wire Bonding
Spacing optimization of high power LED arrays for solid state lighting
Considerations in solution stabilization for thermal fatigue modeling of lead-free solder joints
Evaluation of polymer wafer bonding with silicone adhesive and patterned trenches
Investigation on lead-free solder joint reliability of edge-bonded CBGA under temperature cycling
Nondestructive inspection of through silicon via depth using scanning acoustic microscopy
Hygrothermal Delamination Analysis of Quad Flat No-Lead (QFN) Packages
Nano-scale and Atomistic-scale Modeling of Advanced Materials
Comparative study of PWB pad cratering subject to reflow soldering and thermal impact
Silicon Interposer with Cavities and Copper-filled TSVs for 3D Packaging
Solid State Backlight Unit with Lateral-Emitting LEDs and a Light Distributing Plate
Solid state light tube with periodic units of lateral-emitting LEDs
Critical Review of the Engelmaier Model for Solder Joint Creep Fatigue Reliability
Experimental investigations and model study of moisture behaviors in polymeric materials
Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages
Drop/impact tests and analysis of typical portable electronic devices
Eddy current induced heating for the solder reflow of area array packages
Reliability Study of Surface Mount Printed Circuit Board Assemblies with Lead-free Solder Joints
A comprehensive parallel study on the board level reliability of SAC, SACX and SCN solders
Design and fabrication of MEMS based microphone module by using 3D chip-on-chip package
Development of novel dicing process by anisotropic wet etching with convex corner compensation
Investigation of Moisture Sensitivity Related Failure Mechanism of Quad Flat No-lead (QFN) Packages
Wafer Level LED Packaging with Integrated DRIE Trenches for Encapsulation
Characteristics of copper-to-silicon diffusion in copper wire bonding
Characterization and comparison of five SAC-based solder pastes for pb-free reflow soldering
Design and fabrication of MEMS based microphone module by using 3D chip-on-chip package
Drop impact of a typical portable electronic device - experiments and modeling
Effect of thermal aging on high speed ball shear and pull tests of SnAgCu lead-free solder balls
Effect of V-groove side wall feature on epoxy flow in passive alignment of optical fiber
Effects of tooling tip wear and fixture rigidity on solder ball shear and ball pull tests
Reliability assessment on the re-balling of PBGA from SnPb to Pb-free solder spheres
Wetting characteristics of solder reflow on copper traces without solder mask
Characterization of intermetallic compound formation and copper diffusion of copper wire bonding
Design of shock table tests to mimic real-life drop conditions for portable electronic device
Development and prototyping of a HB-LED array module for indoor solid state lighting
Development and prototyping of a HB-LED array module for indoor solid state lighting
Effect of high temperature storage on reliability of Sn-Ag-Cu flip chip solder bumps
Effect of Microstructure on Thermal and Mechanical Properties of PBGA Substrates
Effect of solder mask thickness on shear and pull tests of lead-free solder balls
Effects of microstructure on thermal and mechanical properties of PBGA substrates
Fracture analysis on popcorning of plastic packages during solder reflow
Isothermal fatigue tests of plastic ball grid array (PBGA) SnAgCu lead-free solder joints at 60°C
Thermal resistance analysis of a multi-stack flip chip 3-d package
Effects of testing conditions and multiple reflows on cold bump pull test of Pb-free solder balls
Evaluation of bondability and reliability of single crystal copper wire bonding
Fabrication of Sub-micron Silicon Vias by Deep Reactive Ion Etching
Multi-stack flip chip 3D packaging with copper plated through-silicon vertical interconnection
Optimization of epoxy flow for passive alignment of optical fiber arrays
A new method for the solder ball pull test using a shape memory alloy tube
Effects of underfill adhesion on flip chip package reliability
Formation and Plugging of Through-Silicon-Vias for 3D Packaging
Formation of through-silicon-vias by laser drilling and deep reactive ion etching
Modified passive alignment of optical fibers with low viscosity epoxy flow running in V-grooves
Optimization of stencil printing wafer bumping for fine pitch flip chip applications
Passive alignment of optical fiber in a V-groove with low viscosity epoxy flow
The impact of the AC current crowding effect on BJT RF noise modeling
Three-dimensional packaging for multi-chip module with through-the-silicon via hole
Analysis on solder ball shear testing conditions with a simple computational model
Assessment of board level solder joint reliability for PBGA assemblies with lead-free solders
Micro-machined Conformal silicon Molds for wafer bumping and probing
Effects of room temperature storage time on the shear strength of PBGA solder balls
Effects of Room Temperature Storage Time on the Shear Strength of PBGA Solder Balls
Evaluation of board level reliability of Pb-free PBGA solder joints
Experimental Evaluation on Solder Joint Reliability of PBGA Assembly under Mechanical Drop Test
Characterization and analysis on the solder ball sheer testing conditions
Characterization of Strain Rate-Dependent Behavior of 63Sn-37Pb Solder Alloy
Dynamic structural coupling behaviours of an anti-symmetric piezoelectric laminate
Effects of plasma cleaning on the reliability of wire bonding
A damage evolution model for thermal fatigue analysis of solder joints
Characterization of strain rate-dependent shear response of 63Sn/37Pb solder under uniaxial torsion
Design and manufacturing of micro via-in-pad substrates for solder bumped flip chip applications
Effects of electric fields on the bending behavior of PZT-5H piezoelectric laminates
Failure analysis of solder bumped flip chip on low-cost substrates
Fracture mechanics analysis of low cost solder bumped flip chip assemblies with imperfect underfills
Modeling of a rotary motor driven by an anisotropic piezoelectric composite laminate
Solder joint reliability of plastic ball grid array with solder bumped flip chip
An analytical method of extension-twisting coupling vibration of piezoelectric composite laminates
Effects of electric fields on the bending behavior of piezoelectric composite laminates
Study on the Interfaces Between Copper Alloys for Lead Frame and Sn-Pb Solder Alloys
The Mechanical Properties Degradation of Solder Joints Under Thermal Cycling